Patents by Inventor Katsumi NISHIKORI

Katsumi NISHIKORI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11968462
    Abstract: The present disclosure relates to a solid-state image pickup apparatus, a correction method, and an electronic apparatus, enabled to suppress an apparent uncomfortable feeling of an image output from a solid-state image pickup apparatus in which pixels of different OCL shapes are mounted mixedly. A solid-state image pickup apparatus according to an aspect of the present disclosure includes a pixel array in which a first pixel in which an OCL (On Chip Lens) of a standard size is formed and a second pixel in which an OCL of a size different from the standard size is formed are present mixedly, and a correction section that corrects a pixel value of the first pixel that is positioned in the vicinity of the second pixel among the first pixels on the pixel array. The present disclosure can be applied to, for example, a CMOS image sensor.
    Type: Grant
    Filed: February 16, 2023
    Date of Patent: April 23, 2024
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Takeru Tsuzuki, Katsumi Nishikori
  • Patent number: 11888004
    Abstract: An imaging apparatus includes a pixel array unit including a plurality of pixel groups, each of the plurality of pixel groups being one of i) a normal pixel group including only normal pixels, or ii) a mixed pixel group including at least one normal pixel and at least one phase difference detection pixel, wherein the pixel array unit comprises at least one normal pixel group and at least one mixed pixel group. For each normal pixel group, the normal pixels receive light transmitted through a same colored color filter. For each mixed pixel group, the at least one phase difference detection pixel shares an on-chip lens with at least one other phase difference detection pixel and receives light transmitted through a same colored color filter as the at least one other phase difference detection pixel.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: January 30, 2024
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Keiichiro Takahashi, Kazuhito Kobayashi, Katsumi Nishikori, Shoyu Tanaka
  • Publication number: 20230402475
    Abstract: An imaging apparatus includes a pixel array unit including a plurality of pixel groups, each of the plurality of pixel groups being one of i) a normal pixel group including only normal pixels, or ii) a mixed pixel group including at least one normal pixel and at least one phase difference detection pixel. For each normal pixel group, the normal pixels receive light transmitted through a same colored color filter. For each mixed pixel group, the at least one phase difference detection pixel shares an on-chip lens with at least one other phase difference detection pixel and receives light transmitted through a same colored color filter as the at least one other phase difference detection pixel.
    Type: Application
    Filed: August 10, 2023
    Publication date: December 14, 2023
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Keiichiro TAKAHASHI, Kazuhito KOBAYASHI, Katsumi NISHIKORI, Shoyu TANAKA
  • Publication number: 20230209221
    Abstract: The present disclosure relates to a solid-state image pickup apparatus, a correction method, and an electronic apparatus, enabled to suppress an apparent uncomfortable feeling of an image output from a solid-state image pickup apparatus in which pixels of different OCL shapes are mounted mixedly. A solid-state image pickup apparatus according to an aspect of the present disclosure includes a pixel array in which a first pixel in which an OCL (On Chip Lens) of a standard size is formed and a second pixel in which an OCL of a size different from the standard size is formed are present mixedly, and a correction section that corrects a pixel value of the first pixel that is positioned in the vicinity of the second pixel among the first pixels on the pixel array. The present disclosure can be applied to, for example, a CMOS image sensor.
    Type: Application
    Filed: February 16, 2023
    Publication date: June 29, 2023
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Takeru TSUZUKI, Katsumi NISHIKORI
  • Patent number: 11632603
    Abstract: The present disclosure relates to a solid-state image pickup apparatus, a correction method, and an electronic apparatus, enabled to suppress an apparent uncomfortable feeling of an image output from a solid-state image pickup apparatus in which pixels of different OCL shapes are mounted mixedly. A solid-state image pickup apparatus according to an aspect of the present disclosure includes a pixel array in which a first pixel in which an OCL (On Chip Lens) of a standard size is formed and a second pixel in which an OCL of a size different from the standard size is formed are present mixedly, and a correction section that corrects a pixel value of the first pixel that is positioned in the vicinity of the second pixel among the first pixels on the pixel array. The present disclosure can be applied to, for example, a CMOS image sensor.
