Patents by Inventor Katsumi NISHIKORI
Katsumi NISHIKORI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11968462Abstract: The present disclosure relates to a solid-state image pickup apparatus, a correction method, and an electronic apparatus, enabled to suppress an apparent uncomfortable feeling of an image output from a solid-state image pickup apparatus in which pixels of different OCL shapes are mounted mixedly. A solid-state image pickup apparatus according to an aspect of the present disclosure includes a pixel array in which a first pixel in which an OCL (On Chip Lens) of a standard size is formed and a second pixel in which an OCL of a size different from the standard size is formed are present mixedly, and a correction section that corrects a pixel value of the first pixel that is positioned in the vicinity of the second pixel among the first pixels on the pixel array. The present disclosure can be applied to, for example, a CMOS image sensor.Type: GrantFiled: February 16, 2023Date of Patent: April 23, 2024Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Takeru Tsuzuki, Katsumi Nishikori
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Patent number: 11888004Abstract: An imaging apparatus includes a pixel array unit including a plurality of pixel groups, each of the plurality of pixel groups being one of i) a normal pixel group including only normal pixels, or ii) a mixed pixel group including at least one normal pixel and at least one phase difference detection pixel, wherein the pixel array unit comprises at least one normal pixel group and at least one mixed pixel group. For each normal pixel group, the normal pixels receive light transmitted through a same colored color filter. For each mixed pixel group, the at least one phase difference detection pixel shares an on-chip lens with at least one other phase difference detection pixel and receives light transmitted through a same colored color filter as the at least one other phase difference detection pixel.Type: GrantFiled: July 25, 2018Date of Patent: January 30, 2024Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Keiichiro Takahashi, Kazuhito Kobayashi, Katsumi Nishikori, Shoyu Tanaka
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Publication number: 20230402475Abstract: An imaging apparatus includes a pixel array unit including a plurality of pixel groups, each of the plurality of pixel groups being one of i) a normal pixel group including only normal pixels, or ii) a mixed pixel group including at least one normal pixel and at least one phase difference detection pixel. For each normal pixel group, the normal pixels receive light transmitted through a same colored color filter. For each mixed pixel group, the at least one phase difference detection pixel shares an on-chip lens with at least one other phase difference detection pixel and receives light transmitted through a same colored color filter as the at least one other phase difference detection pixel.Type: ApplicationFiled: August 10, 2023Publication date: December 14, 2023Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Keiichiro TAKAHASHI, Kazuhito KOBAYASHI, Katsumi NISHIKORI, Shoyu TANAKA
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Publication number: 20230209221Abstract: The present disclosure relates to a solid-state image pickup apparatus, a correction method, and an electronic apparatus, enabled to suppress an apparent uncomfortable feeling of an image output from a solid-state image pickup apparatus in which pixels of different OCL shapes are mounted mixedly. A solid-state image pickup apparatus according to an aspect of the present disclosure includes a pixel array in which a first pixel in which an OCL (On Chip Lens) of a standard size is formed and a second pixel in which an OCL of a size different from the standard size is formed are present mixedly, and a correction section that corrects a pixel value of the first pixel that is positioned in the vicinity of the second pixel among the first pixels on the pixel array. The present disclosure can be applied to, for example, a CMOS image sensor.Type: ApplicationFiled: February 16, 2023Publication date: June 29, 2023Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Takeru TSUZUKI, Katsumi NISHIKORI
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Patent number: 11632603Abstract: The present disclosure relates to a solid-state image pickup apparatus, a correction method, and an electronic apparatus, enabled to suppress an apparent uncomfortable feeling of an image output from a solid-state image pickup apparatus in which pixels of different OCL shapes are mounted mixedly. A solid-state image pickup apparatus according to an aspect of the present disclosure includes a pixel array in which a first pixel in which an OCL (On Chip Lens) of a standard size is formed and a second pixel in which an OCL of a size different from the standard size is formed are present mixedly, and a correction section that corrects a pixel value of the first pixel that is positioned in the vicinity of the second pixel among the first pixels on the pixel array. The present disclosure can be applied to, for example, a CMOS image sensor.Type: GrantFiled: November 5, 2020Date of Patent: April 18, 2023Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Takeru Tsuzuki, Katsumi Nishikori
