Patents by Inventor Katsumasa Hasegawa

Katsumasa Hasegawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High-strength, high-conductivity copper alloy wire excellent in resistance to stress relaxation
    Patent number: 7648601
    Abstract: A high-strength, high conductivity copper alloy wire that is excellent in resistance to stress relaxation, which contains 1.0 to 4.5% by mass of Ni, 0.2 to 1.1% by mass of Si, 0.05 to 1.5% by mass of Sn, and less than 0.005% (including zero) by mass of S, with the balance being Cu and inevitable impurities, wherein the wire has a conductivity of from 20% to 60% IACS and a tensile strength of from 700 to 1,300 MPa, and a method of producing the same.
    Type: Grant
    Filed: March 13, 2006
    Date of Patent: January 19, 2010
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Katsumasa Hasegawa, Kuniteru Mihara, Katsuhiko Uda, Takashi Miyoshi
  • High-strength, high-conductivity copper alloy wire excellent in resistance to stress relaxation
    Publication number: 20060196586
    Abstract: A high-strength, high conductivity copper alloy wire that is excellent in resistance to stress relaxation, which contains 1.0 to 4.5% by mass of Ni, 0.2 to 1.1% by mass of Si, 0.05 to 1.5% by mass of Sn, and less than 0.005% (including zero) by mass of S, with the balance being Cu and inevitable impurities, wherein the wire has a conductivity of from 20% to 60% IACS and a tensile strength of from 700 to 1,300 MPa, and a method of producing the same.
    Type: Application
    Filed: March 13, 2006
    Publication date: September 7, 2006
    Applicant: THE FURUKAWA ELECTRIC CO., LTD.
    Inventors: Katsumasa Hasegawa, Kuniteru Mihara, Katsuhiko Uda, Takashi Miyoshi
  • High-strength, high-conductivity copper alloy wire excellent in resistance to stress relaxation
    Publication number: 20050028907
    Abstract: A high-strength, high-conductivity copper alloy wire that is excellent in resistance to stress relaxation, which contains 1.0 to 4.5% by mass of Ni, 0.2 to 1.1% by mass of Si, 0.05 to 1.5% by mass of Sn, and less than 0.005% (including zero) by mass of S, with the balance being Cu and inevitable impurities, wherein the wire has a conductivity of from 20% to 60% IACS and a tensile strength of from 700 to 1,300 MPa, and a method of producing the same.
    Type: Application
    Filed: September 9, 2004
    Publication date: February 10, 2005
    Applicant: The Furukawa Electric Co., Ltd.
    Inventors: Katsumasa Hasegawa, Kuniteru Mihara, Katsuhiko Uda, Takashi Miyoshi