Abstract: Provided is a novel carbonization treatment method for carbonizing a biomass material containing a large amount of water at an extremely low temperature, and a method for producing carbonized biomass. A water-containing biomass material is carbonized while maintaining the biomass material under treatment conditions including an oxygen-containing atmosphere and a temperature range of 70° C. or greater and less than 100° C., without a drying step for removing or reducing the water forcibly. At this time, preferably the water content (percentage) of the biomass material at the start of carbonization while maintained under the treatment conditions is within a range of 40 to 80% inclusive, and preferably the biomass material is thus maintained for two weeks or longer.

Abstract: Provided is a novel carbonization treatment method for carbonizing a biomass material containing a large amount of water at an extremely low temperature, and a method for producing carbide. A water-containing biomass material (10) is carbonized while maintaining the biomass material (10) under treatment conditions including an oxygen-containing atmosphere and a temperature range of 70° C. or greater and less than 100° C., without a drying step for removing or reducing the water forcibly. At this time, preferably the water content (percentage) of the biomass material (10) at the start of carbonization while maintained under the treatment conditions is within a range of 40 to 80% inclusive, and preferably the biomass material (10) is thus maintained for two weeks or longer.

Abstract: A soldering device comprising: a first treatment part that sets a component having an electrode; a second treatment part separated by an opening-closing unit, the second treatment part sending the component on to a third treatment part; the third treatment part separated by an opening-closing unit, the third treatment part causing the component to contact an organic fatty-acid-containing solution and move horizontally; a fourth treatment part having a unit for moving the component to a space portion and causing molten solder to adhere to the electrode; and a unit for removing excess molten solder; a fifth treatment part for horizontally moving the component moved downward by the fourth treatment part; a sixth treatment part separated by an opening-closing unit, the sixth treatment part sending the component on to a seventh treatment part; and the seventh treatment part separated by an opening-closing unit, the seventh treatment part taking out the component.

Abstract: Provided are a soldering device and method which allow for soldering at low cost with high yield and high reliability.

Abstract: Provided is a space-saving soldering device that can perform allowing high-reliability soldering at a low cost and a high yield be produced at low cost with a high yield.

Abstract: Provided are a soldering device and a soldering method which allow for soldering at low cost with high yield and high reliability. The soldering device has: first organic fatty acid-containing solution bath 21 in which workpiece member 10 having a copper electrode is immersed in organic fatty acid-containing solution 31a; space section 24 having a steam atmosphere of organic fatty acid-containing solution 31b, the space section horizontally having ejection unit 33 to spray a jet stream of a molten solder to the copper electrode provided on workpiece member 10 and ejection unit 34 to spray a liquid to an excess of the molten solder for removal; and second organic fatty acid-containing solution bath 23 in which workpiece member 10 from which the excess of the molten solder is removed in space section 24 is immersed again in organic fatty acid-containing solution 31c.

Abstract: A method of treating biomass material includes: placing biomass material in a container; then setting an initial condition of the container including (a) an oxygen containing atmosphere, (b) a temperature range from 55 degree Celsius to 80 degree Celsius,(c) a pressure range from atmospheric pressure to 15 atmospheric pressure, and (d) carbon monoxide concentration equal to or greater than 100 ppm; increasing temperature of the biomass material over 80 degree Celsius; setting a continuation condition including (i) the oxygen containing atmosphere, (ii) the pressure range from atmospheric pressure to 15 atmospheric pressure, and (iii) a carbon monoxide concentration equal to or greater than 100 ppm; and maintaining the continuation condition, in order to spontaneously increase temperature of the biomass material over at least 150 degree Celsius, and to achieve volume reduction or carbonization of the biomass material.

Abstract: Provided is a solder bump forming method capable of forming solder bumps having a desired constant thickness, without any failure such as copper corrosion, on a mounting board such as a printed circuit board having fine copper electrodes. The solder bump forming method includes: a process in which a prepared mask (5) is placed on a prepared substrate (1) and then a molten solder jet is blown to fill an opening of the mask (5) with molten solder (11a) until the molten solder (11a) exceeds the thickness of the mask (5); a process of removing a part of the molten solder (11a) that exceeds the thickness of the mask (5) to form a solder bump (11) having a predetermined thickness; and a process of removing the mask (5). The molten solder (11a) is molten lead-free solder that includes tin as a main ingredient and at least nickel as a sub ingredient, and further includes one or more other ingredients such as silver, copper, and germanium.

Abstract: Provided are a soldering device and method which allow for oldering at low cost with high yield and high reliability.

Abstract: Provided is a method for manufacturing a component having an electrode corrosion preventing layer by performing the low-cost, high-yield and highly reliable soldering, can be provided. The method for manufacturing a component includes: a step of preparing component 10? having electrode 2; a step of contacting first organic fatty acid-containing solution 3a with electrode 2; a step of adhering first molten solder 5a onto electrode 2 by contacting first molten solder 5a with electrode 2; a step of ejecting a gas flow or a liquid flow to adhered first molten solder 5a to remove excess first molten solder 5a in first molten solder 5a adhered onto electrode 2; and a step of cooling electrode 2 from which excess first molten solder 5a has been removed to less than a melting point of first molten solder 5a.

Abstract: Provided are a soldering device and a soldering method which allow for soldering at low cost with high yield and high reliability. The soldering device has: first organic fatty acid-containing solution bath 21 in which workpiece member 10 having a copper electrode is immersed in organic fatty acid-containing solution 31a; space section 24 having a steam atmosphere of organic fatty acid-containing solution 31b, the space section horizontally having ejection unit 33 to spray a jet stream of a molten solder to the copper electrode provided on workpiece member 10 and ejection unit 34 to spray a liquid to an excess of the molten solder for removal; and second organic fatty acid-containing solution bath 23 in which workpiece member 10 from which the excess of the molten solder is removed in space section 24 is immersed again in organic fatty acid-containing solution 31c.

Abstract: A method of treating biomass material, which can achieve volume reduction or carbonization of biomass material can be achieved at extremely low cost, is disclosed.