Abstract: A defect observation device including an input-output unit supplied with information of a taught defect, and information of an ideal output of the taught defect, and configured to display a processing result based upon a determined image processing parameter set; and an automatic determination unit configured to: select image processing parameter sets which are less in number than the total number of all image processing parameter sets, out of all image processing parameter sets, calculate image processing results on an input defect image, by using the selected image processing parameter sets, calculate a coincidence degree for each of the selected image processing parameter sets, estimate distribution of an index value in all image processing parameter sets from distribution of the coincidence degree for the selected image processing parameter sets, and determine an image processing parameter set to have a high coincidence degree out of all image processing parameter sets.

Abstract: A defect observation device supplied with a taught defect and an ideal output obtained by conducting image processing on the taught defect as its input and capable of conducting work of setting image processing parameters required to classify defect kinds easily and fast is provided.

Abstract: The present invention enables provision of a defect observation device that reduces wait time from an end of pickup of a reference image and accompanying processing to a start of pickup of a defect image compared to conventional ones by making a pixel count resolution of the reference image be low compared to a pixel count of the defect image in an image pickup unit using an electronic microscope for automatic fine defect classification, whereby a throughput enhanced compared to those of conventional ones can be achieved.

Abstract: An image picked up by a detection system capable of actualizing a three-dimensional inclination is usually poor in the signal-to-noise ratio, and it is difficult to stably detect minute defects. Images that actualize a three-dimensional inclination are picked up from opposed directions. The images are subject to subtraction and addition. The images improved in signal-to-noise ratio as compared with original images are calculated. The images calculated and improved in signal-to-noise ratio respectively of a defect portion and a reference portion are compared with each other. Regions differing in comparison results are detected as defects. As a result, minute defects can be inspected stably.

Abstract: The present invention relates to an inspection device and inspection method of a specimen, particularly to the inspection device and inspection method of defects of semiconductor wafers, and the object is to cope with the increase of inspection images and provide an inspection device and inspection method which is capable of classification by sub class, meeting the user needs, in addition to the automatic classification by an inspection device.

Abstract: An image picked up by a detection system capable of actualizing a three-dimensional inclination is usually poor in the signal-to-noise ratio, and it is difficult to stably detect minute defects. Images that actualize a three-dimensional inclination are picked up from opposed directions. The images are subject to subtraction and addition. The images improved in signal-to-noise ratio as compared with original images are calculated. The images calculated and improved in signal-to-noise ratio respectively of a defect portion and a reference portion are compared with each other. Regions differing in comparison results are detected as defects. As a result, minute defects can be inspected stably.

Abstract: The present invention relates to an inspection device and inspection method of a specimen, particularly to the inspection device and inspection method of defects of semiconductor wafers, and the object is to cope with the increase of inspection images and provide an inspection device and inspection method which is capable of classification by sub class, meeting the user needs, in addition to the automatic classification by an inspection device.