Abstract: The present invention relates to provide a projection exposure device having a small volume, thereby not occupying a large installation space. The projection exposure device is configured to transfer patterns formed on a mask to a surface of film-shaped tape on an upright exposure stage by projecting the patterns onto the surface using light. This projection exposure device includes a transfer mechanism for feeding the tape to the exposure stage vertically, and a projection optical mechanism for irradiating the surface of the tape with the light. The projection optical mechanism is composed of Dyson optics located opposite the transfer mechanism across the exposure stage, and has an optical axis that is substantially perpendicular to the exposure stage.

Abstract: The present invention relates to provide a projection exposure device having a small volume, thereby not occupying a large installation space. The projection exposure device is configured to transfer patterns formed on a mask to a surface of film-shaped tape on an upright exposure stage by projecting the patterns onto the surface using light. This projection exposure device includes a transfer mechanism for feeding the tape to the exposure stage vertically, and a projection optical mechanism for irradiating the surface of the tape with the light. The projection optical mechanism is composed of Dyson optics located opposite the transfer mechanism across the exposure stage, and has an optical axis that is substantially perpendicular to the exposure stage.

Abstract: An apparatus for projection exposure which projects a pattern of a mask onto a work is provided. The apparatus has a base, a source of light, an optical system, a mask support mechanism, a work support mechanism and an alignment mechanism. The optical system constitutes light rays into projection light rays carrying image information of the mask, guiding the projection light rays through a predetermined optical path so that the projection light rays can be projected onto an exposure surface of the work. The optical system includes a projection optical system and an illumination optical system. The projection optical system is adapted to be disposed vertical relative to the base. The mask and work support mechanisms vertically support the mask and work relative to the base, respectively. In this way, the exposure surface of the work can coincide with an image forming plane in the optical path.

Abstract: The Xray irradiation device 1 issues Xrays to board mark 7 and projects the image of the board mark 7 on the fluorescence screen 3, the fluorescence face 39 of which visibly displays the image of the board mark 7 that can be captured by the CCD camera 2. The CCD camera 2 images the board mark 7 and the mask mark 5 depicted on the photo mask 4 overlapping together. The board 6 and the photo mask 4 are aligned by exposure stage 8 so as to the board mark 7 and the mask mark 5 coincide.

Abstract: An apparatus for projection exposure which projects a pattern of a mask onto a work is provided. The apparatus has a base, a source of light, an optical system, a mask support mechanism, a work support mechanism and an alignment mechanism. The optical system constitutes light rays into projection light rays carrying image information of the mask, guiding the projection light rays through a predetermined optical path so that the projection light rays can be projected onto an exposure surface of the work. The optical system includes a projection optical system and an illumination optical system. The projection optical system is adapted to be disposed vertical relative to the base. The mask and work support mechanisms vertically support the mask and work relative to the base, respectively. In this way, the exposure surface of the work can coincide with an image forming plane in the optical path.

Abstract: A marking apparatus for forming alignment marks, which improves the alignment accuracy of each layer in the production of multi-layered printed circuit boards. An X-ray generator 11 irradiates X-rays at a standard mark 50 in a core board 51 of a board 5, and projects the image of the standard mark 50 on a fluorescence screen 12. The image is captured by a visible light CCD camera 13, thereby the position of the standard mark 50 is detected. Using the detected position of the standard mark 50 as an alignment reference, the apparatus irradiates ultra-violet rays at dry film resist layers 55 via mirrors 22 and 23, and imprints the marks emerged on photo masks 24 and 25 on the dry film resist layers 55, respectively.

Abstract: A marking apparatus for forming alignment marks, which improves the alignment accuracy of each layer in the production of multi-layered printed circuit boards. An X-ray generator 11 irradiates X-rays at a standard mark 50 in a core board 51 of a board 5, and projects the image of the standard mark 50 on a fluorescence screen 12. The image is captured by a visible light CCD camera 13, thereby the position of the standard mark 50 is detected. Using the detected position of the standard mark 50 as an alignment reference, the apparatus irradiates ultra-violet rays at dry film resist layers 55 via mirrors 22 and 23, and imprints the marks emerged on photo masks 24 and 25 on the dry film resist layers 55, respectively.

