Abstract: In this power semiconductor module, a first lead frame and a second lead frame through which currents flow in opposite directions are arranged so as to overlap each other, whereby the internal inductance can be reduced. In a direction perpendicular to one main surface of a first metal wiring layer, each of the first lead frame and the second lead frame is provided so as not to overlap parts of end surfaces of the first metal wiring layer and a second metal wiring layer. Thus, in a manufacturing process for the power semiconductor module before sealing with sealing resin, it is possible to easily perform positioning between the lead frames and between the metal wiring layer and the lead frame, using the end surfaces, whereby the manufacturing process can be simplified.

Abstract: The semiconductor device includes: a heat spreader; a plurality of semiconductor elements; and one or a plurality of temperature detection elements. If a line segment connecting centers of two respective adjacent ones of the semiconductor elements is defined as X, a straight line that passes through one of the centers of the two adjacent semiconductor elements and that is perpendicular to X and parallel to the one-side surface of the heat spreader is defined as Y1, and a straight line that passes through another one of the centers of the two adjacent semiconductor elements and that is perpendicular to X and parallel to the one-side surface of the heat spreader is defined as Y2, at least a part of the temperature detection element is located in an arrangement region interposed between Y1 and Y2, as seen in a direction perpendicular to the one-side surface of the heat spreader.

Abstract: In a power conversion device, a casing main body has a component mounting surface, on which electrical components are mounted, and a refrigerant flow passage surface, which is a back side of the component mounting surface. The refrigerant flow passage surface has a refrigerant flow passage groove. The component mounting surface has a first facing portion, which faces a lid, a second facing portion, which is adjacent to the first facing portion, and faces the lid farther away from the lid than the first facing portion, and aside surface portion, which is formed between the first facing portion and the second facing portion. The refrigerant flow passage groove has a first flow passage portion located on back sides of the first facing portion and the side surface portion, and a second flow passage portion located on a back side of the second facing portion.

Abstract: In a power conversion device, a casing main body has a component mounting surface, on which electrical components are mounted, and a refrigerant flow passage surface, which is a back side of the component mounting surface. The refrigerant flow passage surface has a refrigerant flow passage groove. The component mounting surface has a first facing portion, which faces a lid, a second facing portion, which is adjacent to the first facing portion, and faces the lid farther away from the lid than the first facing portion, and aside surface portion, which is formed between the first facing portion and the second facing portion. The refrigerant flow passage groove has a first flow passage portion located on back sides of the first facing portion and the side surface portion, and a second flow passage portion located on a back side of the second facing portion.

Abstract: A cooling apparatus has: an opening formed in a cooling plate for cooling an electronic component; and an electronic component accommodating section formed in the opening. A cooling pipeline is disposed in a manner to surround an outer side surface section of the electronic component accommodating section, whereby the electronic component and the cooling pipeline are arranged at substantially the same height as a top of the cooling plate to realize a low profile. In addition, the electronic component accommodating section, which is joined to the cooling plate, is configured that a side surface section thereof is in contact with a side surface section of the electronic component via a potting material. In this way, an area that contributes to heat radiation is increased.

Abstract: An in-vehicle power conversion system, which can shield a circuit unit without using a particular shield member and can achieve reduction in cost and size, is obtained. Included are: a conductive housing having an opening; and a multilayer printed wiring board in which circuit units are mounted and one layer is a GND plane. The multilayer printed wiring board is assembled to an opening surface of an opening of the conductive housing to form a closed space; and the GND plane of the multilayer printed wiring board is electrically connected to the conductive housing to shield the circuit units stored in the closed space surrounded by the conductive housing and the multilayer printed wiring board.

Abstract: A power converter includes: a first metal member; a second metal member to be connected to the first metal member to form a space in which a coolant flows; and a heating electric component main body to be housed in a concave portion formed on the first metal member so as to project into interior of the space.

Abstract: A cooling apparatus has: an opening formed in a cooling plate for cooling an electronic component; and an electronic component accommodating section formed in the opening. A cooling pipeline is disposed in a manner to surround an outer side surface section of the electronic component accommodating section, whereby the electronic component and the cooling pipeline are arranged at substantially the same height as a top of the cooling plate to realize a low profile. In addition, the electronic component accommodating section, which is joined to the cooling plate, is configured that a side surface section thereof is in contact with a side surface section of the electronic component via a potting material. In this way, an area that contributes to heat radiation is increased.

Abstract: In a coaxially-fed slot array antenna including a coaxial line unit configured with a coaxial inner conductor and a coaxial outer conductor that incorporates the coaxial inner conductor; a feeding waveguide for feeding an electromagnetic wave to the coaxial line unit by way of a feeding slot; and a sub-array configured, corresponding to the coaxial line unit, with a plurality of emission slots formed on the external wall surface of the coaxial outer conductor, the space enclosed by the coaxial inner conductor and the coaxial outer conductor is filled with a foamed dielectric having a predetermined foaming rate. As a result, provision is made for a coaxially-fed slot array antenna that can enhance the flexibility in arranging the emission slots, change the width and the gradient of the main beam, and suppress a grating lobe.

Abstract: Provided is a semiconductor device capable of improving heat-radiating performance of a heating element. The semiconductor device of the present invention includes: a heating element (1); a heat-radiating member (2) including an element contact portion (2a) which is held surface contact with a mounting surface (1e); a first pressing member (3) and a second pressing member (4) held in contact with the heating element (1); and a fixation screw (6) for fixing the first pressing member (3) to the heat-radiating member (2) through a through hole (3c) formed through the first pressing member (3). The first pressing member (3) and the second pressing member (4) each include an inclined surface formed so that a component force of an axial force of a tightening force of the fixation screw (6) is generated in a vertical direction with respect to the mounting surface (1e).

