Abstract: A work vehicle includes a vehicle body frame. A cockpit section or platform is arranged at a front section of the vehicle. A carrier bed is provided at a rear section of the vehicle. A ROPS includes a pair of left and right front supporting columns, a pair of left and right rear supporting columns, and a rearward overhanging frame extending rearward from upper part of the rear supporting columns.

Abstract: An ultrasound transducer element including a cell group constituted by a plurality of ultrasound transducer cells, wherein each of the plurality of ultrasound transducer cells includes a lower electrode arranged on a substrate, a membrane including an upper electrode arranged facing the lower electrode with a cavity positioned therebetween, and a plurality of pillars forming the cavity by supporting the membrane, and each cavity mutually communicates with one another.

Abstract: An ultrasound transducer according to the invention includes: a piezoelectric element; an electrode formed on a surface of the piezoelectric element; a conductive wire including a distal end that is in contact with the electrode; and a metal film formed by an electroplating method, the metal film coating at least the distal end of the wire and the electrode that are in contact with each other and thereby electrically connecting the electrode and the wire.

Abstract: A capacitive ultrasonic transducer (c-MUT) comprising a silicon substrate and a transducer element which comprises transducer cells, each of which is constituted by a first electrode equipped on the top surface of the silicon substrate, a second electrode placed opposite to the first electrode with a predetermined gap therefrom and a membrane for supporting the second electrode, wherein a trench is equipped between the adjacent transducers and a conductive film is formed in the trench.

Abstract: An ultrasound transducer element includes a plurality of electrostatic capacitance type ultrasound cells each having a lower electrode portion and a membrane including an upper electrode portion that are oriented and disposed via a cavity circular in plan view, and a thickness of the cavity monotonously decreases in a curved manner toward an outer circumferential portion from a center portion of the cavity.

Abstract: An ultrasound transducer array according to an embodiment includes a substrate, a plurality of groove-like recesses arranged at a predetermined interval on one surface of the substrate, a cell region arranged between the recesses on the one surface side of the substrate, a flexible film configured to cover the substrate and the cell region and having fragility lower than fragility of the substrate, and a dividing groove having a width smaller than a width of the recess and reaching from the other surface of the substrate to the flexible film in the recess.

Abstract: An ultrasonic transducer according to the invention includes a flexible sheet, a rigid body portion including a lower electrode made of at least a thin-film conductive material on a surface of the flexible sheet, a dividing portion which divides the rigid body portion into segments, and a plurality of transducer elements including the divided rigid body portion, has at least one transducer cell composed of one of the segments, an insulating partition portion bonded to the segment, an air gap portion surrounded by the partition portion, an upper electrode opposed to the lower electrode extending to the partition portion to sandwich the air gap portion therebetween, and an upper insulating layer formed on the upper electrode, and includes an upper protection film which continuously covers a surface portion of the transducer elements and the dividing portion.

Abstract: An ultrasound element includes a silicon substrate, a lower electrode layer that has a plurality of lower electrode sections, and a plurality of lower wiring sections, and is connected to a lower electrode terminal to which a drive signal and a bias signal are applied, a lower insulating layer, an upper insulating layer in which a plurality of cavities smaller than the respective lower electrode sections are formed, an upper electrode layer that has a plurality of upper electrode sections that are disposed to face the respective lower electrode sections via the respective cavities, and are smaller than the lower electrode sections and larger than the cavities, and a plurality of upper wiring sections, and is connected to an upper electrode terminal at a ground potential that detects a capacitance signal, and a protection layer.

Abstract: A US element includes a silicon substrate, wherein a lower electrode layer that has a plurality of lower electrode sections, and a plurality of lower wiring sections, and is connected to a lower electrode terminal to which a drive signal and a bias signal are applied, a lower insulating layer, an upper insulating layer in which a plurality of cavities are formed, an upper electrode layer that has a plurality of upper electrode sections and a plurality of upper wiring sections, and is connected to an upper electrode terminal at a ground potential for detecting a capacitance signal, and a protection layer are sequentially stacked on the silicon substrate, and the US element further includes a shield electrode section that is formed at least at an upper side of the lower wiring sections, and is connected to a shield electrode terminal at a ground potential.

Abstract: An ultrasound transducer array according to an embodiment includes a substrate, a plurality of groove-like recesses arranged at a predetermined interval on one surface of the substrate, a cell region arranged between the recesses on the one surface side of the substrate, a flexible film configured to cover the substrate and the cell region and having fragility lower than fragility of the substrate, and a dividing groove having a width smaller than a width of the recess and reaching from the other surface of the substrate to the flexible film in the recess.

Abstract: An ultrasound transducer includes a substrate and a lower electrode layer, a lower insulating layer, an upper insulating layer, and an upper electrode layer. The lower insulating layer and the upper insulating layer are arranged to be opposed to each other via an air gap section. The upper insulating layer and the lower insulating layer are different in a material and thickness and satisfy Equation 1 below. In Equation 1, K1 represents a relative dielectric constant of the lower insulating layer, K2 represents a relative dielectric constant of the upper insulating layer, T1 represents thickness of the lower insulating layer, T2 represents thickness of the upper insulating layer, ?1(x) represents a charge density distribution in the lower insulating layer, and ?2(y) represents a charge density distribution in the upper insulating layer.

