Abstract: A semiconductor laser device produces a laser beam, which is adapted to be expanded into a linear laser beam for use as stimulating rays for an image read-out operation for reading out a radiation image having been stored on a stimulable phosphor sheet. The semiconductor laser device comprises a semiconductor laser chip for producing the laser beam, a package for accommodating the semiconductor laser chip therein, and a radiating window, which is fitted to the package and allows the laser beam having been produced by the semiconductor laser chip to pass therethrough. A surface of the radiating window is coated with an anti-reflection film having a reflectivity of at most 1.0% with respect to a wavelength of the laser beam having been produced by the semiconductor laser chip.

Abstract: An epoxy resin composition for semiconductor encapsulation capable of giving semiconductor devices of high reliability that do not cause short circuits even in pitch reduction in the interconnection electrode distance or the conductor wire distance therein as well as a semiconductor device using the same. The epoxy resin composition for semiconductor encapsulation, which comprises the following components (A) to (C): (A) an epoxy resin, (B) a phenolic resin, and (C) an inorganic filler for preventing semiconductors from short-circuiting in a step of semiconductor encapsulation.

Abstract: A process for producing an epoxy resin composition for photosemiconductor element encapsulation which, even when a filler or the like is not contained therein, can have a viscosity necessary for molding and hence be satisfactorily molded to give a cured resin less apt to have defects such as burrs or bubbles. The process, which is for producing an epoxy resin composition for photosemiconductor element encapsulation comprising an epoxy resin, a hardener and a hardening accelerator as constituent ingredients, comprises: a first step of melt-mixing the ingredients together; and a second step of regulating viscosity of the molten mixture obtained in the first step at a given temperature.

Abstract: An epoxy resin composition having a viscosity of from 50 to 400 P at 25° C. is disclosed. The composition provides by casting a resin plate, particularly a transparent resin plate for a liquid crystal display, which has satisfactory thickness precision.

Abstract: Disclosed herein is an optical scanner having a light source, a collimator lens, a first image-forming optics system with a cylindrical lens, and a second image-forming optics system with a rotating polygon mirror and an f&thgr; lens. In the optical scanner, a light beam is incident obliquely on the rotating polygon mirror with respect to both a horizontal scanning direction and a vertical scanning direction. The cylindrical lens is disposed so that its generating line is substantially parallel with a plane perpendicular to the axis of rotation of the rotating polygon mirror.

Abstract: An epoxy resin composition having a viscosity of from 50 to 400 P at 25° C. is disclosed. The composition provides by casting a resin plate, particularly a transparent resin plate for a liquid crystal display, which has satisfactory thickness precision.

Abstract: A process for producing an epoxy resin composition for photosemiconductor element encapsulation which, even when a filler or the like is not contained therein, can have a viscosity necessary for molding and hence be satisfactorily molded to give a cured resin less apt to have defects such as burrs or bubbles. The process, which is for producing an epoxy resin composition for photosemiconductor element encapsulation comprising an epoxy resin, a hardener and a hardening accelerator as constituent ingredients, comprises: a first step of melt-mixing the ingredients together; and a second step of regulating viscosity of the molten mixture obtained in the first step at a given temperature.

Abstract: An epoxy resin composition having a viscosity of from 50 to 400 P at 25° C. is disclosed. The composition provides by casting a resin plate, particularly a transparent resin plate for a liquid crystal display, which has satisfactory thickness precision.

Abstract: An epoxy resin composition for encapsulating a photosemi-conductor element excellent in releasing property from a mold in forming and in adhesion to the photosemi conductor element is provided. The epoxy resin composition comprises element comprising the following components (A) to (D): (A) an epoxy resin; (B) a hardener; (C) a silane coupling agent having an epoxy group, a mercapto group or an amino group; and (D) a releasing agent in which a molecule thereof has structure moieties represented by the following general formulas (1) and (2) and in which the weight ratio of the structure moiety represented by general formula (2) is 25% to 95% by weight based on the whole molecule, &Parenopenst;CH2CH2&Parenclosest;m  (1)  wherein m is a positive integer of 8 to 100 and &Parenopenst;CH2CH2O&Parenclosest;n  (2)  wherein n is a positive integer.

