Abstract: A camera apparatus (100) includes: a first housing (1) including a lens section (10); a second housing (2) including an image pickup section (20); and a connecting section (3) which connects the first and second housings (1) and (2). During image pickup, a focal length is specified by a contact between a bottom surface of a lens holder (12) which is exposed in the first housing (1) and a top surface of a transparent cover section (25) which is exposed in the second housing (2). This allows a realization of a camera apparatus in which a focal length is specified with high accuracy.

Abstract: A camera module 1 includes: an optical structure 3 that forms a subject image and moves up and down along an optical path; a solid-state image pickup element 21 that converts, into an electrical signal, a subject image formed by the optical structure 3; a lens holder 4, holding the optical structure 3 therein, which contains the solid-state image pickup element 21, the optical structure 3 having a cushioning member 34 so provided on a back surface thereof as to absorb the impact of contact between the optical structure 3 and the holding section 4. The cushioning member 34 has a removing section for, when in contact with a contact surface 4a of the holding section 4, removing dust D on the contact surface 4a outward from the contact surface 4a. This makes it possible to provide a small camera module 1 while preventing (reducing) dust from causing an image defect.

Abstract: A camera apparatus (100) includes: a first housing (1) including a lens section (10); a second housing (2) including an image pickup section (20); and a connecting section (3) which connects the first and second housings (1) and (2). During image pickup, a focal length is specified by a contact between a bottom surface of a lens holder (12) which is exposed in the first housing (1) and a top surface of a transparent cover section (25) which is exposed in the second housing (2). This allows a realization of a camera apparatus in which a focal length is specified with high accuracy.

Abstract: An optical structure is disposed on a surface of a device substrate, and a lens system for introducing external light into a solid-state image pickup device is placed in the center of the optical structure. The outer shape of the optical structure seen from the light incident side of the lens system is rectangular, and its plane shape forms a rectangular frame section. An intermediate structure is disposed between the device substrate and the optical structure. The intermediate structure has a fitting section for fitting the optical structure in a part of side faces of the frame section.

Abstract: In a camera module (1) of the present invention, a lens member (20) is attached to a semiconductor package (10). The semiconductor package (10) includes: an image sensor (11) mounted on a wiring board (13); and a wire 15 through which the wiring board (13) is electrically connected to the image sensor (11). The image sensor (11) and the wire 15 are sealed with mold resin (14). A step (18) is formed around the perimeter of the surface of the mold resin (14), and the semiconductor package (10) and the lens member (20) are joined by fitting the step (18) and a projection (23) of a lens holder (22). With this arrangement, it is possible to realize a small semiconductor module that allows for highly precise alignment between the semiconductor package and a mounting component to which the semiconductor package is joined.

Abstract: In accordance with the present invention of the solid-state image pickup device 100, a holder 31 is mounted along outer edge portion of the board 1 in such a manner that the holder 31 is mounted on a board 1 and on chip components 7 that are arranged on the outer edge portion of the board 1. The downsized solid-state image pickup device 100 can be attained hereby.

Abstract: A camera module structure (100) of the present invention is arranged such that a heat-sensitive camera module (2) is joined to a printed wiring board (1) through solder joint sections (3). The printed wiring board (1) has through holes (11) formed therein and terminals (12) formed thereon so as to close front surface apertures which are formed by the through holes (11) in the mounting surface of the printed wiring board (1). The solder joint sections (3) are provided on the terminals (12), respectively. The solder joint sections (3) are formed by heating by light (heat rays) applied to the rear side of the printed wiring board (1) by way of the terminals (12) on the printed wiring board (1), so that heat is not transmitted to the camera module (2). Accordingly, the camera module structure (100) mounted on the printed wiring board (1) is realized without heat damage to the heat-sensitive camera module (2).

Abstract: In manufacturing a camera module structure (100), a hot air nozzle (4) melts solder at a solder connection portion (3) by blowing hot air to the solder connection portion (3), while a suction nozzle (5) suctions the hot air that moves toward the camera module (2), from a position nearer from the camera module (2) than a position of the hot air nozzle (4). This makes it possible to manufacture a solder mounting structure in which a heat-vulnerable electronic component can be mounted on a wiring board without being damaged by heat.

Abstract: A camera module 1 includes: an optical structure 3 that forms a subject image; a solid-state image pickup element 21 that converts, into an electrical signal, a subject image formed by the optical structure 3; a lens holder 4, holding the optical structure 3 therein, which contains the solid-state image pickup element 21; and a cushioning member 34, disposed between the optical structure 3 and the lens holder 4 so as to avoid an optical path of the optical structure 3, which absorbs the impact of contact between the optical structure 3 and the lens holder 4, the cushioning member being made of nonmetallic material. This makes it possible to provide a small solid-state image pickup device while preventing dust from being generated when the camera module 1 is manufactured or used.

Abstract: A camera module 1 includes: an optical structure 3 that forms a subject image and moves up and down along an optical path; a solid-state image pickup element 21 that converts, into an electrical signal, a subject image formed by the optical structure 3; a lens holder 4, holding the optical structure 3 therein, which contains the solid-state image pickup element 21, the optical structure 3 having a cushioning member 34 so provided on a back surface thereof as to absorb the impact of contact between the optical structure 3 and the holding section 4. The cushioning member 34 has a removing section for, when in contact with a contact surface 4a of the holding section 4, removing dust D on the contact surface 4a outward from the contact surface 4a. This makes it possible to provide a small camera module 1 while preventing (reducing) dust from causing an image defect.

Abstract: An image capturing device module is disclosed. The image capturing device module includes an image capturing device provided on a base circuit substrate; a translucent member adhered to the image capturing device with a first adhesive to cover an upper part of an effective pixel region in the image capturing device; a lens body including a lens portion that focuses light into the effective pixel region in the image capturing device and a support portion that is translucent and is provided around the lens portion to expose an upper part of the lens portion; and a non-translucent molding resin that molds the image capturing device, the translucent member, and the lens body, with the upper part of the lens portion being exposed.

Abstract: There are provided a first casing 100A that has a photosensor section 113 for capturing an image, a second casing 100B that has a lens section 122 for projecting the image of a subject onto the photosensor section 113 of the first casing 100A and a connection section 100C that foldably connects the first casing 100A with the second casing 100B. The photosensor section 113 and the lens section 122 are arranged so that the photosensor section 113 and the lens section 122 are superposed on each other in a state in which the first casing 100A and the second casing 100B are folded together. With this arrangement, the folding type camera device and the folding type portable telephone equipped with this device can be reduced in thickness.

Abstract: An optical structure is disposed on a surface of a device substrate, and a lens system for introducing external light into a solid-state image pickup device is placed in the center of the optical structure. The outer shape of the optical structure seen from the light incident side of the lens system is rectangular, and its plane shape forms a rectangular frame section. An intermediate structure is disposed between the device substrate and the optical structure. The intermediate structure has a fitting section for fitting the optical structure in a part of side faces of the frame section.

Abstract: There are provided a first casing 100A that has a photosensor section 113 for capturing an image, a second casing 100B that has a lens section 122 for projecting the image of a subject onto the photosensor section 113 of the first casing 100A and a connection section 100C that foldably connects the first casing 100A with the second casing 100B. The photosensor section 113 and the lens section 122 are arranged so that the photosensor section 113 and the lens section 122 are superposed on each other in a state in which the first casing 100A and the second casing 100B are folded together. With this arrangement, the folding type camera device and the folding type portable telephone equipped with this device can be reduced in thickness.