Abstract: A multilayer body is formed of a plurality of insulator layers that are stacked on top of one another. A coil is a helical coil provided in the multilayer body and includes a plurality of coil conductor layers that are superposed with one another so as to form a ring-shaped path when seen in plan view from a stacking direction and a plurality of via hole conductors that connect the plurality of coil conductor layers together. The path includes corners that project outward and corners that project inward. Each of the via hole conductors are provided at one of the corners, which project outward.

Abstract: A method of manufacturing an electronic component provides a wide area which can be used for forming elements on the surface of a mother substrate and effectively produces an electronic component having excellent performance characteristics. At least a portion of the mother substrate is cut by using a blade having a shape in which a portion thereof butted against the boundary (shoulder) between the electrode arrangement surface and the cut end surface of the mother substrate or a portion which becomes the boundary (shoulder) is inclined at a predetermined angle to form an inclined surface at the boundary (shoulder) or the portion which becomes the boundary (shoulder) so as to expose a part of an electrode at the inclined surface.

Abstract: A method of manufacturing an electronic component includes forming a slit in a connecting electrode located on the surface of a mother substrate such that the slit extends in a direction intersecting a cutting line, and cutting the mother substrate along the cutting line while cutting the connecting electrode having the slit. The connecting electrode is thereby reliably exposed on two opposing cut surfaces, and the reliability of external connection of the electronic component is improved.

Abstract: A laminate type line transformer. On one side of an insulating substrate, a primary coil section which is a laminate of a first coil pattern layer and a second coil pattern layer with an insulating layer in-between is provided. On the other side of the insulating substrate, a secondary coil section which is a laminate of a first coil pattern layer and a second coil pattern layer with an insulating layer in-between is provided. Both in the primary coil section and in the secondary coil section, conductors of the first coil pattern layer and conductors of the second coil pattern layer are electrically connected alternately via a hole made in the insulating layer.