Patents by Inventor Katsuki Furuta

Katsuki Furuta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for producing molding die, wafer lens, and optical lens
    Patent number: 9789656
    Abstract: A resin amount for forming each first-stage resin layer portion (a first-stage resin replica portion) 41da in a first process is defined to be greater than a resin amount for forming each second-stage resin layer portion (a second-stage resin replica portion) 41db in a second process. Therefore, at a boundary between the first-stage resin layer portion 41da and the second-stage resin layer portion 41db, a joint portion 48 at which resin overlaps is formed, whereby occurrence of an undercut shape can be avoided. Therefore, in a molding process using a sub-master die 40 and a sub-sub-master die 50 obtained from the sub-master die 40, occurrence of an undesired shape can be avoided, whereby mold release resistance can be reduced or eliminated.
    Type: Grant
    Filed: March 5, 2012
    Date of Patent: October 17, 2017
    Assignee: KONICA MINOLTA, INC.
    Inventors: Katsuki Furuta, Hiroyuki Matsuda
  • Lens assembling method, lens assembly, and image capturing device with the lens assembly
    Patent number: 8789285
    Abstract: A lens assembling method for assembling a first lens and a second lens where the first lens has a first mark on a first surface thereof and a second mark on a second surface opposite to the first surface, and the second lens has a third mark on a first surface thereof, the lens assembling method including: a first step of aligning a position of one of the first mark and second marks of the first lens with a position of the third mark of the second lens; and a second step of aligning a position of the other one of the first and second marks of the first lens with the position of the third mark of the second lens, while keeping the position alignment performed in the first step.
    Type: Grant
    Filed: August 17, 2010
    Date of Patent: July 29, 2014
    Assignee: Konica Minolta Opto, Inc.
    Inventors: Kazuhiro Wada, Katsuki Furuta
  • METHODS FOR PRODUCING MOLDING DIE, WAFER LENS, AND OPTICAL LENS
    Publication number: 20130328224
    Abstract: A resin amount for forming each first-stage resin layer portion (a first-stage resin replica portion) 41da in a first process is defined to be greater than a resin amount for forming each second-stage resin layer portion (a second-stage resin replica portion) 41db in a second process. Therefore, at a boundary between the first-stage resin layer portion 41da and the second-stage resin layer portion 41db, a joint portion 48 at which resin overlaps is formed, whereby occurrence of an undercut shape can be avoided. Therefore, in a molding process using a sub-master die 40 and a sub-sub-master die 50 obtained from the sub-master die 40, occurrence of an undesired shape can be avoided, whereby mold release resistance can be reduced or eliminated.
    Type: Application
    Filed: March 5, 2012
    Publication date: December 12, 2013
    Applicant: KONICA MINOLTA, INC.
    Inventors: Katsuki Furuta, Hiroyuki Matsuda