Abstract: A die bonding apparatus having a bonding tool which, upon mounting a chip on a substrate, adsorbs and holds the chip, and transports the chip to a die bonding position, and bonds the chip onto a surface of the substrate. The bonding tool includes a bonding head, a motor, a load cell, and a controller. The bonding head adsorbs and holds a chip at its end, and applies bonding load to the chip from above. The motor drives said bonding head to move downward such that said bonding head applies bonding load to the chip. The load cell senses said bonding load applied to the chip. The controller sequentially calculates a command voltage output to said motor taking account of said bonding load fed back from said load cell, and speed-controls said motor load such that the output voltage to said motor gradually decreases in response to increment of said bonding.