Abstract: A flexible printed circuit board of the present invention includes an insulating base film and an electrode stacked on a first surface of the base film, in which the electrode includes a low-melting-point metal layer on a surface of the electrode, and a plate- or strip-like rigid member electrically insulated from the electrode is disposed in a region of a second surface of the base film opposite from the electrode.

Abstract: A flexible printed circuit board of the present invention includes an insulating base film and an electrode stacked on a first surface of the base film, in which the electrode includes a low-melting-point metal layer on a surface of the electrode, and a plate- or strip-like rigid member electrically insulated from the electrode is disposed in a region of a second surface of the base film opposite from the electrode.

Abstract: Provided are a substrate for a printed wiring board, and a printed wiring board, which are not limited in size because vacuum equipment is not necessary for the production, in which an organic adhesive is not used, and which can include a conductive layer (copper foil layer) having a sufficiently small thickness. Also provided are a method for producing the substrate for a printed wiring board, and a method for producing the printed wiring board. A substrate for a printed wiring board includes an insulating base, a first conductive layer that is stacked on the insulating base, and a second conductive layer that is stacked on the first conductive layer, in which the first conductive layer is a coating layer composed of a conductive ink containing metal particles, and the second conductive layer is a plating layer.

Abstract: Provided are a substrate for a printed wiring board, and a printed wiring board, which are not limited in size because vacuum equipment is not necessary for the production, in which an organic adhesive is not used, and which can include a conductive layer (copper foil layer) having a sufficiently small thickness. Also provided are a method for producing the substrate for a printed wiring board, and a method for producing the printed wiring board. A substrate for a printed wiring board includes an insulating base, a first conductive layer that is stacked on the insulating base, and a second conductive layer that is stacked on the first conductive layer, in which the first conductive layer is a coating layer composed of a conductive ink containing metal particles, and the second conductive layer is a plating layer.

Abstract: Provided is a different-pitch flat cable connection structure for connecting a first flat-cable part that includes a plurality of first conductors arranged in a stripe pattern with a first pitch to a second flat-cable part that includes a plurality of second conductors arranged in a stripe pattern with a second pitch smaller than the first pitch, and establishing electrical continuity between the first conductors and the second conductors. The different-pitch flat cable connection structure includes a connection sheet laminated on one surface side of ends of the first conductors and ends of the second conductors in which at least the one surface side of the ends is exposed.

Abstract: Provided is a different-pitch flat cable connection structure for connecting a first flat-cable part that includes a plurality of first conductors arranged in a stripe pattern with a first pitch to a second flat-cable part that includes a plurality of second conductors arranged in a stripe pattern with a second pitch smaller than the first pitch, and establishing electrical continuity between the first conductors and the second conductors. The different-pitch flat cable connection structure includes a connection sheet laminated on one surface side of ends of the first conductors and ends of the second conductors in which at least the one surface side of the ends is exposed.

Abstract: Provided are a substrate for a printed wiring board, and a printed wiring board, which are not limited in size because vacuum equipment is not necessary for the production, in which an organic adhesive is not used, and which can include a conductive layer (copper foil layer) having a sufficiently small thickness. Also provided are a method for producing the substrate for a printed wiring board, and a method for producing the printed wiring board. A substrate 1 for a printed wiring board includes an insulating base 11, a first conductive layer 12 that is stacked on the insulating base 11, and a second conductive layer 13 that is stacked on the first conductive layer 12, in which the first conductive layer 12 is a coating layer composed of a conductive ink containing metal particles, and the second conductive layer 13 is a plating layer.

Abstract: Provided are a substrate for a printed wiring board, and a printed wiring board, which are not limited in size because vacuum equipment is not necessary for the production, in which an organic adhesive is not used, and which can include a conductive layer (copper foil layer) having a sufficiently small thickness. Also provided are a method for producing the substrate for a printed wiring board, and a method for producing the printed wiring board. A substrate 1 for a printed wiring board includes an insulating base 11, a first conductive layer 12 that is stacked on the insulating base 11, and a second conductive layer 13 that is stacked on the first conductive layer 12, in which the first conductive layer 12 is a coating layer composed of a conductive ink containing metal particles, and the second conductive layer 13 is a plating layer.

Abstract: In a processing method of a fine structure according to the present invention, an opposed platen (211) is moved from a retreat position to a molding/processing position, so that a film (1) is pressed against a mold (5) and processed. Thereafter a second block (211b) is separated from a first block (211a). Thus, improvement of the cooling rate for the opposed platen (211) can be attained by reducing the total thermal capacity of the opposed platen (211) by reducing the volume of the opposed platen (211) in cooling and physically discharging heat stored in the opposed platen (211). Thus, cooling efficiency for the opposed platen (211) is improved, and the heat cycle of the opposed platen (211) can be reduced.

Abstract: [Problem] To enable mounting a part on the rear surface at the back of a connection part on a PCB to be connected with a FPC. [Means for Solving the Problem] Connection parts are provided such that a conductor wiring of a first circuit board and a conductor wiring of a second circuit board are connected with an anisotropic conductive adhesive which is made of an insulative resin including needle-shaped or linear chain-shaped metal powders oriented in a thickness direction, i.e., adhesion direction, and a part is mounted on at least either one of the first and the second circuit boards, the part being mounted on the rear surface at the back opposed to the surface where the connection part is formed.

Abstract: In a processing method of a fine structure according to the present invention, an opposed platen (211)is moved from a retreat position to a molding/processing position, so that a film (1) is pressed against a mold (5) and processed. Thereafter a second block (211b) is separated from a first block (211a). Thus, improvement of the cooling rate for the opposed platen (211) can be attained by reducing the total thermal capacity of the opposed platen (211) by reducing the volume of the opposed platen (211) in cooling and physically discharging heat stored in the opposed platen (211). Thus, cooling efficiency for the opposed platen (211) is improved, and the heat cycle of the opposed platen (211) can be reduced.