Patents by Inventor Katsumi Samejima

Katsumi Samejima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process of producing semiconductor chip with surface interconnection at bump
    Patent number: 7329562
    Abstract: A semiconductor chip including a bump projecting from a surface protective film thereof and a surface interconnection having a smaller height than the bump. The surface interconnection may project from the surface protective film or may be flush with the surface protective film. The surface interconnection may be connected to the bump. The bump may include a peripheral bump configured as surrounding a device formation region of the chip. The peripheral bump may be connected to the ground or a power source.
    Type: Grant
    Filed: January 30, 2004
    Date of Patent: February 12, 2008
    Assignee: Rohm Co., Ltd.
    Inventors: Nobuhisa Kumamoto, Katsumi Samejima
  • Semiconductor chip and production process therefor
    Patent number: 6707159
    Abstract: A semiconductor chip including a bump projecting from a surface protective film thereof and a surface interconnection having a smaller height than the bump. The surface interconnection may project from the surface protective film or may be flush with the surface protective film. The surface interconnection may be connected to the bump. The bump may include a peripheral bump configured as surrounding a device formation region of the chip. The peripheral bump may be connected to the ground or a power source.
    Type: Grant
    Filed: February 16, 2000
    Date of Patent: March 16, 2004
    Assignee: Rohm Co., Ltd.
    Inventors: Nobuhisa Kumamoto, Katsumi Samejima