Patents by Inventor Katsuhiro IWAI
Katsuhiro IWAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230253298Abstract: A semiconductor device includes a plurality of leads, a semiconductor element electrically connected to the leads and supported by one of the leads, and a sealing resin covering the semiconductor element and a part of each lead. The sealing resin includes a first edge, a second edge perpendicular to the first edge, and a center line parallel to the first edge. The reverse surfaces of the respective leads include parts exposed from the sealing resin, and the exposed parts include an outer reverse-surface mount portion and an inner reverse-surface mount portion that are disposed along the second edge of the sealing resin. The inner reverse-surface mount portion is closer to the center line of the sealing resin than is the outer reverse-surface mount portion. The outer reverse-surface mount portion is greater in area than the inner reverse-surface mount portion.Type: ApplicationFiled: April 17, 2023Publication date: August 10, 2023Inventor: Katsuhiro IWAI
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Patent number: 11658100Abstract: A semiconductor device includes a plurality of leads, a semiconductor element electrically connected to the leads and supported by one of the leads, and a sealing resin covering the semiconductor element and a part of each lead. The sealing resin includes a first edge, a second edge perpendicular to the first edge, and a center line parallel to the first edge. The reverse surfaces of the respective leads include parts exposed from the sealing resin, and the exposed parts include an outer reverse-surface mount portion and an inner reverse-surface mount portion that are disposed along the second edge of the sealing resin. The inner reverse-surface mount portion is closer to the center line of the sealing resin than is the outer reverse-surface mount portion. The outer reverse-surface mount portion is greater in area than the inner reverse-surface mount portion.Type: GrantFiled: September 10, 2021Date of Patent: May 23, 2023Assignee: ROHM CO., LTD.Inventor: Katsuhiro Iwai
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Publication number: 20210407893Abstract: A semiconductor device includes a plurality of leads, a semiconductor element electrically connected to the leads and supported by one of the leads, and a sealing resin covering the semiconductor element and a part of each lead. The sealing resin includes a first edge, a second edge perpendicular to the first edge, and a center line parallel to the first edge. The reverse surfaces of the respective leads include parts exposed from the sealing resin, and the exposed parts include an outer reverse-surface mount portion and an inner reverse-surface mount portion that are disposed along the second edge of the sealing resin. The inner reverse-surface mount portion is closer to the center line of the sealing resin than is the outer reverse-surface mount portion. The outer reverse-surface mount portion is greater in area than the inner reverse-surface mount portion.Type: ApplicationFiled: September 10, 2021Publication date: December 30, 2021Inventor: Katsuhiro IWAI
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Patent number: 11183444Abstract: A semiconductor device includes a plurality of leads, a semiconductor element electrically connected to the leads and supported by one of the leads, and a sealing resin covering the semiconductor element and a part of each lead. The sealing resin includes a first edge, a second edge perpendicular to the first edge, and a center line parallel to the first edge. The reverse surfaces of the respective leads include parts exposed from the sealing resin, and the exposed parts include an outer reverse-surface mount portion and an inner reverse-surface mount portion that are disposed along the second edge of the sealing resin. The inner reverse-surface mount portion is closer to the center line of the sealing resin than is the outer reverse-surface mount portion. The outer reverse-surface mount portion is greater in area than the inner reverse-surface mount portion.Type: GrantFiled: December 2, 2020Date of Patent: November 23, 2021Assignee: ROHM CO., LTD.Inventor: Katsuhiro Iwai
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Patent number: 11037865Abstract: An aspect of the present disclosure provides a method of manufacturing a semiconductor device. The method includes preparing a lead frame. The lead frame includes a first lead including a pad and a first terminal. The pad includes a pad main surface and a pad back surface that face opposite sides to each other in a first direction. The first terminal extends from the pad along a second direction that is perpendicular to the first direction.Type: GrantFiled: March 3, 2020Date of Patent: June 15, 2021Assignee: ROHM CO., LTD.Inventors: Koshun Saito, Katsuhiro Iwai
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Publication number: 20210090978Abstract: A semiconductor device includes a plurality of leads, a semiconductor element electrically connected to the leads and supported by one of the leads, and a sealing resin covering the semiconductor element and a part of each lead. The sealing resin includes a first edge, a second edge perpendicular to the first edge, and a center line parallel to the first edge. The reverse surfaces of the respective leads include parts exposed from the sealing resin, and the exposed parts include an outer reverse-surface mount portion and an inner reverse-surface mount portion that are disposed along the second edge of the sealing resin. The inner reverse-surface mount portion is closer to the center line of the sealing resin than is the outer reverse-surface mount portion. The outer reverse-surface mount portion is greater in area than the inner reverse-surface mount portion.Type: ApplicationFiled: December 2, 2020Publication date: March 25, 2021Inventor: Katsuhiro IWAI
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Patent number: 10886203Abstract: A semiconductor device includes a plurality of leads, a semiconductor element electrically connected to the leads and supported by one of the leads, and a sealing resin covering the semiconductor element and a part of each lead. The sealing resin includes a first edge, a second edge perpendicular to the first edge, and a center line parallel to the first edge. The reverse surfaces of the respective leads include parts exposed from the sealing resin, and the exposed parts include an outer reverse-surface mount portion and an inner reverse-surface mount portion that are disposed along the second edge of the sealing resin. The inner reverse-surface mount portion is closer to the center line of the sealing resin than is the outer reverse-surface mount portion. The outer reverse-surface mount portion is greater in area than the inner reverse-surface mount portion.Type: GrantFiled: January 8, 2019Date of Patent: January 5, 2021Assignee: ROHM CO., LTD.Inventor: Katsuhiro Iwai
