Patents by Inventor Katsuhisa Ogita

Katsuhisa Ogita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7364778
    Abstract: A container for an electronic component made of a resin, wherein when the container and an electronic component contained in the container are rubbed 20,000 times, a static electrification voltage of at most 2,000V by the absolute value on the surface of the electronic component is generated.
    Type: Grant
    Filed: June 24, 2002
    Date of Patent: April 29, 2008
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Takeshi Miyakawa, Tetsuo Fujimura, Katsuhisa Ogita
  • Patent number: 7261840
    Abstract: An electroconductive resin composition useful for packaging an electronic device, is provided, whereby a drawback that carbon black is likely to fall off from the surface of a molded product by abrasion, has been overcome. It is an electroconductive resin composition which comprises at least one thermoplastic resin selected from the group consisting of a polyphenylene ether resin, a polystyrenic resin and an ABS resin, and carbon black and which contains a styrene/butadiene/butylene/styrene block copolymer or a mixture of such a copolymer with an olefinic resin, and has a surface resistivity of from 102 to 1010 ?. Contamination of IC, etc., to be caused by falling off of carbon black, etc. by abrasion when contacted with IC, etc., can be substantially reduced.
    Type: Grant
    Filed: December 19, 2002
    Date of Patent: August 28, 2007
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Takeshi Miyakawa, Katsuhisa Ogita, Masafumi Hiura, Minoru Oda
  • Patent number: 7097900
    Abstract: In order to prevent static electricity impairment of an electronic component, a layer at the surface of a container to be in contact with an electronic component is one having a relatively high surface resistivity, a layer having a higher electrical conductivity than that is laminated below it, and the surface resistivity of the layer at the surface is higher than that of the layer below it. It is considered that in an electronic component packaging container having such a constitution, static electricity electrified on an electronic component is gradually discharged from the electronic component to the surface of the electronic component packaging container without sudden discharge, thus preventing the static electricity impairment. The surface layer preferably comprises a material close to the electronic component in the series of frictional electrification.
    Type: Grant
    Filed: June 14, 2002
    Date of Patent: August 29, 2006
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Minoru Oda, Katsuhisa Ogita, Takeshi Miyakawa, Tetsuo Fujimura, Mikio Shimizu
  • Publication number: 20050004303
    Abstract: An electroconductive resin composition useful for packaging an electronic device, is provided, whereby a drawback that carbon black is likely to fall off from the surface of a molded product by abrasion, has been overcome. It is an electroconductive resin composition which comprises at least one thermoplastic resin selected from the group consisting of a polyphenylene ether resin, a polystyrenic resin and an ABS resin, and carbon black and which contains a styrene/butadiene/butylene/styrene block copolymer or a mixture of such a copolymer with an olefinic resin, and has a surface resistivity of from 102 to 1010 ?. Contamination of IC, etc., to be caused by falling off of carbon black, etc. by abrasion when contacted with IC, etc., can be substantially reduced.
    Type: Application
    Filed: December 19, 2002
    Publication date: January 6, 2005
    Inventors: Takeshi Miyakawa, Katsuhisa Ogita, Masafumi Hiura, Minoru Oda
  • Publication number: 20040005465
    Abstract: In order to prevent static electricity impairment of an electronic component, a layer at the surface of a container to be in contact with an electronic component is one having a relatively high surface resistivity, a layer having a higher electrical conductivity than that is laminated below it, and the surface resistivity of the layer at the surface is higher than that of the layer below it. It is considered that in an electronic component packaging container having such a constitution, static electricity electrified on an electronic component is gradually discharged from the electronic component to the surface of the electronic component packaging container without sudden discharge, thus preventing the static electricity impairment. The surface layer preferably comprises a material close to the electronic component in the series of frictional electrification.
    Type: Application
    Filed: January 30, 2003
    Publication date: January 8, 2004
    Inventors: Minoru Oda, Katsuhisa Ogita, Takeshi Miyakawa, Tetsuo Fujimura, Mikio Shimizu
  • Publication number: 20030235041
    Abstract: A container for an electronic component made of a resin, wherein when the container and an electronic component contained in the container are rubbed 20,000 times, a static electrification voltage of at most 2,000V by the absolute value on the surface of the electronic component is generated.
    Type: Application
    Filed: June 24, 2002
    Publication date: December 25, 2003
    Applicant: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Takeshi Miyakawa, Tetsuo Fujimura, Katsuhisa Ogita