Abstract: An apparatus for feeding chip components is disclosed. The apparatus includes a first component reservoir for storing chip components in bulk, a second component reservoir for two-dimensionally storing the chip components in a space so that the chip components are not overlapped in their thickness direction, and a component alignment path for one-dimensionally aligning the chip components. The apparatus further includes an alignment plate for moving the chip components from the first component reservoir to the component alignment path thorough the second component reservoir by the upward and downward movements of the alignment plate. The apparatus further includes a movable plate, which moves in a predetermined direction when the chip components are caught or drawn between itself and the alignment plate, and a roller device for feeding the chip components in the component alignment path to a predetermined position.

Abstract: An imaging optical system for a light beam scanning system for causing a light bundle deflected by a deflector to form an image on a predetermined surface to be scanned and causing the image of the light bundle to scan the surface at a constant speed is provided with an anamorphic lens for compensating for tilt of the deflecting surface of the deflector. The imaging optical system satisfies formula0.ltoreq..phi.1/.phi..ltoreq.0.1.vertline.M.vertline.+0.45wherein .phi.1 represents the power of the anamorphic lens in the main scanning direction, .phi. represents the power of the entire imaging optical system in the main scanning direction and M represents the lateral magnification when the deflecting angle by the deflector is 0.

Abstract: A card terminal for settling transactions with a prepaid card or a credit card using comprising a card reader for reading data out of the card, a data writer for writing data on the card, a display for indicating the customer's data, transaction data, and stamp points, and a keyboard for inputting sales data, customer's data, or stamp point data. The card terminal has at least one of the functions from among inquiring about the transaction, cancellation of the transaction, purchase of commodities, calculation of the service points in accordance with an amount of transaction, display of the personal anniversary of the customer, and writing the details of a transaction, the service points, or personal data, even if the card is prepaid card or a credit card. The service point can be increased in accordance with the convenience of the stores, such as a bonus sales and customer's anniversary, by setting a multiple at the card terminal.

Abstract: A composition useful as an encapsulating material for photosemiconductor elements such as a photodetector or light emmitor comprises an epoxy resin, a hardener and at least one compound represented by the following general formula (1) or (2):CH.sub.3 CH.sub.2 --(--CH.sub.2 --CH.sub.2 --).sub.x --CH.sub.2 --CH.sub.2 --O--(--CH.sub.2 --CH.sub.2 --O--).sub.n --Y.sub.1 (1)[CH.sub.3 CH.sub.2 --(--CH.sub.2 --CH.sub.2 --).sub.x --CH.sub.2 --CH.sub.2 --O--(--CH.sub.2 --CH.sub.2 --O--).sub.n --RCOO--].sub.m --Y.sub.2(2)wherein Y.sub.1 represents --H, --RCOOH, --COR' or --R'; R' is an alkyl group with not more than 30 carbon atoms; R is a divalent organic group; Y.sub.2 represents a metal atom having a valence of at least one; the mean value for x is from 8-200; and n is set such that the weight ratio of the repeating unit --CH.sub.2 --CH.sub.2 --O-- accounts for from 25-95% by weight based on the whole compound; and m is a positive integer corresponding to the valence of Y.sub.2.

Abstract: In a light beam scanning system, a light beam deflected by a deflector is focused to form an image on a surface and the image is caused to scan the surface at a constant speed. A tilt correcting optical system for compensating for surface tilt in the deflector includes an optical element which is disposed between the deflector and the surface to be scanned and reflects the light beam, deflected by the deflector, to converge on the surface in a direction perpendicular to the direction in which the image scans the surface. The optical element is an in-mirror lens which has a refracting surface at its front face and has a reflecting surface at its rear end face. The refracting surface and the reflecting surfaces are both cylindrical and concave toward the deflector and the radius of curvature of the refracting surface is smaller than that of the reflecting surface.

