Patents by Inventor Katsuhiro Nagasawa
Katsuhiro Nagasawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240017345Abstract: A method for joining different kinds of metal materials includes: preparing a rivet, a plurality of metal members, and a first electrode and a second electrode, each having shanks and electrode portions provided at the tips of the shanks; sandwiching the rivet and the plurality of metal members between a first electrode and a second electrode; and embedding the rivet into the metal member by pressurization and energization using the first electrode and the second electrode. The preparation step includes preparing, as the first electrode and the second electrode, two electrodes that satisfy a condition in which each of electrical resistance values of the first and second electrodes is lower than or equal to a sum of an electrical resistance value of the plurality of metal members to be joined and an electrical resistance value of the rivet.Type: ApplicationFiled: February 22, 2022Publication date: January 18, 2024Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Shuhei OGURA, Tomohiko SEKIGUCHI, Shotaro KUROKAWA, Katsuhiro NAGASAWA, Hiroshi ADACHI, Daisuke YANAGIBASHI, Makoto AOYAMA, Keiichirou INAGAKI
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Publication number: 20230256524Abstract: A chip discharging flute is formed in a tip outer peripheral portion of a drill body rotated around an axis in a drill rotation direction. A cutting edge is formed in an intersection ridgeline portion between a wall surface of the chip discharging flute facing the drill rotation direction and a tip flank. The cutting edge includes a main cutting edge portion extending from an inner peripheral side toward an outer peripheral side of the drill body, and a cutting edge shoulder portion extending from an outer peripheral end of the main cutting edge portion to an outer periphery of the drill body, and is subjected to honing. Compared to the outer peripheral end of the main cutting edge portion, in an outer peripheral end of the cutting edge shoulder portion, a true rake angle is increased on a negative rake angle side, and a size of the honing decreases.Type: ApplicationFiled: July 27, 2021Publication date: August 17, 2023Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Akira Sato, Katsuhiro Nagasawa
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Patent number: 8356961Abstract: The invention provides a machining apparatus, and its machining method, having machining tables whose weight do not increase so much even if a number of machining sections such as spindles is increased. One of the machining tables is a rectangular stationary table having a groove in the direction perpendicular to the longitudinal direction on its surface and the other is a rectangular movable table engaged with the groove. The machining apparatus machines a printed circuit board, whose area is larger than that of the movable table, on a mounting surface of the stationary table by changing position of the printed circuit board by moving the movable table and by determining machining position by moving a spindle at position facing the mounting surface of the stationary table.Type: GrantFiled: November 4, 2009Date of Patent: January 22, 2013Assignee: Hitachi Via Mechanics Ltd.Inventors: Norishige Kumagai, Tamio Otani, Katsuhiro Nagasawa, Jun Wakamatsu, Hiroyuki Kamata, Tomoaki Ozaki
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Patent number: 7959385Abstract: A printed circuit board machining apparatus includes a spindle that holds a tool for machining a printed circuit board and a pressure unit for pressing the printed circuit board to a table in machining the printed circuit board. The pressure unit includes a pressure foot movable up an down along the spindle, a rotating member having a plurality of pressure pieces through which a through hole for passing the tool is formed and provided so as to select one among the plurality of pressure pieces, a motor for moving the rotating member, cylinders and electromagnetic valves for moving the pressure foot up and down and a control section for controlling the cylinders and electromagnetic valves. The control section rotates the motor so as to select the pressure piece and controls the cylinders and the electromagnetic valves to change force for pressing the printed circuit board.Type: GrantFiled: May 21, 2008Date of Patent: June 14, 2011Assignee: Hitachi Via Mechanics, Ltd.Inventors: Hirofumi Kado, Hiroyuki Kamata, Shintaro Takahashi, Katsuhiro Nagasawa
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Publication number: 20100119317Abstract: The invention provides a machining apparatus, and its machining method, having machining tables whose weight do not increase so much even if a number of machining sections such as spindles is increased. One of the machining tables is a rectangular stationary table having a groove in the direction perpendicular to the longitudinal direction on its surface and the other is a rectangular movable table engaged with the groove. The machining apparatus machines a printed circuit board, whose area is larger than that of the movable table, on a mounting surface of the stationary table by changing position of the printed circuit board by moving the movable table and by determining machining position by moving a spindle at position facing the mounting surface of the stationary table.Type: ApplicationFiled: November 4, 2009Publication date: May 13, 2010Inventors: Norishige Kumagai, Tamio Otani, Katsuhiro Nagasawa, Jun Wakamatsu, Hiroyuki Kamata, Tomoaki Ozaki
