Patents by Inventor Katsuhiro Haruyama

Katsuhiro Haruyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor wafer, semiconductor chip, semiconductor device and method for manufacturing semiconductor device
    Patent number: 6649931
    Abstract: A semiconductor device includes a first semiconductor chip having a non-volatile memory array which has a first memory area for storing input information of usual operation, and a second memory area for storing historical information of an electrical characteristic test of the first memory area. The device further includes a second semiconductor chip having a volatile memory array with a third memory area for storing input information of usual operation. Historical information of an electrical characteristic test of the third memory area of the second semiconductor chip is stored into the second memory area of the first semiconductor chip.
    Type: Grant
    Filed: November 13, 2001
    Date of Patent: November 18, 2003
    Assignees: Hitachi, Ltd., Akita Electronics Co., Ltd.
    Inventors: Kazuki Honma, Terutaka Okada, Fumiaki Kitajima, Takahiro Hatazawa, Hiroyuki Motomatsu, Katsuhiro Haruyama
  • Semiconductor wafer, semiconductor chip, semiconductor device and method for manufacturing semiconductor device
    Publication number: 20030013249
    Abstract: There is provided an electrical characteristic test technique for a semiconductor device that can shorten the time required for a next probe test after a wafer level burn-in test, prevent leak of defective product to an assembling process and moreover easily realizes the analysis of cause for generation of a fault after delivery of products to customers.
    Type: Application
    Filed: September 17, 2002
    Publication date: January 16, 2003
    Applicant: Hitachi, Ltd.
    Inventors: Kazuki Honma, Terutaka Okada, Fumiaki Kitajima, Takahiro Hatazawa, Hiroyuki Motomatsu, Katsuhiro Haruyama
  • Semiconductor wafer, semiconductor chip, semiconductor device and method for manufacturing semiconductor device
    Publication number: 20020061606
    Abstract: There is provided an electrical characteristic test technique for a semiconductor device that can shorten the time required for a next probe test after a wafer level burn-in test, prevent leak of defective product to an assembling process and moreover easily realizes the analysis of cause for generation of a fault after delivery of products to customers.
    Type: Application
    Filed: November 13, 2001
    Publication date: May 23, 2002
    Applicant: Hitachi, Ltd.
    Inventors: Kazuki Honma, Terutaka Okada, Fumiaki Kitajima, Takahiro Hatazawa, Hiroyuki Motomatsu, Katsuhiro Haruyama
  • Method of and apparatus for manufacturing float glass
    Patent number: 4784680
    Abstract: Difference in height is provided between a first surface of a molten metal bath at the upstream side in a vessel and a second surface thereof by means of a linear induction motor. A glass ribbon supplied to the first surface is formed to have a predetermined thickness while it is moved from the first surface to the second surface.
    Type: Grant
    Filed: July 1, 1987
    Date of Patent: November 15, 1988
    Assignee: Asahi Glass Company Ltd.
    Inventors: Yasuo Sato, Tsunehiro Saito, Hiroshi Mase, Katsuhiro Haruyama, Masaaki Yoshikawa