Patents by Inventor Katsuhito Kamiya

Katsuhito Kamiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Epoxy resin composition, cured product obtained therefrom, curing method therefor, and bonding method using the composition
    Patent number: 5290883
    Abstract: An expoxy resin composition, an epoxy resin cured product obtained therefrom, and a bonding method using the composition are disclosed. The epoxy resin composition comprises an epoxy resin composition comprising (A) 100 parts by weight of an epoxy resin, (B) from 1 to 80 parts by weight of a heat activatable hardener, and (C) from 10 to 100 parts by weight of an aromatic thermoplastic resin powder having a glass transition temperature of 120.degree. C. or more and an average particle diameter of 200 .mu.m or less, said components (A), (B) and (C) being present in a phase separation state.
    Type: Grant
    Filed: October 7, 1992
    Date of Patent: March 1, 1994
    Assignee: Nitto Denko Corporation
    Inventors: Toshitsugu Hosokawa, Takeshi Yamanaka, Hiraku Yamamoto, Koichi Hashimoto, Akihisa Murata, Katsuhito Kamiya