Abstract: A storage control apparatus can be connected to a higher level apparatus and a plurality of storage devices, and receives, from the higher level apparatus, a request to write into one of the plurality of storage devices. Here, if a storage device, among the plurality of storage devices, that has been specified as the access destination for the write request is not yet active, the storage control apparatus suspends the data involved in the write request, and writes the suspended data involved in the write request into the storage device once the storage device specified as the access destination is in a ready state.

Abstract: A printing apparatus receives power from a commercial power supply, a power control unit can control the power supplied when the printing apparatus is powered from the commercial power supply, a storage unit can continuously store information even when power from the commercial power supply to the printing apparatus is interrupted, and based on a user operation received during such an interruption the information stored in the storage unit is switched between information indicating that an instruction to supply power is valid and information indicating that an instruction to stop power supply is valid.

Abstract: This information processing apparatus can operate first wireless communication in parallel with second wireless communication whose communication standard is different from that of the first wireless communication by sequentially operating the first wireless communication and the second wireless communication. In addition, this information processing apparatus determines whether or not a parallel operation in which the second wireless communication is operated in parallel with and in addition to the first wireless communication is to be performed, and decides the transmission interval of the first wireless communication based on the determination result.

Abstract: A storage control apparatus can be connected to a higher level apparatus and a plurality of storage devices, and receives, from the higher level apparatus, a request to write into one of the plurality of storage devices. Here, if a storage device, among the plurality of storage devices, that has been specified as the access destination for the write request is not yet active, the storage control apparatus suspends the data involved in the write request, and writes the suspended data involved in the write request into the storage device once the storage device specified as the access destination is in a ready state.

Abstract: An information processing apparatus includes a first power supply unit, a first device and a second device to which power is supplied from the first power supply unit, a second power supply unit, a third device to which power is supplied from each of the first power supply unit and the second power supply unit, and a power control unit configured to perform control to switch a power supply source for the third device from the first power supply unit to the second power supply unit, and then to cause power to be supplied from the first power supply unit to the second device.

Abstract: This information processing apparatus can operate first wireless communication in parallel with second wireless communication whose communication standard is different from that of the first wireless communication by sequentially operating the first wireless communication and the second wireless communication. In addition, this information processing apparatus determines whether or not a parallel operation in which the second wireless communication is operated in parallel with and in addition to the first wireless communication is to be performed, and decides the transmission interval of the first wireless communication based on the determination result.

Abstract: A semiconductor device has a single unit capable of improving adhesion to a cooling body and a heat dissipation performance, and an aggregate of the single units is capable of configuring any circuit at a low cost. A single unit includes copper blocks, an insulating substrate with a conductive pattern, an IGBT chip, a diode chip, a collector terminal pin, implant pins fixed to the chips by solder, a printed circuit board having the implant pins fixed thereto, an emitter terminal pin, a control terminal pin, a collector terminal pin, and a resin case having the above-mentioned components sealed therein. The copper blocks make it possible to improve adhesion to a cooling body and the heat dissipation performance. A plurality of single units can be combined with an inter-unit wiring board to form any circuit.

Abstract: An image forming apparatus includes a control unit configured to control writing or reading data to or from a storage unit and a cooling unit configured to cool the control unit and the storage unit, in which the control unit reads temperature information from the storage unit, and changes a timing of when to read the temperature information next from the storage unit and a cooling level of the cooling unit in conjunction with each other.

Abstract: A power transmission device that wirelessly supplies power with a power receiving device includes a power transmission unit configured to wirelessly transmit power to a power receiving device, a receiving unit configured to receive a receiving power amount from the power receiving device, an evaluation unit configured to compare a reference value of the power receiving device and the receiving power amount and evaluate a transmission efficiency of power to the power receiving device based on a comparison result, and a transmission unit configured to transmit an evaluation result by the evaluation unit to the power receiving device.

Abstract: In a wireless power supply system, a power transmitting apparatus wirelessly supplies power to an assigned power receiving apparatus. The wireless power supply system includes an assigning unit that assigns the power receiving apparatus to the power transmitting apparatus, and a determining unit that, when the assigning unit assigns a particular power receiving apparatus to a plurality of power transmitting apparatuses, determines a power supply schedule such that the plurality of power transmitting apparatuses supply the power to the particular power receiving apparatus, not simultaneously.

Abstract: An information processing apparatus includes a first power supply unit, a first device and a second device to which power is supplied from the first power supply unit, a second power supply unit, a third device to which power is supplied from each of the first power supply unit and the second power supply unit, and a power control unit configured to perform control to switch a power supply source for the third device from the first power supply unit to the second power supply unit, and then to cause power to be supplied from the first power supply unit to the second device.