Abstract: A power converter includes: a first metal member; a second metal member to be connected to the first metal member to form a space in which a coolant flows; and a heating electric component main body to be housed in a concave portion formed on the first metal member so as to project into interior of the space.

Abstract: An in-vehicle power conversion system, which can shield a circuit unit without using a particular shield member and can achieve reduction in cost and size, is obtained. Included are: a conductive housing having an opening; and a multilayer printed wiring board in which circuit units are mounted and one layer is a GND plane. The multilayer printed wiring board is assembled to an opening surface of an opening of the conductive housing to form a closed space; and the GND plane of the multilayer printed wiring board is electrically connected to the conductive housing to shield the circuit units stored in the closed space surrounded by the conductive housing and the multilayer printed wiring board.

Abstract: First to third lamination layers as an antenna component part and a resilient plate material are laminated on a base, and are caulked by caulking members arranged on the base, so as to generate a planar antenna. The resilient plate material formed of a resilient material has a curved shape prior to assembly. Upon assembly, end portions are pressed and the resilient plate material is resiliently deformed into a flat plate. Due to the resilient force, the first to the third lamination layer are pressed against the base, and are caulked and fixed by the caulking members. Since the first to the third lamination layers are pressed due to the resilient force of the resilient plate material, the number of parts can be reduced and easy manufacturing can be achieved.

Abstract: Provided is a semiconductor device capable of improving heat-radiating performance of a heating element. The semiconductor device of the present invention includes: a heating element (1); a heat-radiating member (2) including an element contact portion (2a) which is held surface contact with a mounting surface (1e); a first pressing member (3) and a second pressing member (4) held in contact with the heating element (1); and a fixation screw (6) for fixing the first pressing member (3) to the heat-radiating member (2) through a through hole (3c) formed through the first pressing member (3). The first pressing member (3) and the second pressing member (4) each include an inclined surface formed so that a component force of an axial force of a tightening force of the fixation screw (6) is generated in a vertical direction with respect to the mounting surface (1e).

Abstract: An antenna apparatus can reduce gaps between laminated plates with a simple structure, and can be produced at low cost and in a small size, while ensuring reliability over a long period of time. The apparatus includes a base having a base transmission line portion, a laminated body that is composed of laminated plates placed on the base and has laminated body transmission line portions in communication with the base transmission line portion, and an antenna main body placed on the laminated body for emitting or receiving electromagnetic waves, wherein the base, the laminated plates and the antenna element plate are coupled with one another through surface to surface contact. The antenna main body has a curved plate formed of an arc-shaped elastic member protruding toward the base in a state before assembly, and the curved plate has an elastic force contributing to the coupling through surface to surface contact.

Abstract: In a coaxially-fed slot array antenna including a coaxial line unit configured with a coaxial inner conductor and a coaxial outer conductor that incorporates the coaxial inner conductor; a feeding waveguide for feeding an electromagnetic wave to the coaxial line unit by way of a feeding slot; and a sub-array configured, corresponding to the coaxial line unit, with a plurality of emission slots formed on the external wall surface of the coaxial outer conductor, the space enclosed by the coaxial inner conductor and the coaxial outer conductor is filled with a foamed dielectric having a predetermined foaming rate. As a result, provision is made for a coaxially-fed slot array antenna that can enhance the flexibility in arranging the emission slots, change the width and the gradient of the main beam, and suppress a grating lobe.

Abstract: A waveguide structure including a first member, made of metal, in a surface portion of which a first groove having a linear shape is formed; and a second member, made of resin, in a surface portion of which a second groove having a linear shape is formed and to the surface of which metal plating is applied. The first member and the second member are arranged in such a way that the first groove and the second groove face each other so that a waveguide tube is configured. The first member in the surface portion of which the first groove is formed and the second member in the surface portion of which the second groove is formed are held in such a way that a gap exists between the respective surfaces thereof.

Abstract: First to third lamination layers as an antenna component part and a resilient plate material are laminated on a base, and are caulked by caulking members arranged on the base, so as to generate a planar antenna. The resilient plate material formed of a resilient material has a curved shape prior to assembly. Upon assembly, end portions are pressed and the resilient plate material is resiliently deformed into a flat plate. Due to the resilient force, the first to the third lamination layer are pressed against the base, and are caulked and fixed by the caulking members. Since the first to the third lamination layers are pressed due to the resilient force of the resilient plate material, the number of parts can be reduced and easy manufacturing can be achieved.

Abstract: There is provided a waveguide structure including a first member, made of metal, in a surface portion of which a first groove having a linear shape is formed; and a second member, made of resin, in a surface portion of which a second groove having a linear shape is formed and to the surface of which metal plating is applied. The first member and the second member are arranged in such a way that the first groove and the second groove face each other so that the waveguide as a waveguide tube is configured. The first member in the surface portion of which the first groove is formed and the second member in the surface portion of which the second groove is formed are held in such a way that a gap exists between the respective surfaces thereof. As a result, there can be obtained a waveguide structure that is superior in the heat radiation performance and is divided so that contact friction can be prevented from causing separation of the metal plating.

Abstract: An antenna apparatus can reduce gaps between laminated plates with a simple structure, and can be produced at low cost and in a small size, while ensuring reliability over a long period of time. The apparatus includes a base having a base transmission line portion, a laminated body that is composed of laminated plates placed on the base and has laminated body transmission line portions in communication with the base transmission line portion, and an antenna main body placed on the laminated body for emitting or receiving electromagnetic waves, wherein the base, the laminated plates and the antenna element plate are coupled with one another through surface to surface contact. The antenna main body has a curved plate formed of an arc-shaped elastic member protruding toward the base in a state before assembly, and the curved plate has an elastic force contributing to the coupling through surface to surface contact.