Patents by Inventor Katsuhiro Arakawa

Katsuhiro Arakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6791834
    Abstract: In a liquid-cooling system for a notebook personal computer having a body part including a CPU and a chip set respectively mounted on a mother board and an HDD, and a display part rotatably supported by the body part, a heat receiving head is fixed to at least one heat generation part including the CPU. A tube filled with cooling liquid is connected to the heat receiving head. The tube connected to the heat receiving head is disposed in series on at least one heat generation part including the chip set so as to collect the heat generated from each heat generation part. The tube is also laid in a meandering or zigzagging pattern between a liquid crystal panel and a housing of the display part. The heat generated from each heat generation part is absorbed at part of the tube by the cooling liquid that circulates in the tube and functions as a heat transfer medium. The absorbed heat is then radiated at another part of the tube.
    Type: Grant
    Filed: December 3, 2002
    Date of Patent: September 14, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Tsuyoshi Nakagawa, Yasushi Neho, Tatsuhiko Matsuoka, Masahito Suzuki, Masaaki Eishima, Kenichi Nagashima, Shinji Matsushita, Katsuhiro Arakawa, Kenichi Saito
  • Publication number: 20030081380
    Abstract: In a liquid-cooling system for a notebook personal computer having a body part including a CPU and a chip set respectively mounted on a mother board and an HDD, and a display part rotatably supported by the body part, a heat receiving head is fixed to at least one heat generation part including the CPU. A tube filled with cooling liquid is connected to the heat receiving head. The tube connected to the heat receiving head is disposed in series on at least one heat generation part including the chip set so as to collect the heat generated from each heat generation part. The tube is also laid in a meandering or zigzagging pattern between a liquid crystal panel and a housing of the display part. The heat generated from each heat generation part is absorbed at part of the tube by the cooling liquid that circulates in the tube and functions as a heat transfer medium. The absorbed heat is then radiated at another part of the tube.
    Type: Application
    Filed: December 3, 2002
    Publication date: May 1, 2003
    Applicant: Hitachi, Ltd.
    Inventors: Tsuyoshi Nakagawa, Yasushi Neho, Tatsuhiko Matsuoka, Masahito Suzuki, Masaaki Eishima, Kenichi Nagashima, Shinji Matsushita, Katsuhiro Arakawa, Kenichi Saito
  • Patent number: 6519147
    Abstract: In a liquid-cooling system for a notebook personal computer having a body part including a CPU and a chip set respectively mounted on a mother board and an HDD, and a display part rotatably supported by the body part, a heat receiving head is fixed to at least one heat generation part including the CPU. A tube filled with cooling liquid is connected to the heat receiving head. The tube connected to the heat receiving head is disposed in series on at least one heat generation part including the chip set so as to collect the heat generated from each heat generation part. The tube is also laid in a meandering or zigzagging pattern between a liquid crystal panel and a housing of the display part. The heat generated from each heat generation part is absorbed at part of the tube by the cooling liquid that circulates in the tube and functions as a heat transfer medium. The absorbed heat is then radiated at another part of the tube.
    Type: Grant
    Filed: March 2, 2001
    Date of Patent: February 11, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Tsuyoshi Nakagawa, Yasushi Neho, Tatsuhiko Matsuoka, Masahito Suzuki, Masaaki Eishima, Kenichi Nagashima, Shinji Matsushita, Katsuhiro Arakawa, Kenichi Saito
  • Patent number: 6519148
    Abstract: In a liquid-cooling system for a notebook personal computer having a body part including a CPU and a chip set respectively mounted on a mother board and an HDD, and a display part rotatably supported by the body part, a heat receiving head is fixed to at least one heat generation part including the CPU. A tube filled with cooling liquid is connected to the heat receiving head. The tube connected to the heat receiving head is disposed in series on at least one heat generation part including the chip set so as to collect the heat generated from each heat generation part. The tube is also laid in a meandering or zigzagging pattern between a liquid crystal panel and a housing of the display part. The heat generated from each heat generation part is absorbed at part of the tube by the cooling liquid that circulates in the tube and functions as a heat transfer medium. The absorbed heat is then radiated at another part of the tube.
