Patents by Inventor Katsumi Konno

Katsumi Konno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110230576
    Abstract: A foamable resin composition according to the present invention comprises starch, an aliphatic polyester and water, and wherein 10 to 40 parts by mass of the water and 10 to 80 parts by mass of the aliphatic polyester are included with respect to 100 parts by mass of the starch. The foamable resin composition preferably comprises 3 to 60 parts by mass of a glycerin with respect to 100 parts by mass of the starch. The whole composition of the foamable resin composition is made of a biodegradable raw material, and the molded product of the composition has excellent water resistance and favorable moldability, is free from problems in mechanical characteristics such as strength, and also has a cost advantage.
    Type: Application
    Filed: December 9, 2008
    Publication date: September 22, 2011
    Applicants: SHOWA HIGHPOLYMER CO., LTD., HOKKAIDO GOVERNMENT
    Inventors: Kei Takahashi, Terumitsu Kotani, Haruki Nishiike, Hiroshi Kani, Katsumi Konno
  • Publication number: 20110077313
    Abstract: A foamable resin composition according to the present invention comprises 10 parts by weight or less, preferably 0.5 to 8 parts by weight of a biodegradable resin and/or polyolefin resin, 10 to 30 parts by weight of water and 0.01 to 5 parts by weight of an inorganic filler, with respect to 100 parts by weight of a modified starch. The modified starch is preferably at least one of oxidized starches, esterified starches, acetylated starches and cationic starches. The foamable resin composition can maintain strength, etc., of the foamed body obtained at a practical level even though the amount of the biodegradable resin and/or polyolefin resin is reduced as much as possible, and has a cost advantage.
    Type: Application
    Filed: May 25, 2009
    Publication date: March 31, 2011
    Applicants: SHOWA DENKO K.K., HOKKAIDO GOVERNMENT
    Inventors: Kei Takahashi, Terumitsu Kotani, Haruki Nishike, Hiroshi Kani, Katsumi Konno