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Publication number: 20200203261Abstract: An aspect of the present disclosure provides a method of manufacturing a semiconductor device. The method includes preparing a lead frame. The lead frame includes a first lead including a pad and a first terminal. The pad includes a pad main surface and a pad back surface that face opposite sides to each other in a first direction. The first terminal extends from the pad along a second direction that is perpendicular to the first direction.Type: ApplicationFiled: March 3, 2020Publication date: June 25, 2020Inventors: Koshun SAITO, Katsuhiro IWAI
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Patent number: 10622285Abstract: An aspect of the present disclosure provides a method of manufacturing a semiconductor device. The method includes: preparing a first semiconductor element and a second semiconductor element, each of the first semiconductor element and the second semiconductor element having an element main surface and an element back surface that face opposite sides to each other; die bonding the element back surface of the first semiconductor element to a pad main surface by using a first solder; and die bonding the element back surface of the second semiconductor element to the pad main surface by using a second solder having a melting point lower than a melting point of the first solder, after die bonding the element back surface of the first semiconductor element to the pad main surface by using the first solder.Type: GrantFiled: July 6, 2017Date of Patent: April 14, 2020Assignee: ROHM CO., LTD.Inventors: Koshun Saito, Katsuhiro Iwai
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Publication number: 20190139871Abstract: A semiconductor device includes a plurality of leads, a semiconductor element electrically connected to the leads and supported by one of the leads, and a sealing resin covering the semiconductor element and a part of each lead. The sealing resin includes a first edge, a second edge perpendicular to the first edge, and a center line parallel to the first edge. The reverse surfaces of the respective leads include parts exposed from the sealing resin, and the exposed parts include an outer reverse-surface mount portion and an inner reverse-surface mount portion that are disposed along the second edge of the sealing resin. The inner reverse-surface mount portion is closer to the center line of the sealing resin than is the outer reverse-surface mount portion. The outer reverse-surface mount portion is greater in area than the inner reverse-surface mount portion.Type: ApplicationFiled: January 8, 2019Publication date: May 9, 2019Inventor: Katsuhiro IWAI
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Patent number: 10211130Abstract: A semiconductor device includes a plurality of leads, a semiconductor element electrically connected to the leads and supported by one of the leads, and a sealing resin covering the semiconductor element and a part of each lead. The sealing resin includes a first edge, a second edge perpendicular to the first edge, and a center line parallel to the first edge. The reverse surfaces of the respective leads include parts exposed from the sealing resin, and the exposed parts include an outer reverse-surface mount portion and an inner reverse-surface mount portion that are disposed along the second edge of the sealing resin. The inner reverse-surface mount portion is closer to the center line of the sealing resin than is the outer reverse-surface mount portion. The outer reverse-surface mount portion is greater in area than the inner reverse-surface mount portion.Type: GrantFiled: January 26, 2017Date of Patent: February 19, 2019Assignee: ROHM CO., LTD.Inventor: Katsuhiro Iwai
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Publication number: 20180012826Abstract: An aspect of the present disclosure provides a method of manufacturing a semiconductor device. The method includes: preparing a first semiconductor element and a second semiconductor element, each of the first semiconductor element and the second semiconductor element having an element main surface and an element back surface that face opposite sides to each other; die bonding the element back surface of the first semiconductor element to a pad main surface by using a first solder; and die bonding the element back surface of the second semiconductor element to the pad main surface by using a second solder having a melting point lower than a melting point of the first solder, after die bonding the element back surface of the first semiconductor element to the pad main surface by using the first solder.Type: ApplicationFiled: July 6, 2017Publication date: January 11, 2018Inventors: Koshun SAITO, Katsuhiro IWAI
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Publication number: 20170213782Abstract: A semiconductor device includes a plurality of leads, a semiconductor element electrically connected to the leads and supported by one of the leads, and a sealing resin covering the semiconductor element and a part of each lead. The sealing resin includes a first edge, a second edge perpendicular to the first edge, and a center line parallel to the first edge. The reverse surfaces of the respective leads include parts exposed from the sealing resin, and the exposed parts include an outer reverse-surface mount portion and an inner reverse-surface mount portion that are disposed along the second edge of the sealing resin. The inner reverse-surface mount portion is closer to the center line of the sealing resin than is the outer reverse-surface mount portion. The outer reverse-surface mount portion is greater in area than the inner reverse-surface mount portion.Type: ApplicationFiled: January 26, 2017Publication date: July 27, 2017Inventor: Katsuhiro IWAI
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Patent number: D796459Type: GrantFiled: September 28, 2016Date of Patent: September 5, 2017Assignee: ROHM CO., LTD.Inventor: Katsuhiro Iwai
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Patent number: D813537Type: GrantFiled: October 15, 2015Date of Patent: March 27, 2018Assignee: MENICON CO., LTD.Inventors: Toshikazu Miura, Shota Nagao, Takashi Goto, Katsuhiro Iwai, Keisuke Yamamoto
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Patent number: D899081Type: GrantFiled: December 7, 2018Date of Patent: October 20, 2020Assignee: MENICON CO., LTD.Inventors: Keisuke Yamamoto, Katsuhiro Iwai, Akihiro Yasuda, Keiko Yamamoto, Takashi Goto