Patents by Inventor Katsuhiko Tsuchikura

Katsuhiko Tsuchikura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4375271
    Abstract: A soldering method comprises forming bubbles by blowing gas into a pool of molten solder, and striking the bubbles against a printed circuit board with electric and or electronic components temporarily fixed thereto to solder them to each other.
    Type: Grant
    Filed: July 28, 1981
    Date of Patent: March 1, 1983
    Assignee: Aiwa Co., Ltd.
    Inventor: Katsuhiko Tsuchikura