Abstract: A bonding method includes attracting and holding a first substrate by using a first holder; attracting and holding a second substrate by using a second holder; and forming a combined substrate by moving the first holder and the second holder relative to each other to bring the first substrate and the second substrate into contact with each other. The bonding method includes heating the first substrate and the second substrate or the combined substrate; and cooling the heated combined substrate by using a cooling unit. In the cooling, bending of the combined substrate is controlled by forming a temperature difference in the combined substrate.

Abstract: A bonding method includes attracting and holding a first substrate by using a first holder; attracting and holding a second substrate by using a second holder; and forming a combined substrate by moving the first holder and the second holder relative to each other to bring the first substrate and the second substrate into contact with each other. The bonding method includes heating the first substrate and the second substrate or the combined substrate; and cooling the heated combined substrate by using a cooling unit. In the cooling, bending of the combined substrate is controlled by forming a temperature difference in the combined substrate.

Abstract: A cleaning method that peels off an overlapped substrate and cleans a bonding surface of a peeled substrate to be processed, the overlapped substrate including the substrate to be processed and a support substrate bonded together with a protectant, a peeling agent and an adhesive stacked in order therebetween from the substrate to be processed, the cleaning method comprising: removing the protectant by supplying a solvent of the protectant from a solvent supply part to the bonding surface of the substrate to be processed; and removing the peeling agent by absorbing the peeling agent, which has been peeled from the bonding surface of the substrate to be processed, using a peeling agent absorption part.

Abstract: A cleaning device peels off an overlapped substrate and cleans a bonding surface of a peeled substrate to be processed, the overlapped substrate including the substrate to be processed and a support substrate bonded together with a protectant, a peeling agent and an adhesive stacked in order therebetween from the substrate to be processed. The cleaning device includes: a support part that supports the substrate to be processed; a solvent supply part that supplies a solvent of the protectant to the bonding surface of the substrate to be processed supported by the support part; and a peeling agent absorption part that absorbs and removes the peeling agent which has been peeled from the bonding surface of the substrate to be processed.