Abstract: A curable resin composition comprises a (meth)acrylic polyol, a hydrogenated polyolefin-based polyol, and a polyisocyanate. The (meth)acrylic polyol includes a polymer having a hydroxyl value of 5 mg KOH/g or more and 150 mg KOH/g or less, a glass transition temperature of ?70° C. or more and ?40° C. or less, and a number average molecular weight of 500 or more and 20000 or less, and which is liquid at 25° C. The hydrogenated polyolefin-based polyol has an iodine value of 15 or less. An electrical component (1) comprises a sealing member (2) including a cured product of the curable resin composition.

Abstract: A curable resin composition comprises a (meth)acrylic polyol, a hydrogenated polyolefin-based polyol, and a polyisocyanate. The (meth)acrylic polyol includes a polymer having a hydroxyl value of 5 mg KOH/g or more and 150 mg KOH/g or less, a glass transition temperature of ?70° C. or more and ?40° C. or less, and a number average molecular weight of 500 or more and 20000 or less, and which is liquid at 25° C. The hydrogenated polyolefin-based polyol has an iodine value of 15 or less. An electrical component (1) comprises a sealing member (2) including a cured product of the curable resin composition.

Abstract: A curable resin composition includes a main agent, an amine-based curing agent, and a phenol-based curing agent. The main agent includes at least one of a maleimide compound and an epoxy compound. The amine-based curing agent is made of aromatic polyamine. The phenol-based curing agent is made of phenols that has a phenolic OH equivalent of equal to or less than 90 and has a softening point or a melting point of equal to or lower than 100° C.