Abstract: An apparatus for feeding chip components includes a component container for containing many chip components in bulk, a first component reservoir for storing the chip components in bulk. The component container is attached to the first component reservoir. The apparatus further includes a second component reservoir provided under the first component reservoir for two-dimensionally storing the chip components in a space so that the chip components are not overlapped in their thickness direction, and a component alignment path provided under the second component reservoir for one-dimensionally aligning the chip components. The apparatus further includes an alignment palate having first and second alignment portions. The first alignment portion is provided between the first component reservoir and the second component reservoir for two-dimensionally aligning the chip components and letting the chip components move down by their own weight.

Abstract: An optical condenser system for a light scanning apparatus includes a first lens which is a single lens formed of plastic and a second lens which is a plano-convex lens formed of glass and convex toward the scanning surface. The first lens is concave toward a deflector of the light scanning apparatus and each side of the first lens is an aspheric surface defined by the following formula (6). The first and second lens satisfying the following formulae (1) to (5)0.1f.ltoreq.d.sub.0 .ltoreq.0.3f (1)0.02f.ltoreq.d.sub.2 .ltoreq.0.2f (2)-1.0.times.10.sup.2 /f.sup.3 .ltoreq.a.sub.1 .ltoreq.-1.0/f.sup.3( 3)5.0.times.10/f.sup.5 .ltoreq.a.sub.2 .ltoreq.5.0.times.10.sup.3 /f.sup.5( 4 )-0.3/f.ltoreq.1/f.sub.1 .ltoreq.0.3f (5)z=ch.sup.2 /?1+{1-(1+K)c.sup.2 h.sup.2}.sup.1/2 !+a.sub.1 h.sup.4 +a.sub.2 h.sup.6 +a.sub.3 h.sup.8 +a.sub.4 h.sup.10 ( 6)wherein f represents the focal length (mm) of the whole system, d.sub.

Abstract: An f.theta. lens includes first and second lens groups arranged in this order from the entrance pupil side. The first lens group consists of a first lens having a negative or positive refracting power. The second lens group consists of a second lens having a positive refracting power and a third lens having a negative refracting power with the second and third lenses being cemented together. The second lens group has a positive refracting power as a whole. The following formulae (1) to (4) are satisfied.12.ltoreq..nu..sub.d2 -.nu..sub.d3 (1)-0.035.ltoreq..SIGMA.(.phi..sub.i /.nu..sub.di).ltoreq.0.005 (2)0.7.ltoreq..phi..sub.23 .ltoreq.2.0 (3)0.03.ltoreq.d.sub.12 .ltoreq.0.20 (4)wherein .phi..sub.i represents the power of i-th lens as numbered from the entrance pupil side standardized on the basis of the power of the whole system, .phi..sub.23 represents the power of the second lens group standardized on the basis of the power of the whole system, .nu..sub.

Abstract: In a condenser optical system for a light scanning system, a single lens focuses a light beam deflected by a reflecting surface of a deflector onto a surface to be scanned and causes the deflected light to scan the surface in a main scanning direction at a constant speed. A cylindrical mirror which has a refracting power only in a sub-scanning direction normal to the main scanning direction compensates for surface tilt of the reflecting surface. At least one surface of the single lens is toric to compensate for the surface tilt associated with the cylindrical mirror and the toric surface is aspheric in a main-scanning cross-section.

Abstract: A photosemiconductor device and an epoxy resin composition for use in molding a photosemiconductor used for the photosemiconductor device, the photosemiconductor device comprises a photosemiconductor element molded with a cured transparent epoxy resin composition, the cured transparent epoxy resin composition having a refractive index distribution curve characterized by the following (A), (B), and (C):(A) the refractive index difference X between refractive index values (b) and (c), which respectively are lower and higher than refractive index value (a) corresponding to the maximum peak of the refractive index distribution curve and respectively correspond to those points on the refractive index distribution curve which have a relative height of 20 with the height of the maximum peak being taken as 100, is 0.

Abstract: A central processing unit is cascade-connected with a plurality of I/O units, and a bus interconnecting them comprises a plurality of data lines for transmitting a control command signal, an address signal and a data signal on a time shared basis, a plurality of tag lines, each transmitting a tag signal indicating which one of the signals is provided on the data lines, and a clock line for transmitting a clock signal for these signals.