Abstract: A driver IC and passive parts, which convert a direct current voltage into a three-phase voltage, and an FP coil for cyclically generating a magnetic field through the driver IC are mounted on a flexible substrate, which constitutes a small vibration motor. The driver IC is a so-called bare chip in which a circuit section is exposed and is not molded with resin and the like. Magnets and an unbalance weight are installed on a yoke having a shaft. The FP coil and the magnet are placed so as to face each other. A cover is caulked to fixed to a bottom plate. Thus, the vibration motor can be miniaturized and thinned. Moreover, the vibration motor can be automatically manufactured, and installing them to an electronic apparatus can be automatically performed.

Abstract: A driver IC and passive parts, which convert a direct current voltage into a three-phase voltage, and an FP coil for cyclically generating a magnetic field through the driver IC are mounted on a flexible substrate, which constitutes a small vibration motor. The driver IC is a so-called bare chip in which a circuit section is exposed and is not molded with resin and the like. Magnets and an unbalance weight are installed on a yoke having a shaft. The FP coil and the magnet are placed so as to face each other. A cover is caulked to fixed to a bottom plate. Thus, the vibration motor can be miniaturized and thinned. Moreover, the vibration motor can be automatically manufactured, and installing them to an electronic apparatus can be automatically performed.

Abstract: A driver IC and passive parts, which convert a direct current voltage into a three-phase voltage, and an FP coil for cyclically generating a magnetic field through the driver IC are mounted on a flexible substrate, which constitutes a small vibration motor. The driver IC is a so-called bare chip in which a circuit section is exposed and is not molded with resin and the like. Magnets and an unbalance weight are installed on a yoke having a shaft. The FP coil and the magnet are placed so as to face each other. A cover is caulked to fixed to a bottom plate. Thus, the vibration motor can be miniaturized and thinned. Moreover, the vibration motor can be automatically manufactured, and installing them to an electronic apparatus can be automatically performed.

Abstract: A driver IC and passive parts, which convert a direct current voltage into a three-phase voltage, and an FP coil for cyclically generating a magnetic field through the driver IC are mounted on a flexible substrate, which constitutes a small vibration motor. The driver IC is a so-called bare chip in which a circuit section is exposed and is not molded with resin and the like. Magnets and an unbalance weight are installed on a yoke having a shaft. The FP coil and the magnet are placed so as to face each other. A cover is caulked to fixed to a bottom plate. Thus, the vibration motor can be miniaturized and thinned. Moreover, the vibration motor can be automatically manufactured, and installing them to an electronic apparatus can be automatically performed.

Abstract: An semiconductor device and a method for manufacturing semiconductor devices which are easily made compact. A plurality of semiconductor chips having protrusion electrodes respectively provided on a plurality of electrodes formed on circuit surfaces are integrally sealed by an insulating material so as to cover the circuit surfaces while the circuit surfaces are nearly directed to the same direction and arranged in prescribed conditions, and to expose the respective protrusion electrodes; and insulating layers and wiring layers respectively electrically connected to the corresponding protrusion electrodes are alternately laminated on the insulating material so as to have the desired number of layers in the direction of thickness.