Patents by Inventor Katsumi Shizu

Katsumi Shizu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6735995
    Abstract: A shaping device for producing a U-shaped conductor includes a holding portion, a feeding portion, a core metal portion and a shaping portion. The core metal portion includes a core metal and an upper guide portion. The core metal forms a die. The upper guide portion restrains upward movement of the conductor material during the shaping operation. The shaping portion includes a shaping element and a lower guide. The shaping element shapes the conductor material into the U-shape by urging the conductor material along the core metal. The lower guide restrains downward movement of the conductor material during the shaping operation. It is possible to move the shaping element downwardly after the conductor material is shaped into the U-shape. The conductor material can be fed forward without returning the shaping element to its initial position.
    Type: Grant
    Filed: November 7, 2001
    Date of Patent: May 18, 2004
    Assignee: Denso Corporation
    Inventor: Katsumi Shizu
  • Patent number: 6546617
    Abstract: A method of peeling off a coating of an elliptical cross sectional insulated conductive wire has a groove forming process of forming a groove nearly perpendicular to a longitudinal direction of the insulated conductive wire at given positions within a peeling region thereof, a first peeling process of peeling off the coating by moving a pair of first cutting edges in a longitudinal direction of the insulated conductive wire and perpendicularly to a longer diameter direction of the cross section thereof toward the groove from opposite ends of the peeling region, and a second peeling process of peeling off the coating at the peeling region by moving a pair of second cutting edges in a direction perpendicular to the longitudinal direction and in parallel with the longer diameter direction of the cross section thereof. As a result, the coating all around the outer circumference of the insulated conductive wire at the peeling region may be completely peeled off.
    Type: Grant
    Filed: March 31, 2000
    Date of Patent: April 15, 2003
    Assignee: Denso Corporation
    Inventors: Mitsuyuki Hayashi, Katsumi Shizu, Masaru Sugiyama, Yoshio Naka, Kazuki Maesoba
  • Publication number: 20020059820
    Abstract: A shaping device for producing a U-shaped conductor includes a holding portion, a feeding portion, a core metal portion and a shaping portion. The core metal portion includes a core metal and an upper guide portion. The core metal forms a die. The upper guide portion restrains upward movement of the conductor material during the shaping operation. The shaping portion includes a shaping element and a lower guide. The shaping element shapes the conductor material into the U-shape by urging the conductor material along the core metal. The lower guide restrains downward movement of the conductor material during the shaping operation. It is possible to move the shaping element downwardly after the conductor material is shaped into the U-shape. The conductor material can be fed forward without returning the shaping element to its initial position.
    Type: Application
    Filed: November 7, 2001
    Publication date: May 23, 2002
    Inventor: Katsumi Shizu