Abstract: This disclosure relates to an imaging element, an imaging element control method, an imaging apparatus, and an electronic device adapted to suppress the drop in yield of the imaging element with an ever-higher density of circuitry. Multiple transfer paths are configured to transfer, bit by bit, a time code of a predetermined number of bits for use in converting into a digital signal a pixel signal reflecting the intensity of light received by a pixel. The transfer paths are provided with a relief transfer path that is switched for use in the case where an error has occurred on the multiple transfer paths. This disclosure may be applied to the imaging element.

Abstract: This disclosure relates to an imaging element, an imaging element control method, an imaging apparatus, and an electronic device adapted to suppress the drop in yield of the imaging element with an ever-higher density of circuitry. Multiple transfer paths are configured to transfer, bit by bit, a time code of a predetermined number of bits for use in converting into a digital signal a pixel signal reflecting the intensity of light received by a pixel. The transfer paths are provided with a relief transfer path that is switched for use in the case where an error has occurred on the multiple transfer paths. This disclosure may be applied to the imaging element.

Abstract: A solid-state imaging device includes a first chip including a plurality of pixels, each pixel including a light sensing unit generating a signal charge responsive to an amount of received light, and a plurality of MOS transistors reading the signal charge generated by the light sensing unit and outputting the read signal charge as a pixel signal, a second chip including a plurality of pixel drive circuits supplying desired drive pulses to pixels, the second chip being laminated beneath the first chip in a manner such that the pixel drive circuits are arranged beneath the pixels formed in the first chip to drive the pixels, and a connection unit for electrically connecting the pixels to the pixel drive circuits arranged beneath the pixels.

Abstract: A solid-state imaging device includes a first chip including a plurality of pixels, each pixel including a light sensing unit generating a signal charge responsive to an amount of received light, and a plurality of MOS transistors reading the signal charge generated by the light sensing unit and outputting the read signal charge as a pixel signal, a second chip including a plurality of pixel drive circuits supplying desired drive pulses to pixels, the second chip being laminated beneath the first chip in a manner such that the pixel drive circuits are arranged beneath the pixels formed in the first chip to drive the pixels, and a connection unit for electrically connecting the pixels to the pixel drive circuits arranged beneath the pixels.

Abstract: A solid-state imaging device includes a first chip including a plurality of pixels, each pixel including a light sensing unit generating a signal charge responsive to an amount of received light, and a plurality of MOS transistors reading the signal charge generated by the light sensing unit and outputting the read signal charge as a pixel signal, a second chip including a plurality of pixel drive circuits supplying desired drive pulses to pixels, the second chip being laminated beneath the first chip in a manner such that the pixel drive circuits are arranged beneath the pixels formed in the first chip to drive the pixels, and a connection unit for electrically connecting the pixels to the pixel drive circuits arranged beneath the pixels.

Abstract: Provided is a signal processing apparatus, including: an A/D conversion unit configured to perform A/D conversion of a first signal, A/D conversion of a second signal, A/D conversion of a third signal, and A/D conversion of a fourth signal; and a correlated double sampling processing unit configured to generate a first output signal by performing correlated double sampling using a first digital data item obtained through the A/D conversion of the first signal, and a second digital data item obtained through the A/D conversion of the second signal, a second output signal by performing correlated double sampling using a third digital data item obtained through the A/D conversion of the third signal, and a fourth digital data item obtained through the A/D conversion of the fourth signal, and a third output signal by performing correlated double sampling using the first output signal and the second output signal.

Abstract: Provided is a signal processing apparatus, including: an A/D conversion unit configured to perform A/D conversion of a first signal, A/D conversion of a second signal, A/D conversion of a third signal, and A/D conversion of a fourth signal; and a correlated double sampling processing unit configured to generate a first output signal by performing correlated double sampling using a first digital data item obtained through the A/D conversion of the first signal, and a second digital data item obtained through the A/D conversion of the second signal, a second output signal by performing correlated double sampling using a third digital data item obtained through the A/D conversion of the third signal, and a fourth digital data item obtained through the A/D conversion of the fourth signal, and a third output signal by performing correlated double sampling using the first output signal and the second output signal.

