Patents by Inventor Katsuhiro Ando

Katsuhiro Ando has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6624260
    Abstract: By using a curable composition comprising, (A) per 100 parts by weight of an epoxy resin, (B) from 1 to 50 parts by weight of a reactive silicon group-containing polyoxyalkylene polymer, and (C) from 1 to 90 parts by weight of a curing agent for epoxy resins, the working properties of an existing rubber-modified epoxy resin are improved to thereby give stable adhesion properties (for example, improved peel strength) without worsening the shear strength.
    Type: Grant
    Filed: April 13, 2001
    Date of Patent: September 23, 2003
    Assignee: Kaneka Corporation
    Inventors: Katsuhiro Ando, Junji Takase, Fumio Kawakubo
  • Publication number: 20020016411
    Abstract: By using a curable composition comprising, (A) per 100 parts by weight of an epoxy resin, (B) from 1 to 50 parts by weight of a reactive silicon group-containing polyoxyalkylene polymer, and (C) from 1 to 90 parts by weight of a curing agent for epoxy resins, the working properties of an existing rubber-modified epoxy resin are improved to thereby give stable adhesion properties (for example, improved peel strength) without worsening the shear strength.
    Type: Application
    Filed: April 13, 2001
    Publication date: February 7, 2002
    Inventors: Katsuhiro Ando, Junji Takase, Fumio Kawakubo
  • Patent number: 5952052
    Abstract: The present invention has its object to a method for glazing a motor vehicle by direct glazing using a novel curable resin composition. A method for glazing a motor vehicle by direct glazing, which comprises using, as a sealant, a curable resin composition comprising (A) an oxyalkylene polymer having at least one silicon group containing a hydroxyl or hydrolyzable group bound to a silicon atom and capable of crosslinking by silanol condensation reaction, (B) carbon black, and (C) an oxyalkylene polymer not containing a crosslinking group is provided.
    Type: Grant
    Filed: August 28, 1998
    Date of Patent: September 14, 1999
    Assignee: Kaneka Corporation
    Inventors: Jun Hattori, Toshifumi Hirose, Katsuhiro Ando
  • Patent number: 5889124
    Abstract: A curable resin composition containing (a) an oxyalkylene polymer which comprises at least one silicon-containing group having at least one hydroxyl or hydrolyzable group bonded to a silicon atom, (b) an epoxy resin, (c) a ketimine compound and (d) a carbonyl compound, which has improved storage stability.
    Type: Grant
    Filed: March 4, 1997
    Date of Patent: March 30, 1999
    Assignee: Kaneka Corporation
    Inventors: Katsuhiro Ando, Jun Hattori, Toshifumi Hirose