Patents by Inventor Katsuhisa Osako

Katsuhisa Osako has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7262511
    Abstract: The present invention provides a conductive adhesive agent capable of being diluted with a solvent to give good coating workability and allowing formation of a conductive joint excellent in both thermal conductivity and electrical conductivity by inhibiting a gas generated when a binder resin is heat-cured after attachment of a part. The conductive adhesive agent according to the present invention is a conductive adhesive agent wherein, based on 100 parts by weight of silver powder having an average particle diameter of micrometers, which is used for a conductive medium, e.g.
    Type: Grant
    Filed: August 18, 2005
    Date of Patent: August 28, 2007
    Assignees: Harima Chemicals, Inc., Toshiba Corporation
    Inventors: Katsuhisa Osako, Naoto Shioi, Daisuke Itoh, Hideyuki Gotoh, Yorishige Matsuba, Kazuki Tateyama, Yasunari Ukita, Masao Segawa, Takuo Kikuchi
  • Patent number: 7070829
    Abstract: To provide a method for producing a sensing film for gas sensors by sintering particles comprising a metal or a metal oxide on a substrate, where the sensing film for gas sensors having excellent sensor properties such as sensitivity and responsibility can be easily and simply formed. A nano-meter order particle (100), a dispersant (110) for preventing aggregation of the particles (100), and a scavenger (120) for trapping the dispersant (110) at the sintering are mixed in a solvent (130) to prepare a paste body (140), and this paste body (140) is coated on a base material and fired, thereby forming a sensing film.
    Type: Grant
    Filed: March 12, 2003
    Date of Patent: July 4, 2006
    Assignees: DENSO Corporation, Harima Chemicals, Inc., Ulvac, Inc.
    Inventors: Masashi Totokawa, Yorishige Matsuba, Yoshihisa Misawa, Hideyuki Gotoh, Katsuhisa Osako, Masaaki Oda, Norimichi Saito, Toshihiro Suzuki, Noriyuki Abe
  • Publication number: 20060038304
    Abstract: The present invention provides a conductive adhesive agent capable of being diluted with a solvent to give good coating workability and allowing formation of a conductive joint excellent in both thermal conductivity and electrical conductivity by inhibiting a gas generated when a binder resin is heat-cured after attachment of a part. The conductive adhesive agent according to the present invention is a conductive adhesive agent wherein, based on 100 parts by weight of silver powder having an average particle diameter of micrometers, which is used for a conductive medium, e.g.
    Type: Application
    Filed: August 18, 2005
    Publication date: February 23, 2006
    Applicants: HARIMA CHEMICALS, INC., TOSHIBA CORPORATION
    Inventors: Katsuhisa Osako, Naoto Shioi, Daisuke Itoh, Hideyuki Gotoh, Yorishige Matsuba, Kazuki Tateyama, Yasunari Ukita, Masao Segawa, Takuo Kikuchi
  • Publication number: 20030180446
    Abstract: To provide a method for producing a sensing film for gas sensors by sintering particles comprising a metal or a metal oxide on a substrate, where the sensing film for gas sensors having excellent sensor properties such as sensitivity and responsibility can be easily and simply formed. A nano-meter order particle (100), a dispersant (110) for preventing aggregation of the particles (100), and a scavenger (120) for trapping the dispersant (110) at the sintering are mixed in a solvent (130) to prepare a paste body (140), and this paste body (140) is coated on a base material and fired, thereby forming a sensing film.
    Type: Application
    Filed: March 12, 2003
    Publication date: September 25, 2003
    Inventors: Masashi Totokawa, Yorishige Matsuba, Yoshihisa Misawa, Hideyuki Gotoh, Katsuhisa Osako, Masaaki Oda, Norimichi Saito, Toshihiro Suzuki, Noriyuki Abe