    Type: Grant
    Filed: March 2, 2001
    Date of Patent: February 11, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Tsuyoshi Nakagawa, Yasushi Neho, Tatsuhiko Matsuoka, Masahito Suzuki, Masaaki Eishima, Kenichi Nagashima, Shinji Matsushita, Katsuhiro Arakawa, Kenichi Saito
  • Publication number: 20020101716
    Abstract: In a liquid-cooling system for a notebook personal computer having a body part including a CPU and a chip set respectively mounted on a mother board and an HDD, and a display part rotatably supported by the body part, a heat receiving head is fixed to at least one heat generation part including the CPU. A tube filled with cooling liquid is connected to the heat receiving head. The tube connected to the heat receiving head is disposed in series on at least one heat generation part including the chip set so as to collect the heat generated from each heat generation part. The tube is also laid in a meandering or zigzagging pattern between a liquid crystal panel and a housing of the display part. The heat generated from each heat generation part is absorbed at part of the tube by the cooling liquid that circulates in the tube and functions as a heat transfer medium. The absorbed heat is then radiated at another part of the tube.
    Type: Application
    Filed: March 2, 2001
    Publication date: August 1, 2002
    Inventors: Tsuyoshi Nakagawa, Yasushi Neho, Tatsuhiko Matsuoka, Masahito Suzuki, Masaaki Eishima, Kenichi Nagashima, Shinji Matsushita, Katsuhiro Arakawa, Kenichi Saito
  • Publication number: 20020075643
    Abstract: In a liquid-cooling system for a notebook personal computer having a body part including a CPU and a chip set respectively mounted on a mother board and an HDD, and a display part rotatably supported by the body part, a heat receiving head is fixed to at least one heat generation part including the CPU. A tube filled with cooling liquid is connected to the heat receiving head. The tube connected to the heat receiving head is disposed in series on at least one heat generation part including the chip set so as to collect the heat generated from each heat generation part. The tube is also laid in a meandering or zigzagging pattern between a liquid crystal panel and a housing of the display part. The heat generated from each heat generation part is absorbed at part of the tube by the cooling liquid that circulates in the tube and functions as a heat transfer medium. The absorbed heat is then radiated at another part of the tube.
    Type: Application
    Filed: March 2, 2001
    Publication date: June 20, 2002
    Inventors: Tsuyoshi Nakagawa, Yasushi Neho, Tatsuhiko Matsuoka, Masahito Suzuki, Masaaki Eishima, Kenichi Nagashima, Shinji Matsushita, Katsuhiro Arakawa, Kenichi Saito
  • Patent number: 5291419
    Abstract: A method for evaluating the life of a connection between members including the steps of extracting parameters defining the shearing strain of a predetermined model representing the connection thereby to calculate the values of plural shearing strains of the connection, calculating the equivalent strain amplitude corresponding to thermal fatigue stress for each of the values of the plural shearing strains defining the relationship between the shearing strain and the equivalent strain amplitude, formulating a life evaluation criterion equation expressed using the equivalent strain amplitude, calculating, for the connection, the equivalent strain amplitude corresponding to each of the shearing strains actually measured using the equation, and substituting the equivalent strain amplitude for the life evaluation criterion equation to acquire the life of the connection.
    Type: Grant
    Filed: January 6, 1992
    Date of Patent: March 1, 1994
    Assignees: Hitachi, Ltd., Hitachi Microcomputer Engineering Ltd.
    Inventors: Ryohei Satoh, Katsuhiro Arakawa, Kiyoshi Kanai, Tsutomu Takahashi, Takaji Takenaka, Haruhiko Imada