Patents by Inventor Katsuhiro Makihata

Katsuhiro Makihata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110116661
    Abstract: To provide a shield case and an MEMS microphone having the shield case which can secure on a top plate the minimum distance for adhering with a gasket in a view point of airtightness. The shield case according to the invention is a shield case for shielding an MEMS chip mounted on a board from the outside, which includes a top plate and a plurality of side plates and the thickness of each of the plurality of side plates is larger than that of the top plate. According to this configuration, the area of the top plate can be made larger as compared with a conventional shield case having a uniform thickness. Thus, the area for adhering the gasket to the top plate can be secured without changing the position, size and range etc. of the chucking area from those of the conventional shield case.
    Type: Application
    Filed: January 26, 2011
    Publication date: May 19, 2011
    Applicant: PANASONIC CORPORATION
    Inventors: Katsuhiro Makihata, Norio Kimura
  • Patent number: 7904123
    Abstract: To provide a shield case and an MEMS microphone having the shield case which can secure on a top plate the minimum distance for adhering with a gasket in a view point of airtightness. The shield case according to the invention is a shield case for shielding an MEMS chip mounted on a board from the outside, which includes a top plate and a plurality of side plates and the thickness of each of the plurality of side plates is larger than that of the top plate. According to this configuration, the area of the top plate can be made larger as compared with a conventional shield case having a uniform thickness. Thus, the area for adhering the gasket to the top plate can be secured without changing the position, size and range etc. of the chucking area from those of the conventional shield case.
    Type: Grant
    Filed: September 13, 2007
    Date of Patent: March 8, 2011
    Assignee: Panasonic Corporation
    Inventors: Katsuhiro Makihata, Norio Kimura
  • Publication number: 20100167799
    Abstract: To provide a shield case and an MEMS microphone having the shield case which can secure on a top plate the minimum distance for adhering with a gasket in a view point of airtightness. The shield case according to the invention is a shield case for shielding an MEMS chip mounted on a board from the outside, which includes a top plate and a plurality of side plates and the thickness of each of the plurality of side plates is larger than that of the top plate. According to this configuration, the area of the top plate can be made larger as compared with a conventional shield case having a uniform thickness. Thus, the area for adhering the gasket to the top plate can be secured without changing the position, size and range etc. of the chucking area from those of the conventional shield case.
    Type: Application
    Filed: September 13, 2007
    Publication date: July 1, 2010
    Inventors: Katsuhiro Makihata, Norio Kimura
  • Patent number: 7590252
    Abstract: The outer face of a case which accommodates a whole microphone is coated by a material having a heat conductivity which is lower than that of a metal, and a material transforming temperature which is higher than the charge dissipating temperature of a dielectric layer for forming an internal electret, and which is higher than 260° C., so that the internal temperature rise can be mitigated by the thermal resistance and the thermal capacity of the whole interior. When a microphone is attached to an application equipment, particularly, the microphone may be passed through a reflow solder bath for a short time period. A heat-resistant structure which can prevent the function from being impaired by a high temperature in the period is provided.
    Type: Grant
    Filed: August 4, 2005
    Date of Patent: September 15, 2009
    Assignee: Panasonic Corporation
    Inventors: Katsuhiro Makihata, Hiroshi Ogura, Yoshinobu Yasuno
  • Publication number: 20080105935
    Abstract: A micromachine device includes a pad 107a and a pad 107b formed of a polysilicon doped with impurities.
    Type: Application
    Filed: August 15, 2005
    Publication date: May 8, 2008
    Inventors: Hiroshi Ogura, Seiji Ueda, Katsuhiro Makihata
  • Publication number: 20070160247
    Abstract: The outer face of a case which accommodates a whole microphone is coated by a material having a heat conductivity which is lower than that of a metal, and a material transforming temperature which is higher than the charge dissipating temperature of a dielectric layer for forming an internal electret, and which is higher than 260° C., so that the internal temperature rise can be mitigated by the thermal resistance and the thermal capacity of the whole interior. When a microphone is attached to an application equipment, particularly, the microphone may be passed through a reflow solder bath for a short time period. A heat-resistant structure which can prevent the function from being impaired by a high temperature in the period is provided.
    Type: Application
    Filed: August 4, 2005
    Publication date: July 12, 2007
    Inventors: Katsuhiro Makihata, Hiroshi Ogura, Yoshinobu Yasuno
  • Patent number: D517534
    Type: Grant
    Filed: April 1, 2005
    Date of Patent: March 21, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroshi Ogura, Katsuhiro Makihata, Yusuke Takeuchi