Abstract: A polyimide precursor solution contains resin particles and a polyimide precursor. The resin particles in the polyimide precursor solution have a volume particle size distribution with one or more peaks. The volume frequency of a peak having the highest volume frequency of the one or more peaks accounts for 90% to 100% of the total volume frequency of all peaks of the volume particle size distribution.

Abstract: A polyimide laminated film includes a porous polyimide layer that has a porosity of from 30% to 90% and pores having a spherical shape and a non-porous polyimide layer that has a porosity of 5% or less.

Abstract: A porous film includes at least one porous polyimide film that includes a polyimide resin, an organic amine compound and a resin other than a polyimide resin, and that does not include a polar aprotic solvent, wherein a content of the organic amine compound is 0.001% by weight or higher with respect to a total weight of the porous polyimide film.

Abstract: A polyimide precursor solution contains resin particles and a polyimide precursor. The resin particles in the polyimide precursor solution have a volume particle size distribution with one or more peaks. The volume frequency of a peak having the highest volume frequency of the one or more peaks accounts for 90% to 100% of the total volume frequency of all peaks of the volume particle size distribution.

Abstract: A porous film includes at least one porous polyimide film that includes a polyimide resin, an organic amine compound and a resin other than a polyimide resin, and that does not include a polar aprotic solvent, wherein a content of the organic amine compound is 0.001% by weight or higher with respect to a total weight of the porous polyimide film.

Abstract: A polyimide precursor composition in which a resin and an organic amine compound are dispersed in an aqueous solvent, wherein the aqueous solvent contains 50% by weight or more of water and at least one organic solvent selected from a solvent group A consisting of a urea solvent, an amide solvent containing an alkoxy group, and an amide solvent containing an ester group in an amount of 5% by weight or more with respect to the total amount of the aqueous solvent, and the resin has a repeating unit represented by the following formula (I): wherein A indicates a tetravalent organic group, and B indicates a bivalent organic group.

Abstract: A polyimide precursor solution contains resin particles and a polyimide precursor. The resin particles in the polyimide precursor solution have a volume particle size distribution with one or more peaks. The volume frequency of a peak having the highest volume frequency of the one or more peaks accounts for 90% to 100% of the total volume frequency of all peaks of the volume particle size distribution.

Abstract: A porous polyimide shaped article has a thickness in a range from 550 ?m to 3,000 ?m and has a relative dielectric constant of 1.8 or less and a dielectric loss tangent of 0.01 or less at 1 MHz. The porous polyimide shaped article satisfies the following formula: 1.2?A?1.6 wherein A represents a square root of a ratio of a pore size D84 where a cumulative percentage by number of pores from smaller sizes is 84% to a pore size D16 where the cumulative percentage by number of the pores from smaller sizes is 16% ((D84/D16)1/2) in a pore size distribution measured by mercury intrusion porosimetry.

Abstract: A porous polyimide shaped article has a thickness in a range from 550 ?m to 3,000 ?m and has a relative dielectric constant of 1.8 or less and a dielectric loss tangent of 0.01 or less at 1 MHz. The porous polyimide shaped article satisfies the following formula: 1.2?A?1.6 wherein A represents a square root of a ratio of a pore size D84 where a cumulative percentage by number of pores from smaller sizes is 84% to a pore size D16 where the cumulative percentage by number of the pores from smaller sizes is 16% ((D84/D16)1/2) in a pore size distribution measured by mercury intrusion porosimetry.

Abstract: A rubber-particle-dispersed polyimide resin solution contains at least one resin selected from the group consisting of polyimide precursors and polyimides having a solubility of 1% by mass or more in an aprotic polar solvent; rubber particles; and a solvent including a poor solvent for the rubber particles.

Abstract: An organic electroluminescent device includes an anode and a cathode that are a pair of electrodes, at least one of the electrodes being transparent or translucent; and an organic compound layer interposed between the electrodes, the organic compound layer including at least one layer containing a cured film obtained from a composition that contains an amine compound having six or more crosslinkable groups. The cured film has a residual film ratio of 90% or more after a condition described below, and a rate of change in surface roughness Ra of the cured film before and after the condition described below is 0.99 or more: condition: placing toluene on the cured film and leaving toluene thereon for 30 seconds.

Abstract: A polyimide precursor solution includes an aqueous solution that contains water; a resin particle that does not dissolve in the aqueous solution; an inorganic particle; and a polyimide precursor.

Abstract: A polyimide precursor solution includes an aqueous solution that contains water; a resin particle that does not dissolve in the aqueous solution; inorganic particles that have a volume average particle diameter within a range of 0.001 ?m to 0.2 ?m; and a polyimide precursor.

Abstract: There is provided a method for producing a porous polyimide film, including a first step of forming a coating film containing a polyimide precursor solution where a polyimide precursor and an organic amine compound are dissolved in an aqueous solvent, and a resin particle incapable of dissolving in the polyimide precursor solution, followed by drying of the coating film to form a coat containing the polyimide precursor and the resin particle, and a second step of heating the coat to imidize the polyimide precursor and form a polyimide film, the second step including a treatment for removing the resin particle.

Abstract: A polyimide laminated film includes a porous polyimide layer that has a porosity of from 30% to 90% and pores having a spherical shape and a non-porous polyimide layer that has a porosity of 5% or less.

Abstract: A polyimide precursor solution contains resin particles and a polyimide precursor. The resin particles in the polyimide precursor solution have a volume particle size distribution with one or more peaks. The volume frequency of a peak having the highest volume frequency of the one or more peaks accounts for 90% to 100% of the total volume frequency of all peaks of the volume particle size distribution.

Abstract: A polyimide precursor solution includes resin particles, an aqueous solvent including water, a polyimide precursor, an organic amine compound, and a water-soluble nonionic surfactant.

Abstract: A porous film includes at least one porous polyimide film that includes a polyimide resin, an organic amine compound and a resin other than a polyimide resin, and that does not include a polar aprotic solvent, wherein a content of the organic amine compound is 0.001% by weight or higher with respect to a total weight of the porous polyimide film.

Abstract: Provided is a fluorine-containing resin particle dispersion including: fluorine-containing resin particles, a resin which is not dissolved in at least one solvent in a group of hydroxyl group-containing solvents including an alcohol-based solvent having 1 to 10 carbon atoms, containing no aromatic ring in the molecule structure, and a water-based medium, and which is adhered on the surface of the fluorine-containing resin particles, and at least one solvent, in which the resin is not dissolved, in the group of hydroxyl group-containing solvents, in which the fluorine-containing resin particles having the resin adhered on the surface thereof are dispersed.

Abstract: There is provided a method for producing a porous polyimide film, including a first step of forming a coating film containing a polyimide precursor solution where a polyimide precursor and an organic amine compound are dissolved in an aqueous solvent, and a resin particle incapable of dissolving in the polyimide precursor solution, followed by drying of the coating film to form a coat containing the polyimide precursor and the resin particle, and a second step of heating the coat to imidize the polyimide precursor and form a polyimide film, the second step including a treatment for removing the resin particle.