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Patent number: 7637702Abstract: There is provided a drilling method capable of improving machining accuracy of a printed board drilling apparatus as a whole by decreasing dispersion of the machining accuracy even if it is a multi-spindle printed board drilling apparatus. A misalignment of an axial center of a drill with respect to a designed axial center in X and Y directions is detected in advance per a certain number of revolutions of each spindle that rotates the drill. Holes of two or more types of diameter are made on a printed board by making holes of at least one diameter, e.g., an exposure master hole, per each spindle and by making holes of all other diameters almost simultaneously by all of the spindles.Type: GrantFiled: July 20, 2006Date of Patent: December 29, 2009Assignee: Hitachi Via Mechanics, Ltd.Inventors: Takao Furukawa, Hiroshi Kawasaki, Toshiyuki Iwata, Katsuhiro Nagasawa, Takahiko Yamashita
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Patent number: 7507058Abstract: A tool positioning device and a machining element have simple structures which can reduce running cost. In addition to a hole that engages with a shank of an end mill, a channel is provided so that it penetrates through the device such that one end thereof communicates with an upper face of the device and the other end communicates with a lower end of the device. In this case, it is more effective to provide a concave portion that is opened to the upper face and communicates with the hole. The same effect may be obtained by making a cylindrical hole, for example, instead of the channel.Type: GrantFiled: October 19, 2005Date of Patent: March 24, 2009Assignee: Hitachi Via Mechanics, Ltd.Inventors: Takayuki Hashimoto, Katsuhiro Nagasawa, Shintarou Takahashi
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Patent number: 7488676Abstract: A manufacturing method of a multi-layered circuit board allows electronic parts to be mounted adequately and will not hamper performance of the electronic parts. A power terminal (pin) of an electronic part to be mounted on a surface of the multi-layered circuit board is inserted into a plated through hole to connect with a first conductive layer. A detecting section having a detecting hole which is formed coaxially with the through hole and whose diameter is larger than the through hole is provided on a second conductive layer on the back of the first conductive layer. A hole having a large diameter is formed by a tool along the through hole from the back while applying voltage between the second conductive layer and the tool. The depth of the hole is set based on the tool electrically conducting with the detecting hole. Unnecessary plate of the through hole may be removed by the large hole.Type: GrantFiled: December 9, 2005Date of Patent: February 10, 2009Assignee: Hitachi Via Mechanics, Ltd.Inventors: Yasuhiko Kanaya, Akira Irie, Katsuhiro Nagasawa, Toru Yuki
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Patent number: 7476065Abstract: A printed board drilling method and a printed board machining apparatus capable of improving machining quality, such as improving positional accuracy of holes and true roundness of machined holes, and improving work efficiency by minimizing a runout of the tip of a drill. An extension of the drill extending out of a spindle when the drill is held by the spindle is defined in advance per type or mode of use of each drill. One drill is selected among a plurality of drills corresponding to a shape of holes to be drilled in the printed board and the spindle holds the drill so that the selected drill extends out of the spindle by the extension corresponding to the selected drill. Then, the move of the spindle with respect to the printed board is controlled and the selected drill is rotationally driven by the spindle to drill the printed board.Type: GrantFiled: May 31, 2005Date of Patent: January 13, 2009Assignee: Hitachi Via Mechanics, Ltd.Inventors: Nobuhiko Suzuki, Katsuhiro Nagasawa
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Publication number: 20080292416Abstract: A printed circuit board machining apparatus includes a spindle that holds a tool for machining a printed circuit board and a pressure unit for pressing the printed circuit board to a table in machining the printed circuit board. The pressure unit includes a pressure foot movable up an down along the spindle, a rotating member having a plurality of pressure pieces through which a through hole for passing the tool is formed and provided so as to select one among the plurality of pressure pieces, a motor for moving the rotating member, cylinders and electromagnetic valves for moving the pressure foot up and down and a control section for controlling the cylinders and electromagnetic valves. The control section rotates the motor so as to select the pressure piece and controls the cylinders and the electromagnetic valves to change force for pressing the printed circuit board.Type: ApplicationFiled: May 21, 2008Publication date: November 27, 2008Inventors: Hirofumi Kado, Hiroyuki Kamata, Shintaro Takahashi, Katsuhiro Nagasawa
