Abstract: Provided are a filling component useful for the production of a thin, low-profile three-dimensional integrated semiconductor device via a COW process, and a curable composition for the formation of the filling component. The filling component according to the present invention for three-dimensional mounting of semiconductor elements is used to fill gaps between laterally adjacent semiconductor elements in the production of a three-dimensional integrated semiconductor device by stacking and integrating semiconductor elements. The filling component is a component that is polished and/or ground flat from the front side of semiconductor elements while gaps between the semiconductor elements are filled with the filling component.

Abstract: Provided is a sheet-shaped mold possessing a high strength and having a low breakage rate in demolding even in a case where the mold is thin and has a large-area. The sheet-shaped mold is prepared by combining a cured silicone rubber containing a polyorganosiloxane and a fiber for reinforcing the cured silicone rubber. The fiber may comprise a cellulose nanofiber. The sheet-shaped mold may have an uneven pattern on at least one surface (or side) thereof. The fiber may be surface-treated with a hydrophobizing agent. The fiber may forma nonwoven fabric, and the nonwoven fabric may be impregnated with the cured silicone rubber. The cured silicone rubber may comprise a two-component curable silicone rubber having a polydimethylsiloxane unit. The sheet-shaped mold may be a mold for nanoimprint lithography using a photo-curable resin.

Abstract: Provided is an adhesive composition for multilayer semiconductors. The adhesive composition gives, when applied and dried by heating, an adhesive layer that has approximately no adhesiveness at a temperature lower than 50° C., but, when heated at such a temperature as to less cause damage to semiconductor chips, offers adhesiveness and is rapidly cured thereafter. This adhesive composition for multilayer semiconductors includes a polymerizable compound (A), at least one of a cationic-polymerization initiator (B1) and an anionic-polymerization initiator (B2), and a solvent (C). The polymerizable compound (A) contains 80% by weight or more of an epoxide having a softening point or melting point of 50° C. or higher. The cationic-polymerization initiator (B1) gives a composition having a thermal curing time of 3.5 minutes or longer at 130° C.

Abstract: Provided are a filling component useful for the production of a thin, low-profile three-dimensional integrated semiconductor device via a COW process, and a curable composition for the formation of the filling component. The filling component according to the present invention for three-dimensional mounting of semiconductor elements is used to fill gaps between laterally adjacent semiconductor elements in the production of a three-dimensional integrated semiconductor device by stacking and integrating semiconductor elements. The filling component is a component that is polished and/or ground flat from the front side of semiconductor elements while gaps between the semiconductor elements are filled with the filling component.

Abstract: Provided is an adhesive composition for multilayer semiconductors. The adhesive composition gives, when applied and dried by heating, an adhesive layer that has approximately no adhesiveness at a temperature lower than 50° C., but, when heated at such a temperature as to less cause damage to semiconductor chips, offers adhesiveness and is rapidly cured thereafter. This adhesive composition for multilayer semiconductors includes a polymerizable compound (A), at least one of a cationic-polymerization initiator (B1) and an anionic-polymerization initiator (B2), and a solvent (C). The polymerizable compound (A) contains 80% by weight or more of an epoxide having a softening point or melting point of 50° C. or higher. The cationic-polymerization initiator (B1) gives a composition having a thermal curing time of 3.5 minutes or longer at 130° C.

Abstract: Provided is a sheet-shaped mold possessing a high strength and having a low breakage rate in demolding even in a case where the mold is thin and has a large-area. The sheet-shaped mold is prepared by combining a cured silicone rubber containing a polyorganosiloxane and a fiber for reinforcing the cured silicone rubber. The fiber may comprise a cellulose nanofiber. The sheet-shaped mold may have an uneven pattern on at least one surface (or side) thereof. The fiber may be surface-treated with a hydrophobizing agent. The fiber may forma nonwoven fabric, and the nonwoven fabric may be impregnated with the cured silicone rubber. The cured silicone rubber may comprise a two-component curable silicone rubber having a polydimethylsiloxane unit. The sheet-shaped mold may be a mold for nanoimprint lithography using a photo-curable resin.