Abstract: A light interference-type film thickness measuring mechanism 24 measures a film thickness by irradiating a light emitted from a light transmission portion on to the bottom surface of a wafer W held by a wafer holding head 8 and receives the reflected light and. A cleaning mechanism 26 includes a cleaning fluid tank 27 a top surface of which is opened and arranged in the vicinity of the bottom surface of the wafer; a light transmission portion 50 formed at the bottom portion 48 of the tank 27; a wafer cleaning nozzle 40 spraying the cleaning fluid on the measuring points at the bottom surface of the wafer; a light transmission portion cleaning nozzle 44 spraying the cleaning fluid on the light transmission portion 50 and cleaning fluid supply means for supplying cleaning fluid to these nozzles.

Abstract: A truing apparatus for a wafer polishing pad is provided which is capable of obtaining a sufficient truing effect while keeping the polishing amount of a polishing pad to a maximum. The truing apparatus includes a truing grinding wheel having an abrasive grain layer having ultra-abrasive grains electrodeposited thereon, a support arm for rotatably supporting the truing grinding wheel by bringing the polishing surface of an electrodeposition abrasive grain layer into abutment with the polishing pad, a grinding wheel rotary motor for rotating the grinding wheel, a self-aligning bearing disposed between a grinding wheel support plate and a grinding wheel rotation shaft, and pure water supply means for supplying pure water from the inside of the truing grinding wheel.

Abstract: A cutting apparatus comprises an endless chain body comprising a plurality of plate-like flaps connected to each other for angular movement in a common plane. Each flap has an end face on an inner peripheral side of the chain body, and at least a part of the flaps having a cutting device at the end face. The apparatus further comprises a plurality of sprockets supporting the chain body in tension, and defining a common plane of cut effected by the combination of the chain body and the sprockets. The chain body is supported by a rigid backplate, of thickness not greater than the thickness of the flaps. It provides a firm support to the rotating chain body to permit sliding movement of the chain body within the common plane of cut.

Abstract: A chain cutter comprises an endless chain body including a plurality of plate-like flaps connected to each other to provide angular movement in a common plane; each of the flaps has an end face on a inner peripheral side of said chain body, and at least a part of said flaps has a cutting device at the end face.