Abstract: An ultrasound diagnostic apparatus includes: transmission and reception signal lines that send transmission and reception signals of ultrasound to a plurality of ultrasound transducers; signal determining portions near the ultrasound transducers and determine a selection signal for selecting an ultrasound transducer to be driven or a readout signal for reading out the selection signal, the selection signal being sent out in synchronization with a transmission signal for forming the transmission and reception signal, and couple the ultrasound transducer to be driven with the transmission and reception signal line according to a result of the determination; and direct current blocking/clipping circuits that block a direct current bias component superimposed on the transmission and reception signal and sent via the transmission and reception signal line, and clip a waveform with large amplitude.

Abstract: It becomes possible to obtain high sound pressure in a high frequency domain by a capacitive ultrasonic transducer which comprises a membrane on which one electrode is formed, a cavity constructed in its backface, and a substrate on which these are mounted and supported and on whose surface an electrode is provided, on a surface in an ultrasonic transmission and reception side, characterized in that the membrane comprises tow or more layers, and at least one layer of them comprises a high dielectric constant film.

Abstract: An ultrasonic transducer fabrication method including: depositing a conductive material on an insulating layer, partially etching the conductive material to form lower electrodes; depositing an insulating material to cover the lower electrodes to form a first insulating layer and depositing a sacrificial material thereon, performing etching, to create cavities and a channel-shaped sacrificial layer to communicate the cavities; depositing an insulating material on the first insulating layer to form a second insulating layer; partially etching the second insulating layer to form holes; etching and removing the sacrificial layer through the holes to form the cavities and channels; depositing a conductive material on the second insulating layer to plug the holes and form a conductive film; partially etching the conductive film to form upper electrodes and sealing portions which plug the holes; and forming a protective film on the second insulating layer to cover the upper electrodes and the sealing portions.

Abstract: An ultrasound transducer includes a substrate and a lower electrode layer, a lower insulating layer, an upper insulating layer, and an upper electrode layer. The lower insulating layer and the upper insulating layer are arranged to be opposed to each other via an air gap section. The upper insulating layer and the lower insulating layer are different in a material and thickness and satisfy Equation 1 below. In Equation 1, K1 represents a relative dielectric constant of the lower insulating layer, K2 represents a relative dielectric constant of the upper insulating layer, T1 represents thickness of the lower insulating layer, T2 represents thickness of the upper insulating layer, ?1(x) represents a charge density distribution in the lower insulating layer, and ?2(y) represents a charge density distribution in the upper insulating layer.

Abstract: A capacitive micromachined ultrasonic transducer (cMUT) device, comprising: a cMUT formed on a semiconductor substrate; a DC high-voltage generation unit that is provided on the semiconductor substrate and that is for generating a DC high-voltage signal to be superposed on a driving signal for the cMUT; a driving signal generation unit that is provided on the semiconductor substrate and that is for generating the driving signal; and a superposition unit that is provided on the semiconductor substrate and that is for branching the DC high-voltage signal output from the DC high-voltage generation unit and for superposing one of the branched DC high-voltage signals on the other of the branched DC high-voltage signals via the driving signal generation unit.

Abstract: An ultrasound endoscope has an ultrasound probe which is disposed at a distal end side of a distal end rigid portion configuring a distal end portion out of a flexible tube portion, a bending portion and the distal end rigid portion configuring an insertion portion, and forms an ultrasound scanning surface having a normal line in a direction orthogonal to an endoscope insertion axis L1, and a treatment instrument outlet of a treatment hole in the distal end rigid portion. The ultrasound probe is configured by a plurality of ultrasound transducers arranged in a convex circular arc shape, and a center of curvature of the plurality of ultrasound transducers is disposed at a proximal end side from the treatment instrument outlet.

Abstract: An ultrasound diagnostic apparatus includes: transmission and reception signal lines that send transmission and reception signals of ultrasound to a plurality of ultrasound transducers; signal determining portions near the ultrasound transducers and determine a selection signal for selecting an ultrasound transducer to be driven or a readout signal for reading out the selection signal, the selection signal being sent out in synchronization with a transmission signal for forming the transmission and reception signal, and couple the ultrasound transducer to be driven with the transmission and reception signal line according to a result of the determination; and direct current blocking/clipping circuits that block a direct current bias component superimposed on the transmission and reception signal and sent via the transmission and reception signal line, and clip a waveform with large amplitude.

Abstract: A capacitive micromachined ultrasonic transducer (cMUT) device, includes: a cMUT obtained by processing a silicon substrate by using a silicon micromachining technique; and an oscillator circuit having the cMUT as a capacitor, and outputting a frequency modulation signal by modulating a frequency of an oscillation signal to be output on the basis of a change of capacitance of the cMUT.

Abstract: An electronic radial ultrasonic probe comprising an electronic radial array which comprises a plurality of ultrasonic transducers being continuously arrayed circularly around an insertion axis as center and also for which a transmission/reception of an ultrasonic wave is controlled by electronically selecting the plurality of ultrasonic transducer, comprises: a support member equipped on the electronic radial array; a lock member featured with a cavity in which the support member is inserted and with a lock groove for locking a balloon which is mounted in a manner to cover the electronic radial array and in which an ultrasonic medium is filled; and a filler member which is constituted by an adhesive material converting from a fluid state to a solid state, and is filled in the cavity.