Patents by Inventor Katsumichi KOGURE

Katsumichi KOGURE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin composition for circuit board, and metal-base circuit board in which same is used
    Patent number: 11133445
    Abstract: Provided are a metal-base circuit board having excellent solder crack resistance, thermal conductivity, adhesive property, and insulation property and a resin composition for a circuit board used for the metal-base circuit board. A resin composition for a circuit board comprises a vinylsilyl group-containing polysiloxane (having a vinylsilyl group equivalent of 0.005 to 0.045 mol/kg) comprising (A) a dual-end type vinylsilyl group-containing polysiloxane having a weight average molecular weight of 30,000 to 80,000 and (B) a side-chain dual-end type vinylsilyl group-containing polysiloxane having a weight average molecular weight of 100,000 or more, a hydrosilyl group-containing polysiloxane (having a hydrosilyl group equivalent of 6 mol/kg or more), and an inorganic filler at 60 to 80% by volume. The mass ratio of (A) to (B), (A)/(B), is 80/20 to 30/70, and the molar ratio of (C) a hydrosilyl group to (D) a vinylsilyl group, (C)/(D), is 2.5 to 5.0.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: September 28, 2021
    Assignee: DENKA COMPANY LIMITED
    Inventors: Taiki Nishi, Katsunori Yashima, Yuki Kimoto, Ikuo Suyama, Katsumichi Kogure
  • RESIN COMPOSITION FOR CIRCUIT BOARD, AND METAL-BASE CIRCUIT BOARD IN WHICH SAME IS USED
    Publication number: 20190355885
    Abstract: Provided are a metal-base circuit board having excellent solder crack resistance, thermal conductivity, adhesive property, and insulation property and a resin composition for a circuit board used for the metal-base circuit board. A resin composition for a circuit board comprises a vinylsilyl group-containing polysiloxane (having a vinylsilyl group equivalent of 0.005 to 0.045 mol/kg) comprising (A) a dual-end type vinylsilyl group-containing polysiloxane having a weight average molecular weight of 30,000 to 80,000 and (B) a side-chain dual-end type vinylsilyl group-containing polysiloxane having a weight average molecular weight of 100,000 or more, a hydrosilyl group-containing polysiloxane (having a hydrosilyl group equivalent of 6 mol/kg or more), and an inorganic filler at 60 to 80% by volume. The mass ratio of (A) to (B), (A)/(B), is 80/20 to 30/70, and the molar ratio of (C) a hydrosilyl group to (D) a vinylsilyl group, (C)/(D), is 2.5 to 5.0.
    Type: Application
    Filed: March 16, 2018
    Publication date: November 21, 2019
    Applicant: DENKA COMPANY LIMITED
    Inventors: Taiki NISHI, Katsunori YASHIMA, Yuki KIMOTO, Ikuo SUYAMA, Katsumichi KOGURE