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Patent number: 7249485Abstract: Substrate processing apparatus for processing holes accurately positioned in an long film, comprising: work supporting devices for supporting the work; clamping devices for clamping the work onto the work supporting devices; first movement devices for moving the work supporting devices in the transferring direction of the work; guiding devices for guiding the work supporting devices; guide supporting devices for supporting these guiding devices; and second movement devices for moving the guide supporting devices in the direction perpendicular to the transferring direction of the work, wherein two pins or holes are disposed on or in each of the guiding devices, holes or pins to engage with the pins or holes are disposed on or in each of the guide supporting devices to combine the guiding devices and guide supporting devices in a grid form, and the holes and pins at four junctions are fitted.Type: GrantFiled: September 8, 2004Date of Patent: July 31, 2007Assignee: Hitachi Via Mechanics, Ltd.Inventors: Yuji Honda, Katsuhiro Nagasawa
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Publication number: 20070020053Abstract: There is provided a drilling method capable of improving machining accuracy of a printed board drilling apparatus as a whole by decreasing dispersion of the machining accuracy even if it is a multi-spindle printed board drilling apparatus. A misalignment of an axial center of a drill with respect to a designed axial center in X and Y directions is detected in advance per certain number of revolutions of each spindle that rotates the drill. Holes of two or more types of diameter are made on a printed board by making holes of at least one diameter, e.g., an exposure master hole, per each spindle and by making holes of all other diameters almost simultaneously by all of the spindles.Type: ApplicationFiled: July 20, 2006Publication date: January 25, 2007Inventors: Takao Furukawa, Hiroshi Kawasaki, Toshiyuki Iwata, Katsuhiro Nagasawa, Takahiko Yamashita
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Patent number: 7130715Abstract: In a machining method and a machining apparatus, prior to machining, an NC control unit makes an X-axis drive unit move a table based on examination conditions specified in advance. Thus, the NC control unit obtains a stabilization time required from the command-reach time of a poisoning command and till the stabilization of position response of the table within a predetermined allowable range. Likewise, for moving a drill in a Y-axis direction, the NC control unit obtains a stabilization time required till the stabilization of position response within a predetermined allowable range. At the time of machining, the drill is moved in a Z-axis direction to cut into a printed wiring board as soon as the obtained stabilization time has passed.Type: GrantFiled: October 7, 2003Date of Patent: October 31, 2006Assignee: Hitachi Via Mechanics Ltd.Inventors: Kazuo Watanabe, Takahiko Yamashita, Yasushi Ito, Katsuhiro Nagasawa
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Publication number: 20060127652Abstract: There is provided a multi-layered circuit board and a manufacturing method of the multi-layered circuit board that allows electronic parts to be mounted adequately and that will not hamper performance of the electronic parts. A power terminal (pin) of an electronic part to be mounted on a surface of the multi-layered circuit board is inserted into a plated through hole to connect with a first conductive layer. A detecting section having a detecting hole which is formed coaxially with the through hole and whose diameter is larger than the through hole is provided on a second conductive layer on the back of the first conductive layer. A hole having a large diameter is formed by a tool along the through hole from the back while applying voltage between the second conductive layer and the tool. A depth of the hole is set based on that the tool electrically conducts with the detecting hole. Unnecessary plate of the through hole may be removed by the large hole.Type: ApplicationFiled: December 9, 2005Publication date: June 15, 2006Inventors: Yasuhiko Kanaya, Akira Irie, Katsuhiro Nagasawa, Toru Yuki
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Publication number: 20060082076Abstract: There is provided a tool positioning device and a machining element whose structures are simple and which can reduce a running cost. In addition to a hole that engages with a shank of an end mill, a channel is provided so that it penetrates through the device such that one end thereof communicates with an upper face of the device and the other end communicates with a lower end of the device. In this case, it is more effective to provide a concave portion that is opened to the upper face and communicates with the hole. The same effect may be obtained by making a cylindrical hole for example instead of the channel.Type: ApplicationFiled: October 19, 2005Publication date: April 20, 2006Inventors: Takayuki Hashimoto, Katsuhiro Nagasawa, Shintarou Takahashi