Abstract: A semiconductor device includes a molded body obtained by sealing, with a sealing material, a member including a semiconductor element, an insulating substrate which is bonded to one surface of the semiconductor element, and a printed circuit board which is used for a connection to an external circuit and is bonded to another surface of the semiconductor element. The sealing material includes a first sealing material which is a nanocomposite resin including an epoxy base resin, a curing agent, and an inorganic filler with an average particle size of 1 nm to 100 nm; and a second sealing material which is a thermosetting resin, a thermoplastic resin, or a mixture thereof without an inorganic filler. The sealing material is less likely to be degraded by thermal oxidation, even when the semiconductor element operates at a high temperature of 175° C. or higher, is crack resistant, and has high reliability and durability.

Abstract: A power semiconductor module has an insulating layer; a copper base substrate having first and second copper blocks, either the first or the second copper block being fixed on one side and the other being fixed on the other side of the insulating layer; a plurality of power semiconductor elements using silicon carbide, and having one side fixed onto the first copper block with a conductive bond layer; a plurality of implant pins fixed to the other side of each of the plurality of power semiconductor elements with a conductive bond layer; a printed circuit board fixed to the implant pins and disposed to face the power semiconductor elements; a first sealing material containing no flame retardant, and disposed at least between the power semiconductor elements and the printed circuit board; and a second sealing material containing a flame retardant, and disposed to cover the first sealing material.

Abstract: An information processing apparatus that is capable of reducing power consumption. A power supply unit supplies electric power to devices including first and second devices of the apparatus. A power-state-switching unit switches a power state of the apparatus among a first power state in which the power supply unit supplies power to the devices, a second power state in which the power supply unit does not supply power to the first device without supplying power from a secondary battery to the devices, and a third power state in which the secondary battery supplies power to the second device. A control unit controls so that the secondary battery is charged by the power supplied from the power supply unit in the first power state, and to control so that the secondary battery is not charged by the power supplied from the power supply unit in the second and third power states.

Abstract: A semiconductor device includes a molded body obtained by sealing, with a sealing material, a member including a semiconductor element, an insulating substrate which is bonded to one surface of the semiconductor element, and a printed circuit board which is used for a connection to an external circuit and is bonded to another surface of the semiconductor element. The sealing material includes a first sealing material which is a nanocomposite resin including an epoxy base resin, a curing agent, and an inorganic filler with an average particle size of 1 nm to 100 nm; and a second sealing material which is a thermosetting resin, a thermoplastic resin, or a mixture thereof without an inorganic filler. The sealing material is less likely to be degraded by thermal oxidation, even when the semiconductor element operates at a high temperature of 175° C. or higher, is crack resistant, and has high reliability and durability.

Abstract: An image forming apparatus includes a control unit configured to control writing or reading data to or from a storage unit and a cooling unit configured to cool the control unit and the storage unit, in which the control unit reads temperature information from the storage unit, and changes a timing of when to read the temperature information next from the storage unit and a cooling level of the cooling unit in conjunction with each other.

Abstract: In a wireless power supply system, a power transmitting apparatus wirelessly supplies power to an assigned power receiving apparatus. The wireless power supply system includes an assigning unit that assigns the power receiving apparatus to the power transmitting apparatus, and a determining unit that, when the assigning unit assigns a particular power receiving apparatus to a plurality of power transmitting apparatuses, determines a power supply schedule such that the plurality of power transmitting apparatuses supply the power to the particular power receiving apparatus, not simultaneously.

Abstract: A semiconductor device has a single unit capable of improving adhesion to a cooling body and a heat dissipation performance, and an aggregate of the single units is capable of configuring any circuit at a low cost. A single unit includes copper blocks, an insulating substrate with a conductive pattern, an IGBT chip, a diode chip, a collector terminal pin, implant pins fixed to the chips by solder, a printed circuit board having the implant pins fixed thereto, an emitter terminal pin, a control terminal pin, a collector terminal pin, and a resin case having the above-mentioned components sealed therein. The copper blocks make it possible to improve adhesion to a cooling body and the heat dissipation performance. A plurality of single units can be combined with an inter-unit wiring board to form any circuit.

Abstract: A semiconductor device has a single unit capable of improving adhesion to a cooling body and a heat dissipation performance, and an aggregate of the single units is capable of configuring any circuit at a low cost. A single unit (101) includes copper blocks (1, 8), an insulating substrate (6) with a conductive pattern, an IGBT chip (10), a diode chip (13), a collector terminal pin (15), implant pins (17) fixed to the chips (10) by solder (11), a printed circuit board (16) having the implant pins (17) fixed thereto, an emitter terminal pin (19), a control terminal pin (20), a collector terminal pin (15), and a resin case (21) having the above-mentioned components sealed therein. The copper blocks (1, 8) make it possible to improve adhesion to a cooling body and the heat dissipation performance. A plurality of single units (101) can be combined with an inter-unit wiring board to form any circuit.

Abstract: A power transmission device that wirelessly supplies power with a power receiving device includes a power transmission unit configured to wirelessly transmit power to a power receiving device, a receiving unit configured to receive a receiving power amount from the power receiving device, an evaluation unit configured to compare a reference value of the power receiving device and the receiving power amount and evaluate a transmission efficiency of power to the power receiving device based on a comparison result, and a transmission unit configured to transmit an evaluation result by the evaluation unit to the power receiving device.