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Patent number: 11595603Abstract: The present disclosure relates to a solid-state image pickup apparatus, a correction method, and an electronic apparatus, enabled to suppress an apparent uncomfortable feeling of an image output from a solid-state image pickup apparatus in which pixels of different OCL shapes are mounted mixedly. A solid-state image pickup apparatus according to an aspect of the present disclosure includes a pixel array in which a first pixel in which an OCL (On Chip Lens) of a standard size is formed and a second pixel in which an OCL of a size different from the standard size is formed are present mixedly, and a correction section that corrects a pixel value of the first pixel that is positioned in the vicinity of the second pixel among the first pixels on the pixel array. The present disclosure can be applied to, for example, a CMOS image sensor.Type: GrantFiled: November 5, 2020Date of Patent: February 28, 2023Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Takeru Tsuzuki, Katsumi Nishikori
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Publication number: 20210058577Abstract: The present disclosure relates to a solid-state image pickup apparatus, a correction method, and an electronic apparatus, enabled to suppress an apparent uncomfortable feeling of an image output from a solid-state image pickup apparatus in which pixels of different OCL shapes are mounted mixedly. A solid-state image pickup apparatus according to an aspect of the present disclosure includes a pixel array in which a first pixel in which an OCL (On Chip Lens) of a standard size is formed and a second pixel in which an OCL of a size different from the standard size is formed are present mixedly, and a correction section that corrects a pixel value of the first pixel that is positioned in the vicinity of the second pixel among the first pixels on the pixel array. The present disclosure can be applied to, for example, a CMOS image sensor.Type: ApplicationFiled: November 5, 2020Publication date: February 25, 2021Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Takeru TSUZUKI, Katsumi NISHIKORI
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Patent number: 10863124Abstract: The present disclosure relates to a solid-state image pickup apparatus, a correction method, and an electronic apparatus, enabled to suppress an apparent uncomfortable feeling of an image output from a solid-state image pickup apparatus in which pixels of different OCL shapes are mounted mixedly. A solid-state image pickup apparatus according to an aspect of the present disclosure includes a pixel array in which a first pixel in which an OCL (On Chip Lens) of a standard size is formed and a second pixel in which an OCL of a size different from the standard size is formed are present mixedly, and a correction section that corrects a pixel value of the first pixel that is positioned in the vicinity of the second pixel among the first pixels on the pixel array. The present disclosure can be applied to, for example, a CMOS image sensor.Type: GrantFiled: June 22, 2017Date of Patent: December 8, 2020Assignee: Sony Semiconductor Solutions CorporationInventors: Takeru Tsuzuki, Katsumi Nishikori
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Publication number: 20200161352Abstract: An imaging apparatus includes a pixel array unit including a plurality of pixel groups, each of the plurality of pixel groups being one of i) a normal pixel group including only normal pixels, or ii) a mixed pixel group including at least one normal pixel and at least one phase difference detection pixel, wherein the pixel array unit comprises at least one normal pixel group and at least one mixed pixel group. For each normal pixel group, the normal pixels receive light transmitted through a same colored color filter. For each mixed pixel group, the at least one phase difference detection pixel shares an on-chip lens with at least one other phase difference detection pixel and receives light transmitted through a same colored color filter as the at least one other phase difference detection pixel.Type: ApplicationFiled: July 25, 2018Publication date: May 21, 2020Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Keiichiro TAKAHASHI, Kazuhito KOBAYASHI, Katsumi NISHIKORI, Shoyu TANAKA
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Publication number: 20190238773Abstract: The present disclosure relates to a solid-state image pickup apparatus, a correction method, and an electronic apparatus, enabled to suppress an apparent uncomfortable feeling of an image output from a solid-state image pickup apparatus in which pixels of different OCL shapes are mounted mixedly. A solid-state image pickup apparatus according to an aspect of the present disclosure includes a pixel array in which a first pixel in which an OCL (On Chip Lens) of a standard size is formed and a second pixel in which an OCL of a size different from the standard size is formed are present mixedly, and a correction section that corrects a pixel value of the first pixel that is positioned in the vicinity of the second pixel among the first pixels on the pixel array. The present disclosure can be applied to, for example, a CMOS image sensor.Type: ApplicationFiled: June 22, 2017Publication date: August 1, 2019Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Takeru TSUZUKI, Katsumi NISHIKORI