Patents by Inventor Katsuhiro Gunji

Katsuhiro Gunji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Probe card maintenance method which adjusts position/posture of probes
    Patent number: 8446160
    Abstract: An improved probe card maintenance method is capable of accurately, rapidly, and easily performing the maintenance of a probe card. The probe card is a jig adapted to test the electrical properties of semiconductor integrated circuits. The electrical properties of the semiconductor integrated circuits are tested at a predetermined test temperature. The probe card has a plurality of probes thereon. The probe card maintenance method includes heating the probe card and the probes on the probe card to the same temperature as the test temperature. The method also includes adjusting positions and postures of the defective probes while maintaining the temperature of the probe card and the probes at the test temperature.
    Type: Grant
    Filed: February 1, 2010
    Date of Patent: May 21, 2013
    Assignee: Oki Semiconductor Co., Ltd.
    Inventors: Katsuhiro Gunji, Toru Iwasaki, Tatsurou Nagai, Yumi Kodama
  • Apparatus and method for testing semiconductor devices
    Patent number: 8432176
    Abstract: A test apparatus for testing semiconductor integrated circuits includes a test head, a probe card holder for detachably holding a probe card that probes a semiconductor device, a heater for heating the probe card, and a heater holder that holds the heater in direct contact with the probe card when the probe card is held by the probe card holder. The test apparatus heats the probe card efficiently and thereby reduces test time and cost.
    Type: Grant
    Filed: February 9, 2010
    Date of Patent: April 30, 2013
    Assignee: OKI Semiconductor Co., Ltd.
    Inventors: Katsuhiro Gunji, Toru Iwasaki, Takaaki Sasaki
  • APPARATUS AND METHOD FOR TESTING SEMICONDUCTOR DEVICES
    Publication number: 20100201391
    Abstract: A test apparatus for testing semiconductor integrated circuits includes a test head, a probe card holder for detachably holding a probe card that probes a semiconductor device, a heater for heating the probe card, and a heater holder that holds the heater in direct contact with the probe card when the probe card is held by the probe card holder. The test apparatus heats the probe card efficiently and thereby reduces test time and cost.
    Type: Application
    Filed: February 9, 2010
    Publication date: August 12, 2010
    Applicant: OKI SEMICONDUCTOR CO., LTD.
    Inventors: Katsuhiro Gunji, Toru Iwasaki, Takaaki Sasaki
  • PROBE CARD MAINTENANCE METHOD
    Publication number: 20100196136
    Abstract: An improved probe card maintenance method is capable of accurately, rapidly, and easily performing the maintenance of a probe card. The probe card is a jig adapted to test the electrical properties of semiconductor integrated circuits. The electrical properties of the semiconductor integrated circuits are tested at a predetermined test temperature. The probe card has a plurality of probes thereon. The probe card maintenance method includes heating the probe card and the probes on the probe card to the same temperature as the test temperature. The method also includes adjusting positions and postures of the defective probes while maintaining the temperature of the probe card and the probes at the test temperature.
    Type: Application
    Filed: February 1, 2010
    Publication date: August 5, 2010
    Applicant: OKI SEMICONDUCTOR CO., LTD.
    Inventors: Katsuhiro Gunji, Toru Iwasaki, Tatsurou Nagai, Yumi Kodama