    Type: Grant
    Filed: November 5, 2020
    Date of Patent: April 18, 2023
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Takeru Tsuzuki, Katsumi Nishikori
  • Patent number: 11595603
    Abstract: The present disclosure relates to a solid-state image pickup apparatus, a correction method, and an electronic apparatus, enabled to suppress an apparent uncomfortable feeling of an image output from a solid-state image pickup apparatus in which pixels of different OCL shapes are mounted mixedly. A solid-state image pickup apparatus according to an aspect of the present disclosure includes a pixel array in which a first pixel in which an OCL (On Chip Lens) of a standard size is formed and a second pixel in which an OCL of a size different from the standard size is formed are present mixedly, and a correction section that corrects a pixel value of the first pixel that is positioned in the vicinity of the second pixel among the first pixels on the pixel array. The present disclosure can be applied to, for example, a CMOS image sensor.
    Type: Grant
    Filed: November 5, 2020
    Date of Patent: February 28, 2023
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Takeru Tsuzuki, Katsumi Nishikori
  • Publication number: 20210058577
    Abstract: The present disclosure relates to a solid-state image pickup apparatus, a correction method, and an electronic apparatus, enabled to suppress an apparent uncomfortable feeling of an image output from a solid-state image pickup apparatus in which pixels of different OCL shapes are mounted mixedly. A solid-state image pickup apparatus according to an aspect of the present disclosure includes a pixel array in which a first pixel in which an OCL (On Chip Lens) of a standard size is formed and a second pixel in which an OCL of a size different from the standard size is formed are present mixedly, and a correction section that corrects a pixel value of the first pixel that is positioned in the vicinity of the second pixel among the first pixels on the pixel array. The present disclosure can be applied to, for example, a CMOS image sensor.
    Type: Application
    Filed: November 5, 2020
    Publication date: February 25, 2021
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Takeru TSUZUKI, Katsumi NISHIKORI
  • Patent number: 10863124
    Abstract: The present disclosure relates to a solid-state image pickup apparatus, a correction method, and an electronic apparatus, enabled to suppress an apparent uncomfortable feeling of an image output from a solid-state image pickup apparatus in which pixels of different OCL shapes are mounted mixedly. A solid-state image pickup apparatus according to an aspect of the present disclosure includes a pixel array in which a first pixel in which an OCL (On Chip Lens) of a standard size is formed and a second pixel in which an OCL of a size different from the standard size is formed are present mixedly, and a correction section that corrects a pixel value of the first pixel that is positioned in the vicinity of the second pixel among the first pixels on the pixel array. The present disclosure can be applied to, for example, a CMOS image sensor.
    Type: Grant
    Filed: June 22, 2017
    Date of Patent: December 8, 2020
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Takeru Tsuzuki, Katsumi Nishikori
  • Publication number: 20200161352
    Abstract: An imaging apparatus includes a pixel array unit including a plurality of pixel groups, each of the plurality of pixel groups being one of i) a normal pixel group including only normal pixels, or ii) a mixed pixel group including at least one normal pixel and at least one phase difference detection pixel, wherein the pixel array unit comprises at least one normal pixel group and at least one mixed pixel group. For each normal pixel group, the normal pixels receive light transmitted through a same colored color filter. For each mixed pixel group, the at least one phase difference detection pixel shares an on-chip lens with at least one other phase difference detection pixel and receives light transmitted through a same colored color filter as the at least one other phase difference detection pixel.
    Type: Application
    Filed: July 25, 2018
    Publication date: May 21, 2020
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Keiichiro TAKAHASHI, Kazuhito KOBAYASHI, Katsumi NISHIKORI, Shoyu TANAKA
  • Publication number: 20190238773
    Abstract: The present disclosure relates to a solid-state image pickup apparatus, a correction method, and an electronic apparatus, enabled to suppress an apparent uncomfortable feeling of an image output from a solid-state image pickup apparatus in which pixels of different OCL shapes are mounted mixedly. A solid-state image pickup apparatus according to an aspect of the present disclosure includes a pixel array in which a first pixel in which an OCL (On Chip Lens) of a standard size is formed and a second pixel in which an OCL of a size different from the standard size is formed are present mixedly, and a correction section that corrects a pixel value of the first pixel that is positioned in the vicinity of the second pixel among the first pixels on the pixel array. The present disclosure can be applied to, for example, a CMOS image sensor.
    Type: Application
    Filed: June 22, 2017
    Publication date: August 1, 2019
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Takeru TSUZUKI, Katsumi NISHIKORI