Patents by Inventor Katsuhiro Nakazato

Katsuhiro Nakazato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220325061
    Abstract: The present invention aims to provide a foam that is less likely to deflate even after prolonged or repeated load application, has low density, and has good appearance quality, and a method for producing the foam. Provided is a foam including cells dispersed in an elastomer resin, the foam having a thickness of 300 ?m or greater, the foam having a surface layer that is a portion from a surface to a depth of 100 ?m and a center portion that is a portion other than the surface layer, the cells in the surface layer having an average circularity of 0.980 or greater, the cells in the center portion having an average circularity of 0.990 or greater, the cells having an average diameter of 70 ?m or greater.
    Type: Application
    Filed: September 7, 2020
    Publication date: October 13, 2022
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Yasuhiro KAWAGUCHI, Yusaku UCHIYAMA, Takehisa SUGAYA, Katsuhiro NAKAZATO
  • Publication number: 20220325062
    Abstract: The present invention aims to provide a foam that is less likely to deflate even after prolonged or repeated load application, has low density, and has good appearance quality, and a method for producing the foam. Provided is a foam including cells dispersed in an elastomer resin, the cells having an average diameter of 40 to 60 ?m and an average circularity of 0.990 or greater.
    Type: Application
    Filed: September 7, 2020
    Publication date: October 13, 2022
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Yasuhiro KAWAGUCHI, Yusaku UCHIYAMA, Takehisa SUGAYA, Katsuhiro NAKAZATO
  • Publication number: 20140345886
    Abstract: A thermally expandable multilayer packing for building material, having protruding parts and a body portion in the cross-sectional shape based a plane perpendicular to the longitudinal direction. The thermally expandable multilayer packing includes both a thermally expandable resin composition layer and a thermoplastic resin composition layer, wherein the thermally expandable resin composition forming the thermally expandable resin composition layer contains 100 parts by weight of a resin component containing a chlorinated polyvinyl chloride resin and/or an EPDM, 3 to 300 parts by weight of a thermally expandable graphite, 3 to 200 parts by weight of an inorganic filler and 20 to 200 parts by weight of a plasticizer. The thermally expandable resin composition layer and the thermoplastic resin composition layer are formed by simultaneous co-extrusion using the thermally expandable resin composition and the thermoplastic resin composition.
    Type: Application
    Filed: November 29, 2012
    Publication date: November 27, 2014
    Applicants: SEKISUI CHEMICAL CO., LTD., SEKISUI CHEMICAL HOKKAIDO CO., LTD., TOKUYAMA SEKISUI CO., LTD.
    Inventors: Hideaki Yano, Kenji Otsuka, Masaki Tono, Katsuhiro Nakazato, Ryota Yamasugi, Kenichi Matsumura
  • Publication number: 20140336321
    Abstract: A chlorinated vinyl chloride resin composition for extrusion molding, characterized by: containing 100 parts by weight of a chlorinated vinyl chloride resin, 3 to 300 parts by weight of a thermally expandable graphite, 3 to 200 parts by weight of an inorganic filler and 20 to 200 parts by weight of a plasticizer; and containing no phosphorus compound (excluding phosphate plasticizer). A chlorinated vinyl chloride resin having a chlorine content of 60 to 72% by weight can be used as the resin component for extrusion molding.
    Type: Application
    Filed: November 29, 2012
    Publication date: November 13, 2014
    Applicants: SEKISUI CHEMICAL CO., LTD., TOKUYAMA SEKISUI CO., LTD.
    Inventors: Ryota Yamasugi, Katsuhiro Nakazato, Hideaki Yano, Kenji Otsuka, Masaki Tono