Patents by Inventor Katsumasa Miyazaki

Katsumasa Miyazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thickness reducing management system for pipes in pipe lines
    Patent number: 6487518
    Abstract: In a thickness reducing management for pipes in pipe lines, limited proper parameters which cause erosion and corrosion of the pipes are selected and with these parameters a pipe thickness reducing speed evaluation model formulas are constructed, and by making use of the model formulas thickness reducing amount of the pipes is evaluated. Thereby, conventional difficulty of formulating a proper pipe thickness reducing estimation model formula in view of actual pipe material and pipe inner fluid state because of too many possibly influential parameters causing pipe thickness reducing due to erosion and corrosion, and conventional difficulty of performing highly reliable pipe thickness reducing management are overcome.
    Type: Grant
    Filed: June 21, 2000
    Date of Patent: November 26, 2002
    Assignee: Hitachi, Ltd.
    Inventors: Katsumasa Miyazaki, Satoru Aoike, Satoshi Kanno, Masakazu Hisatsune