Abstract: The invention provides an aligner enabling to perform high accuracy positioning at manufacturing a multi-layered circuit board. A board alignment mark is photographed by a CCD camera by irradiating X-ray from an X-ray generator at the state removing a photo mask, and position of the board alignment mark is memorized. Then, the photo mask is set on a print circuit board, a mask alignment mark is photographed, and positioning of the mask alignment mark and the print circuit board is performed by comparing with position of memorized board alignment mark and by moving a platen so that the gap becomes zero.

Abstract: There is provided an aligner that improves contact between a glass mask and an object to be exposed. In one preferred mode, a pressure glass 3 is set at a rear side of a glass mask 1 to form a closed space 4. A pressurized air is introduced from a pressure source 5 into the closed space 4 to raise the pressure of the closed space 4 and expand the glass mask 1 toward the object to be exposed, i.e., a board 50, by which the closeness of the contact between the glass mask 1 and the board 50 improves.

Abstract: The invention provides an aligner enabling to perform high accuracy positioning at manufacturing a multi-layered circuit board. A board alignment mark is photographed by a CCD camera by irradiating X-ray from an X-ray generator at the state removing a photo mask, and position of the board alignment mark is memorized. Then, the photo mask is set on a print circuit board, a mask alignment mark is photographed, and positioning of the mask alignment mark and the print circuit board is performed by comparing with position of memorized board alignment mark and by moving a platen so that the gap becomes zero.

Abstract: A device for detecting the position of an information recording or reproducing head relative to a recording medium; the head is relatively rotatable around a first axis with respect to the recording medium, and rotatable around a second axis parallel to the first axis. The device includes an autocollimator for measuring a relative positional relationship of the head substantially along the direction of the rotation around the second axis, a rotating table on which either the combination of the recording medium and the head or the autocollimator is mounted to activate the rotational movement substantially around the second axis, and a control unit. The control unit rotates the rotating table in response to the obtained position of the head with respect to the recording medium. According to the measurement result by the autocollimator, the control unit accomplishes a relative positional controlling in which a relative positional relationship between the autocollimator and the head is kept constant.

Abstract: This specification discloses a method of aligning a mask and a wafer for manufacturing semiconductor circuit elements into a predetermined positional relationship. The method comprises two steps. In a first step, the mask and wafer are aligned by the use of relatively large alignment marks provided on the mask and wafer. In a second step, the mask and wafer are aligned by using relatively small key patterns provided on the mask and wafer and having substantially no positional deviation with respect to actual element (circuit) patterns.

Abstract: An exposure method for exposing to a pattern a photosensitive material formed over a substrate having a reflective surface uses a light source having beam components of different wavelengths. The beam from the light source is used to project an exposure pattern upon the photosensitive material through a predetermined mask pattern to thereby form a combined standing wave pattern with the aid of the light beam incident on the photosensitive material and the light beam reflected by the reflective surface. The photosensitive material is disposed in the reduced peak value region of the combined standing wave pattern as the result of the interposition of a transparent layer between the reflecting surface and the photosensitive layer. Thus, the photosensitive material is pattern-exposed to a substantially uniform sensitizing energy.

Abstract: An exposure method for exposing to a pattern a photosensitive material formed over a substrate having a reflective surface uses a light source having beam components of different wavelengths. The beam from the light source is used to project an exposure pattern upon the photosensitive material through a predetermined mask pattern to thereby form a combined standing wave pattern with the aid of the light beam incident on the photosensitive material and the light beam reflected by the reflective surface. The photosensitive material is disposed in the reduced peak value region of the combined standing wave pattern as the result of the interposition of a transparent layer between the reflecting surface and the photosensitive layer. Thus, the photosensitive material is pattern-exposed to a substantially uniform sensitizing energy.

Abstract: In the system disclosed, illuminating means form an optical path. An imaging system in the optical path includes a support for a mask, an imaging lens that focuses the image of the mask onto an optical plane, and a support that holds a component having a radiation-sensitive surface at the plane. A filter in the illuminating system blocks out light capable of affecting the radiation-sensitive material but allows passage of some visible light so that the image of the mask can be seen on the component. A half-mirror or beam splitter allows light from the imaging lens to focus on the component but deflects a portion of the light coming from the component toward an analyzer that detects the alignment between the image of the mask and the component. A second half-mirror or beam splitter near the first half-mirror compensates for radial shift of the image relative to the axis of the light path caused by the first half-mirror.