Abstract: A semiconductor module includes an insulating substrate. A first and a second metal member are joined respectively to a side surface of the substrate. Each metal member has an opening formed therein. A first and a second conductive layer are on the upper surface of the substrate and spaced apart from each other. A first semiconductor chip is mounted on the first conductive layer. A first electrode of the first semiconductor chip is electrically connected to the first conductive layer, and a second electrode is electrically connected to the second conductive layer. A first terminal is electrically connected to the first conductive layer, and a second terminal is electrically connected to the second conductive layer. A sealing resin is disposed on the upper surface of the substrate to cover the first conductive layer, the second conductive layer, the first semiconductor chip, and portions of the first and second terminals.

Abstract: A semiconductor device includes a substrate having a first surface and a second surface. A semiconductor chip is disposed on the first surface of the substrate. A first metal pattern is disposed on a central portion of the second surface. A second metal pattern is disposed on the second surface and spaced from the first metal pattern. A thermal conducting material is affixed to the first and second metal patterns. The first metal pattern has no two outer edges that meet to form an angle that is 90° or less, and the second metal pattern is between the first metal pattern and an outer edge of the substrate.