Abstract: A solid electrolytic capacitor includes at least one capacitor element including an anode part and a cathode part, an anode lead terminal, a cathode lead terminal, and an exterior body that covers the least one capacitor element. Each of the anode lead terminal and the cathode lead terminal includes an embedded part embedded in the exterior body. The embedded part of the anode lead terminal has a first contact surface in contact with the exterior body, and the embedded part of the cathode lead terminal has a second contact surface in contact with the exterior body. At least one contact surface selected from the group consisting of the first contact surface and the second contact surface includes a rough surface having a developed area ratio of an interface of more than or equal to 0.4.

Abstract: A solid electrolytic capacitor includes an element stack, an anode terminal, a cathode terminal, and an exterior member. The element stack includes a plurality of capacitor elements stacked on each other, and a conductive material interposed between two adjacent capacitor elements in the plurality of capacitor elements. Each of the plurality of capacitor elements includes an anode part and a cathode part, and the conductive material is disposed on the cathode part. The anode terminal is connected to the anode part. The cathode terminal is connected to the cathode part via a conductive paste. The cathode terminal has a facing surface facing a tip end of the element stack with a gap interposed between the facing surface and the tip end, and at least a part of the gap is filled with a sealing material.

Abstract: A crystal unit is provided with a rectangular substrate, a frame which is provided on an upper surface of the substrate, a mounting frame which has joining pads which are provided along the outer circumferential edge of the upper surface and which is provided on the lower surface of the substrate by joining joining terminals provided along the outer circumferential edge of the lower surface of the substrate and its joining pads, a crystal element which is mounted on electrode pads which are provided on the upper surface of the substrate in a region surrounded by the frame, a thermosensitive element which is mounted on connection pads which are provided on the lower surface of the substrate in a region surrounded by the mounting frame, and a lid which is joined to the upper surface of the frame.

Abstract: An electronic device and a glass sealing method used therefor, with which a sufficient joint strength can be acquired only with the use of a glass sealing material without using an activated brazing material is provided. A crystal device includes an element loading member, lid member, a crystal vibration element, and a glass sealing material. The glass sealing material is provided in a ring-like form between the fringe of the lid member on a main surface side and the fringe of the element loading member on a main surface side, and keeps a space in vacuum.

Abstract: The crystal device has a rectangular substrate, a frame which is provided along the outer circumferential edge of the upper surface of the substrate, an electrode pad which is provided on the upper surface of the substrate, a wiring pattern which is electrically connected to the electrode pad and is provided on the upper surface of the substrate, a crystal element which is mounted on the electrode pad, and a lid for air-tight sealing the crystal element. The thickness of the electrode pad in the vertical direction differs from the thickness of the wiring pattern in the vertical direction.

Abstract: The crystal device has a rectangular substrate, a frame which is provided along the outer circumferential edge of the upper surface of the substrate, an electrode pad which is provided on the upper surface of the substrate, a wiring pattern which is electrically connected to the electrode pad and is provided on the upper surface of the substrate, a crystal element which is mounted on the electrode pad, and a lid for air-tight sealing the crystal element. The thickness of the electrode pad in the vertical direction differs from the thickness of the wiring pattern in the vertical direction.

Abstract: A crystal unit is provided with a rectangular substrate, a frame which is provided on an upper surface of the substrate, a mounting frame which has joining pads which are provided along the outer circumferential edge of the upper surface and which is provided on the lower surface of the substrate by joining terminals provided along the outer circumferential edge of the lower surface of the substrate and its joining pads, a crystal element which is mounted on electrode pads which are provided on the upper surface of the substrate in a region surrounded by the frame, a thermosensitivel element which is mounted on connection pads which are provided on the lower surface of the substrate in a region surrounded by the mounting frame, and a lid which is joined to the upper surface of the frame.

Abstract: An electronic device and a glass sealing method used therefor, with which a sufficient joint strength can be acquired only with the use of a glass sealing material without using an activated brazing material is provided. A crystal device includes an element loading member, lid member, a crystal vibration element, and a glass sealing material. The glass sealing material is provided in a ring-like form between the fringe of the lid member on a main surface side and the fringe of the element loading member on a main surface side, and keeps a space in vacuum.