Patents by Inventor Katsuhiro Otsuka

Katsuhiro Otsuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120238686
    Abstract: The present invention relates to a thermoplastic resin composition which comprises 100 parts by weight of a polyamide resin (component A) and 1 to 400 parts by weight of a granular inorganic filler (component B) comprising an inorganic filler having an average particle diameter of 0.01 to 100 ?m and a water-soluble polyester resin binder, and having a bulk density of 0.4 to 1.5 g/mL; and a resin molded article obtained by molding the thermoplastic resin composition. The thermoplastic resin composition is improved in various properties such as extrusion moldability, rigidity, impact resistance, thermal stability and hue, and exhibits an excellent balance between these properties.
    Type: Application
    Filed: April 11, 2012
    Publication date: September 20, 2012
    Applicants: MATSUMURA SANGYO CO., LTD., MITSUBISHI ENGINEERING-PLASTIC CORPORATION
    Inventors: Makoto NAKAMURA, Hiroshi Nakano, Katsuhiro Otsuka, Kazutoyo Matsumura
  • Patent number: 8178608
    Abstract: The present invention relates to a thermoplastic resin composition which comprises 100 parts by weight of a thermoplastic resin (component A) and 1 to 400 parts by weight of a granular inorganic filler (component B) comprising an inorganic filler having an average particle diameter of 0.01 to 100 ?m and a water-soluble polyester resin binder, and having a bulk density of 0.4 to 1.5 g/mL; and a resin molded article obtained by molding the thermoplastic resin composition. The thermoplastic resin composition is improved in various properties such as extrusion moldability, rigidity, impact resistance, thermal stability and hue, and exhibits an excellent balance between these properties.
    Type: Grant
    Filed: April 3, 2007
    Date of Patent: May 15, 2012
    Assignees: Mitsubishi Engineering-Plastics Corporation, Matsumura Sangyo Co., Ltd.
    Inventors: Makoto Nakamura, Hiroshi Nakano, Katsuhiro Otsuka, Kazutoyo Matsumura
  • Publication number: 20100010141
    Abstract: The present invention relates to a thermoplastic resin composition which comprises 100 parts by weight of a thermoplastic resin (component A) and 1 to 400 parts by weight of a granular inorganic filler (component B) comprising an inorganic filler having an average particle diameter of 0.01 to 100 ?m and a water-soluble polyester resin binder, and having a bulk density of 0.4 to 1.5 g/mL; and a resin molded article obtained by molding the thermoplastic resin composition. The thermoplastic resin composition is improved in various properties such as extrusion moldability, rigidity, impact resistance, thermal stability and hue, and exhibits an excellent balance between these properties.
    Type: Application
    Filed: April 3, 2007
    Publication date: January 14, 2010
    Inventors: Makoto Nakamura, Hiroshi Nakano, Katsuhiro Otsuka, Kazutoyo Matsumura
  • Publication number: 20060211457
    Abstract: In a portable terminal, the hinge portion (3) includes an intermediate case (31) having a plate-like shape, a first hinge (32) for rotatably coupling the vicinity of one end of a lower case (1) with the vicinity of one end of the intermediate case (31) about a first axis, and a second hinge (33) for rotatably coupling an upper case (2) with the intermediate case (31) about a second axis parallel to the first axis. The second hinge (33) couples the other end of the intermediate case (31) with the rear surface of the upper case (2).
    Type: Application
    Filed: December 1, 2005
    Publication date: September 21, 2006
    Inventor: Katsuhiro Otsuka
  • Publication number: 20040116578
    Abstract: Provided are a granular inorganic filler which is highly effective in improving the physical properties of resins and excellent in working efficiency, working atmosphere, productivity and economical efficiency, a process for producing the filler, and resin compositions excellent in mechanical properties, surface appearance, flame retardance and antiblock properties. The filler is produced by granulating a mixture comprising inorganic filler particles having a mean particle diameter of 0.01 to 20 &mgr;m and a binder in such a way as to give an apparent density of 0.1 to 3.0 g/ml and a breakage rate of 5 to 80 wt %. The resin compositions are prepared by adding the granular inorganic filler to resins.
    Type: Application
    Filed: December 16, 2003
    Publication date: June 17, 2004
    Inventors: Yasutaka Imanishi, Tateki Arakawa, Junichi Kawashima, Mikio Miyaji, Kazutoyo Matsumura, Tsuyoshi Hamaie, Ryohei Watanabe, Katsuhiro Otsuka
  • Patent number: 6576695
    Abstract: A thermoplastic resin composition having an excellent thermal aging resistance, particularly when used in moldings is provided which contains (1) a thermoplastic resin and (2) at least one of a polyglycerin derivative in which at least one hydroxyl group is esterified with a fatty acid, an N-acyl basic amino acid and a dibasic acid erythritol ester, and wherein i) if the polyglycerin derivative is used, the composition contains an antioxidant, or an antioxidant and a filler; ii) if the N-acyl basic amino acid is used, the composition contains a filler; and the thermoplastic resin contains at least one of a polyolefin resin, a polystyrene resin, a polyester resin, a polyamide resin and an engineering plastic; and iii) if the dibasic acid erythritol ester is used, the composition contains a filler, and the thermoplastic resin contains at least one of a polyolefin resin, a polystyrene resin, a polyester resin, a polyamide resin or an engineering plastic; and the amount of the dibasic acid erythritol ester is
    Type: Grant
    Filed: May 8, 2000
    Date of Patent: June 10, 2003
    Assignee: Ajinomoto Co., Inc.
    Inventors: Hiroyuki Tanaka, Naoki Yasuda, Katsuhiro Otsuka, Ryohei Watanabe
  • Patent number: 6563923
    Abstract: A portable telephone having a ten-key pad that allows input of a plurality of kinds of characters is disclosed. Each of the keys of the ten-key pad has a plurality of contact points having a corresponding position with respect to the key, at least one of the contact points being selected depending on which position of the key is pressed, another position of the key being determined by pressing all of the contact points simultaneously. Each key preferably has five positions. A table correlates each position of the key and an individual character of a selected type of characters. Input of an individual character depends on a pressed position of the key correlated by the table to a pressed key of the ten-key pad.
    Type: Grant
    Filed: November 24, 1999
    Date of Patent: May 13, 2003
    Assignee: NEC Corporation
    Inventor: Katsuhiro Otsuka
  • Publication number: 20030063739
    Abstract: A portable telephone having a ten-key pad that allows input of a plurality of kinds of characters is disclosed. Each of keys of the ten-key pad has a plurality of contact points, at least one of which is selected depending on which position of the key is pressed. A table is provided for each of the kinds of characters. The table contains correspondence between each position of the key and an individual character of a selected type of characters. Input of an individual character of the selected type of characters is controlled depending on a pressed position of the key by referring to the table such that an individual character of the selected type of characters is determined depending on a combination of a pressed key of the ten-key pad and a pressed position of the pressed key. Each key of the ten-key pad preferably has five positions, one of which selecting all the contact points of the key.
    Type: Application
    Filed: November 24, 1999
    Publication date: April 3, 2003
    Inventor: KATSUHIRO OTSUKA