Abstract: A solid-state imaging device includes a first chip including a plurality of pixels, each pixel including a light sensing unit generating a signal charge responsive to an amount of received light, and a plurality of MOS transistors reading the signal charge generated by the light sensing unit and outputting the read signal charge as a pixel signal, a second chip including a plurality of pixel drive circuits supplying desired drive pulses to pixels, the second chip being laminated beneath the first chip in a manner such that the pixel drive circuits are arranged beneath the pixels formed in the first chip to drive the pixels, and a connection unit for electrically connecting the pixels to the pixel drive circuits arranged beneath the pixels.

Abstract: A solid-state imaging device includes a first chip including a plurality of pixels, each pixel including a light sensing unit generating a signal charge responsive to an amount of received light, and a plurality of MOS transistors reading the signal charge generated by the light sensing unit and outputting the read signal charge as a pixel signal, a second chip including a plurality of pixel drive circuits supplying desired drive pulses to pixels, the second chip being laminated beneath the first chip in a manner such that the pixel drive circuits are arranged beneath the pixels formed in the first chip to drive the pixels, and a connection unit for electrically connecting the pixels to the pixel drive circuits arranged beneath the pixels.

Abstract: A solid-state imaging device includes a first chip including a plurality of pixels, each pixel including a light sensing unit generating a signal charge responsive to an amount of received light, and a plurality of MOS transistors reading the signal charge generated by the light sensing unit and outputting the read signal charge as a pixel signal, a second chip including a plurality of pixel drive circuits supplying desired drive pulses to pixels, the second chip being laminated beneath the first chip in a manner such that the pixel drive circuits are arranged beneath the pixels formed in the first chip to drive the pixels, and a connection unit for electrically connecting the pixels to the pixel drive circuits arranged beneath the pixels.

Abstract: A solid-state imaging device includes a first chip including a plurality of pixels, each pixel including a light sensing unit generating a signal charge responsive to an amount of received light, and a plurality of MOS transistors reading the signal charge generated by the light sensing unit and outputting the read signal charge as a pixel signal, a second chip including a plurality of pixel drive circuits supplying desired drive pulses to pixels, the second chip being laminated beneath the first chip in a manner such that the pixel drive circuits are arranged beneath the pixels formed in the first chip to drive the pixels, and a connection unit for electrically connecting the pixels to the pixel drive circuits arranged beneath the pixels.

Abstract: A solid-state imaging device includes a first chip including a plurality of pixels, each pixel including a light sensing unit generating a signal charge responsive to an amount of received light, and a plurality of MOS transistors reading the signal charge generated by the light sensing unit and outputting the read signal charge as a pixel signal, a second chip including a plurality of pixel drive circuits supplying desired drive pulses to pixels, the second chip being laminated beneath the first chip in a manner such that the pixel drive circuits are arranged beneath the pixels formed in the first chip to drive the pixels, and a connection unit for electrically connecting the pixels to the pixel drive circuits arranged beneath the pixels.

Abstract: A method for compressing digital data from an original bit stream into a coded bit stream useful for facsimile data transmission and digitized document image storage. The method comprises the steps of dividing the original bit stream into a plurality of data blocks and then comparing each of the data blocks with a reference block having a predetermined bit pattern. A coded bit stream is formed that comprises data blocks, compressed blocks and index blocks according to the following procedure. When a data block in the original bit stream is a mismatch with the reference block, the data block is included as is, without modification, in the coded bit stream along with an index bit indicating a mismatch in the index block. When a data block in the original bit stream is matched to the reference block, then compressed block is included in the coded bit stream along with an index bit in the index block indicating that the data block is matched.