Abstract: A package is provided for achieving higher packing density and higher circuit integration of memories, in particular, a structure is provided having a plurality of thin, surface mount packages which are stacked up. Each of the laminated packages includes a semiconductor pellet, leads fixed to the front surface of the pellet, a radiating plate fixed to the rear surface of the same, and a resin mold member. To achieve a stabilized laminated structure, the mold member is shaped into a convex form on the front side of the pellet and into a concave form on the rear side of the same, so that the concave portion of one package can engage with the convex portion of another package.

Abstract: A process for producing a laminate-shaped zirconia refractory heating element which generates heat by passing a current therethrough or by induction heating including the steps of incorporating a flexible binder in a filler composed of zirconia fibers and stabilized zirconia powder, forming the mixture into a refractory sheet having flexibility at room temperature, laminating the refractory sheet to form a multi-layer and firing the laminate.

Abstract: The present invention provides a zirconia fiber-based or zirconia fiber-reinforced zirconia heating element which can be used in an oxidizing atmosphere at an elevated temperature.

Abstract: A manufacturing apparatus has a clean air supply means provided integrally with a part thereof for supplying clean air toward at least an area in which a workpiece exists, and an air discharge means disposed so as to face the clean air supply means across the workpiece and adapted to discharge the air to the outside of the apparatus. It is therefore possible for clean air to be constantly supplied to the workpiece area under positive pressure. Thus, there is no risk of dust generated not only inside but also outside the apparatus being moved to the vicinity of the workpiece. Accordingly, it is possible to prevent adhesion of dust to the surface of the workpiece by the apparatus alone and also possible to install the apparatus as desired.

Abstract: A manufacturing apparatus has a clean air supply means provided integrally with a part thereof for supplying clean air toward at least an area in which a workpiece exists, and an air discharge means disposed so as to face the clean air supply means across the workpiece and adapted to discharge the air to the outside of the apparatus. It is therefore possible for clean air to be constantly supplied to the workpiece area under positive pressure. Thus, there is no risk of dust generated not only inside but also outside the apparatus being moved to the vicinity of the workpiece. Accordingly, it is possible to prevent adhesion of dust to the surface of the workpiece by the apparatus alone and also possible to install the apparatus as desired.

Abstract: A mold assembly for resin sealing for use in the manufacture of a semiconductor device etc., includes a pair of upper and lower molds. Elastic deformation parts adapted to be deformed in the direction of compression of the upper and lower molds with an object to-be-sealed, held therebetween, are provided on at least one of a cavity block of the upper mold and a cavity block of the lower mold. Grooves are provided in the surface of the cavity block formed with the elastic deformation parts.