Patents by Inventor Katsumi Nakasato

Katsumi Nakasato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9581501
    Abstract: A sensitive and practicable temperature control material which precisely or determinably detects whether the temperature reaches a predetermined temperature by electrical change from a conductive state to an insulated or lower-conductive state has excellent time stability, chemical stability, durability, and weather resistance. The temperature control material includes a heat-melt substance which melts by heat at a melting point according to temperature being detected, and a conductive paste which includes conductive powder. The temperature control material is in a conductive state by the conductive paste. The heat-melt substance is kept away from the conductive paste through a porous material and the temperature control material changes to be in an insulated or lower-conductive states. The heat-melt substance penetrates the porous material to irreversibly permeate and/or disperse into the conductive paste on a heat-melt state thereof.
    Type: Grant
    Filed: November 8, 2015
    Date of Patent: February 28, 2017
    Assignee: NiGK CORPORATION
    Inventors: Naoki Kozono, Katsumi Nakasato
  • Publication number: 20160290871
    Abstract: A sensitive and practicable temperature control material which precisely or determinably detects whether the temperature reaches a predetermined temperature by electrical change from a conductive state to an insulated or lower-conductive state has excellent time stability, chemical stability, durability, and weather resistance. The temperature control material includes a heat-melt substance which melts by heat at a melting point according to temperature being detected, and a conductive paste which includes conductive powder. The temperature control material is in a conductive state by the conductive paste. The heat-melt substance is kept away from the conductive paste through a porous material and the temperature control material changes to be in an insulated or lower-conductive states. The heat-melt substance penetrates the porous material to irreversibly permeate and/or disperse into the conductive paste on a heat-melt state thereof.
    Type: Application
    Filed: November 8, 2015
    Publication date: October 6, 2016
    Applicant: NiGK CORPORATION
    Inventors: Naoki KOZONO, Katsumi NAKASATO
  • Patent number: 7575150
    Abstract: Soldering flux compositions, solder pastes, and methods of soldering using the same are provided, that exhibit excellent wettability, give highly reliable solder joints, and have superior storage stability. The flux composition contains at least one compound having at least one blocked carboxyl group selected from the group including compound (X) obtained by reaction of a carboxylic acid compound and a vinyl ether compound, compound (Y) obtained by reaction of a carboxylic acid anhydride compound and a hydroxy vinyl ether compound, and compound (Z) obtained by reaction of an acid anhydride and a polyhydric alcohol, followed by addition polymerization with a divinyl ether compound, and the flux composition is non-curing.
    Type: Grant
    Filed: September 24, 2007
    Date of Patent: August 18, 2009
    Assignee: NOF Corporation
    Inventors: Shun Saito, Katsumi Nakasato, Yukihiro Kato, Isao Nakata
  • Publication number: 20080073414
    Abstract: Soldering flux compositions, solder pastes, and methods of soldering using the same are provided, that exhibit excellent wettability, give highly reliable solder joints, and have superior storage stability. The flux composition contains at least one compound having at least one blocked carboxyl group selected from the group including compound (X) obtained by reaction of a carboxylic acid compound and a vinyl ether compound, compound (Y) obtained by reaction of a carboxylic acid anhydride compound and a hydroxy vinyl ether compound, and compound (Z) obtained by reaction of an acid anhydride and a polyhydric alcohol, followed by addition polymerization with a divinyl ether compound, and the flux composition is non-curing.
    Type: Application
    Filed: September 24, 2007
    Publication date: March 27, 2008
    Applicant: NOF Corporation
    Inventors: Shun Saito, Katsumi Nakasato, Yukihiro Kato, Isao Nakata
  • Publication number: 20040250919
    Abstract: Soldering flux compositions, solder pastes, and methods of soldering using the same are provided, that exhibit excellent wettability, give highly reliable solder joints, and have superior storage stability. The flux composition contains at least one compound having at least one blocked carboxyl group selected from the group including compound (X) obtained by reaction of a carboxylic acid compound and a vinyl ether compound, compound (Y) obtained by reaction of a carboxylic acid anhydride compound and a hydroxy vinyl ether compound, and compound (Z) obtained by reaction of an acid anhydride and a polyhydric alcohol, followed by addition polymerization with a divinyl ether compound, and the flux composition is non-curing.
    Type: Application
    Filed: March 24, 2004
    Publication date: December 16, 2004
    Inventors: Shun Saito, Katsumi Nakasato, Yukihiro Kato, Isao Nakata