Abstract: There is provided an IC socket capable of reducing inductance of contacts corresponding to a power supply pin and a ground pin of an IC, of increasing the level of impedance matching and of enabling the measurement of a high frequency IC. Contacts each formed of a single kind and comprising three contact portions and one curved portion are arranged in a straight line along grooves of an IC socket and the contacts are connected to a measuring circuit board which is inserted into the grooves of the IC socket through the three contact portions regardless of the curved portion.