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Publication number: 20050265797Abstract: There are provided a printed board drilling method and a printed board machining apparatus that are capable of improving machining quality, such positional accuracy of holes and true roundness of machined holes, and work efficiency by minimizing a runout of the tip of a drill. An extension of the drill extending out a spindle when the drill is held by the spindle is defined in advance per type or mode of use of each drill. One drill is selected among a plurality of drills corresponding to a shape of holes to be drilled in the printed board and the spindle is caused to hold the drill so that the selected drill extends out of the spindle by the extension corresponding to the selected drill. Then, the move of the spindle with respect to the printed board is controlled and the selected drill is rotationally driven by the spindle to drill the printed board.Type: ApplicationFiled: May 31, 2005Publication date: December 1, 2005Inventors: Nobuhiko Suzuki, Katsuhiro Nagasawa
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Publication number: 20050115796Abstract: Substrate processing apparatus for processing holes accurately positioned in an long film, comprising: work supporting devices for supporting the work; clamping devices for clamping the work onto the work supporting devices; first movement devices for moving the work supporting devices in the transferring direction of the work; guiding devices for guiding the work supporting devices; guide supporting devices for supporting these guiding devices; and second movement devices for moving the guide supporting devices in the direction perpendicular to the transferring direction of the work, wherein two pins or holes are disposed on or in each of the guiding devices, holes or pins to engage with the pins or holes are disposed on or in each of the guide supporting devices to combine the guiding devices and guide supporting devices in a grid form, and the holes and pins at four junctions are fitted.Type: ApplicationFiled: September 8, 2004Publication date: June 2, 2005Inventors: Yuji Honda, Katsuhiro Nagasawa
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Publication number: 20040128816Abstract: The invention provides a machining method and a machining apparatus in which the machining productivity and the machining quality of the machining apparatus can be improved. Prior to machining, an NC control unit makes an X-axis drive unit move a table based on examination conditions specified in advance. Thus, the NC control unit obtains a stabilization time required from the command-reach time of a poisoning command and till the stabilization of position response of the table within a predetermined allowable range. Likewise, for means for moving a drill in a Y-axis direction, the NC control unit obtains a stabilization time required till the stabilization of position response within a predetermined allowable range. At the time of machining, the drill is moved in a Z-axis direction to cut into a printed wiring board as soon as the obtained stabilization time has passed.Type: ApplicationFiled: October 7, 2003Publication date: July 8, 2004Applicant: Hitachi Via Mechanics Ltd.Inventors: Kazuo Watanabe, Takahiko Yamashita, Yasushi Ito, Katsuhiro Nagasawa
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Patent number: 6623219Abstract: Nuts 22, 23 are engaged with one ball screw 10, and the nut 22 is directly fixed on a slider main body 7s. The nut 23 is rotatably held by a bearing 25, and a bearing holder 24 holding the bearing 25 is fixed on a slider main body 7t. And, a gear 26 is fixed on the side of the nut 23, and a gear 29 engaging with the gear 26 is provided. And, a motor 28 for driving a gear 29 is fixed on a bracket 27, being united with the slider main body 7t. The ball screw 10 is stopped and the motor 28 is rotated so as to individually position the slider 7b. Even if the number of the sliders is increased, a machine is not made bigger, and the printed board processing machine having simple structure can be provided.Type: GrantFiled: January 11, 2001Date of Patent: September 23, 2003Assignee: Hitachi Via Mechanics, Ltd.Inventors: Katsuhiro Nagasawa, Tamio Otani, Akira Irie
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Publication number: 20010019686Abstract: Nuts 22, 23 are engaged with one ball screw 10, and the nut 22 is directly fixed on a slider main body 7s. The nut 23 is rotatably held by a bearing 25, and a bearing holder 24 holding the bearing 25 is fixed on a slider main body 7t. And, a gear 26 is fixed on the side of the nut 23, and a gear 29 engaging with the gear 26 is provided. And, a motor 28 for driving a gear 29 is fixed on a bracket 27, being united with the slider main body 7t. The ball screw 10 is stopped and the motor 28 is rotated so as to individually position the slider 7b. Even if the number of the sliders is increased, a machine is not made bigger, and the printed board processing machine having simple structure can be provided.Type: ApplicationFiled: January 11, 2001Publication date: September 6, 2001Inventors: Katsuhiro Nagasawa, Tamio Otani, Akira Irie