Patents by Inventor Katsuhito Kikuma

Katsuhito Kikuma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-chip package and method of fabricating the same
    Publication number: 20060108677
    Abstract: A lower chip is fixed to a surface of an interposer by flip-chip bonding with an under fill acting as an adhesive applied to the surface. A lifted pad having a height of approximately 10 ?m is provided on the surface of the interposer. A bonding wire connects the lifted pad and a bonding pad provided on a surface of an upper chip. A stick-out portion of the under fill at the time of fixing the lower chip to the interposer is dammed by the lifted portion of the lifted pad. This prevents the stick-out portion of the under fill from covering the top of the lifted pad.
    Type: Application
    Filed: October 28, 2005
    Publication date: May 25, 2006
    Inventors: Mitsutaka Ikeda, Katsuhito Kikuma, Sachiko Nogami, Yuji Akashi
  • Semiconductor device having multiple semiconductor chips in a single package
    Patent number: 6818999
    Abstract: A semiconductor device of MCP structure, in which multiple semiconductor chips are provided in a single package and a method of manufacturing the same, that prevents damage of semiconductor chip that does not require burn-in and ensures the initial reliability of the semiconductor chip that requires the burn-in, are provided. The method has the steps of resin sealing and packaging the semiconductor chip that requires the burn-in and performing the burn-in to such packaged semiconductor chip; and mounting the semiconductor chip evaluated to be non-defective in the burn-in to the substrate along with the semiconductor chip not requiring the burn-in.
    Type: Grant
    Filed: January 10, 2003
    Date of Patent: November 16, 2004
    Assignee: Fujitsu Limited
    Inventors: Katsuhito Kikuma, Yuji Akashi, Takeshi Ikuta
  • Stacked semiconductor device and method of producing the same
    Patent number: 6777799
    Abstract: In a stacked semiconductor device which has a plurality of semiconductor chips of desired sizes stacked as one package, a first semiconductor chip is mounted on a flexible printed wiring board provided with external connecting terminals. A printed circuit board is placed and mounted on the first semiconductor chip by flip-chip bonding. A second semiconductor chip is secured onto the printed circuit board. The second semiconductor chip is connected to the flexible printed wiring board by wire bonding. The first semiconductor chip is connected to the flexible printed wiring board by wire bonding via the printed circuit board.
    Type: Grant
    Filed: July 22, 2003
    Date of Patent: August 17, 2004
    Assignee: Fujitsu Limited
    Inventors: Katsuhito Kikuma, Mitsutaka Ikeda, Yoshihiro Tsukidate, Yuji Akashi, Kaname Ozawa, Akira Takashima, Takao Nishimura
  • Stacked semiconductor device and method of producing the same
    Publication number: 20040051119
    Abstract: In a stacked semiconductor device which has a plurality of semiconductor chips of desired sizes stacked as one package, a first semiconductor chip is mounted on a flexible printed wiring board provided with external connecting terminals. A printed circuit board is placed and mounted on the first semiconductor chip by flip-chip bonding. A second semiconductor chip is secured onto the printed circuit board. The second semiconductor chip is connected to the flexible printed wiring board by wire bonding. The first semiconductor chip is connected to the flexible printed wiring board by wire bonding via the printed circuit board.
    Type: Application
    Filed: July 22, 2003
    Publication date: March 18, 2004
    Applicant: FUJITSU LIMITED
    Inventors: Katsuhito Kikuma, Mitsutaka Ikeda, Yoshihiro Tsukidate, Yuji Akashi, Kaname Ozawa, Akira Takashima, Takao Nishimura
  • Semiconductor device and method of manufacturing the same
    Publication number: 20030180988
    Abstract: A semiconductor device of MCP structure, in which multiple semiconductor chips are provided in a single package and a method of manufacturing the same, that prevents damage of semiconductor chip that does not require burn-in and ensures the initial reliability of the semiconductor chip that requires the burn-in, are provided. The method has the steps of resin sealing and packaging the semiconductor chip that requires the burn-in and performing the burn-in to such packaged semiconductor chip; and mounting the semiconductor chip evaluated to be non-defective in the burn-in to the substrate along with the semiconductor chip not requiring the burn-in.
    Type: Application
    Filed: January 10, 2003
    Publication date: September 25, 2003
    Inventors: Katsuhito Kikuma, Yuji Akashi, Takeshi Ikuta
  • Stacked semiconductor device and method of producing the same
    Patent number: 6621169
    Abstract: In a stacked semiconductor device which has a plurality of semiconductor chips of desired sizes stacked as one package, a first semiconductor chip is mounted on a flexible printed wiring board provided with external connecting terminals. A printed circuit board is placed and mounted on the first semiconductor chip by flip-chip bonding. A second semiconductor chip is secured onto the printed circuit board. The second semiconductor chip is connected to the flexible printed wiring board by wire bonding. The first semiconductor chip is connected to the flexible printed wiring board by wire bonding via the printed circuit board.
    Type: Grant
    Filed: August 29, 2001
    Date of Patent: September 16, 2003
    Assignee: Fujitsu Limited
    Inventors: Katsuhito Kikuma, Mitsutaka Ikeda, Yoshihiro Tsukidate, Yuji Akashi, Kaname Ozawa, Akira Takashima, Tadashi Uno, Takao Nishimura, Fumihiko Ando, Hiroshi Onodera, Hayato Okuda
  • Stacked semiconductor device and method of producing the same
    Publication number: 20020027295
    Abstract: In a stacked semiconductor device which has a plurality of semiconductor chips of desired sizes stacked as one package, a first semiconductor chip is mounted on a flexible printed wiring board provided with external connecting terminals. A printed circuit board is placed and mounted on the first semiconductor chip by flip-chip bonding. A second semiconductor chip is secured onto the printed circuit board. The second semiconductor chip is connected to the flexible printed wiring board by wire bonding. The first semiconductor chip is connected to the flexible printed wiring board by wire bonding via the printed circuit board.
    Type: Application
    Filed: August 29, 2001
    Publication date: March 7, 2002
    Applicant: Fujitsu Limited
    Inventors: Katsuhito Kikuma, Mitsutaka Ikeda, Yoshihiro Tsukidate, Yuji Akashi, Kaname Ozawa, Akira Takashima, Tadashi Uno, Takao Nishimura, Fumihiko Ando, Hiroshi Onodera, Hayato Okuda