Patents by Inventor Katsuji YAMAGISHI

Katsuji YAMAGISHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayer printed wiring board production method, adhesive layer-equipped metal foil, metal-clad laminate, and multilayer printed wiring board
    Patent number: 10893616
    Abstract: Disclosed is a production method of a multi-layered printed wiring board, including the following steps 1 to 3: Step 1: a step of laminating, on a substrate with inner layer circuit, a metal foil with adhesive layer including a support, a metal foil having a thickness of 3 ?m or less and ? or less relative to the thickness of the inner layer circuit, and an organic adhesive layer having a thickness of 10 ?m or less in this order, via an organic insulating resin layer such that the organic insulating resin layer and the organic adhesive layer are opposed to each other, and then releasing the support to form a laminated sheet (a) having the metal foil as an outer layer metal foil layer; Step 2: a step of irradiating the laminated sheet (a) with a laser to bore the outer layer metal foil layer, the organic adhesive layer, and the organic insulating resin layer to form a bored laminated sheet (b) having a blind via hole; and Step 3: a step of forming an outer layer circuit connected with the inner layer circui
    Type: Grant
    Filed: August 10, 2016
    Date of Patent: January 12, 2021
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Hitoshi Onozeki, Tsubasa Inoue, Katsuji Yamagishi, Hiroshi Shimizu
  • MULTILAYER PRINTED WIRING BOARD PRODUCTION METHOD, ADHESIVE LAYER-EQUIPPED METAL FOIL, METAL-CLAD LAMINATE, AND MULTILAYER PRINTED WIRING BOARD
    Publication number: 20180235090
    Abstract: Disclosed is a production method of a multi-layered printed wiring board, including the following steps 1 to 3: Step 1: a step of laminating, on a substrate with inner layer circuit, a metal foil with adhesive layer including a support, a metal foil having a thickness of 3 ?m or less and ? or less relative to the thickness of the inner layer circuit, and an organic adhesive layer having a thickness of 10 ?m or less in this order, via an organic insulating resin layer such that the organic insulating resin layer and the organic adhesive layer are opposed to each other, and then releasing the support to form a laminated sheet (a) having the metal foil as an outer layer metal foil layer; Step 2: a step of irradiating the laminated sheet (a) with a laser to bore the outer layer metal foil layer, the organic adhesive layer, and the organic insulating resin layer to form a bored laminated sheet (b) having a blind via hole; and Step 3: a step of forming an outer layer circuit connected with the inner layer circui
    Type: Application
    Filed: August 10, 2016
    Publication date: August 16, 2018
    Inventors: Hitoshi ONOZEKI, Tsubasa INOUE, Katsuji YAMAGISHI, Hiroshi SHIMIZU