Patents by Inventor Katsunari Moriai

Katsunari Moriai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9762203
    Abstract: A piezoelectric device has: a ceramic substrate having a first principal surface and a second principal surface opposed to each other; a piezoelectric element arranged on the first principal surface; a frame having a first face and a second face opposed to each other and arranged on the ceramic substrate so as to surround the piezoelectric element; a metal layer arranged on the second face of the frame; and a metal lid arranged on the metal layer so as to close a space surrounded by the frame. The first face of the frame is in contact with the first principal surface of the ceramic substrate. The metal layer and the metal lid are joined to each other by resistance welding. The frame has a composite portion containing a metal and a metal oxide and the composite portion includes the second face and is in contact with the metal layer.
    Type: Grant
    Filed: January 14, 2015
    Date of Patent: September 12, 2017
    Assignee: TDK CORPORATION
    Inventors: Takeshi Yanata, Yo Saito, Kazuto Takeya, Katsunari Moriai, Takashi Inagaki, Takahiro Itami, Takeshi Oyanagi, Hitoshi Ishida
  • Patent number: 9726552
    Abstract: Provided is a piezoelectric device capable of improving measurement precision of a temperature of a piezoelectric element. A piezoelectric device (1) includes a package (2) including a housing member (4) having a thermistor substrate (3) and a frame (7) provided to project from a first main surface (3a) of the thermistor substrate (3) and in which a housing part (6) is formed by the first main surface (3a) and the frame (7) and a lid (9) provided on the frame (7) to cover a space (5) of the housing part (6), and a piezoelectric vibration element (5) provided on the first main surface (3a) of the thermistor substrate (3) in the housing part (6), wherein the thermistor substrate (3) is a multilayer negative temperature coefficient (NTC) thermistor.
    Type: Grant
    Filed: March 9, 2015
    Date of Patent: August 8, 2017
    Assignee: TDK CORPORATION
    Inventors: Takeshi Yanata, Yo Saito, Kazuto Takeya, Katsunari Moriai, Takashi Inagaki, Takahiro Itami, Takeshi Oyanagi, Hitoshi Ishida
  • Publication number: 20150276504
    Abstract: Provided is a piezoelectric device capable of improving measurement precision of a temperature of a piezoelectric element. A piezoelectric device (1) includes a package (2) including a housing member (4) having a thermistor substrate (3) and a frame (7) provided to project from a first main surface (3a) of the thermistor substrate (3) and in which a housing part (6) is formed by the first main surface (3a) and the frame (7) and a lid (9) provided on the frame (7) to cover a space (5) of the housing part (6), and a piezoelectric vibration element (5) provided on the first main surface (3a) of the thermistor substrate (3) in the housing part (6), wherein the thermistor substrate (3) is a multilayer negative temperature coefficient (NTC) thermistor.
    Type: Application
    Filed: March 9, 2015
    Publication date: October 1, 2015
    Inventors: Takeshi YANATA, Yo SAITO, Kazuto TAKEYA, Katsunari MORIAI, Takashi INAGAKI, Takahiro ITAMI, Takeshi OYANAGI, Hitoshi ISHIDA
  • Patent number: 9142340
    Abstract: An element body has first and second faces opposed to each other. A first conductor has one end exposed in a first face and the other end located in the element body. The second conductor has one end exposed in a second face and the other end located in the element body. The element body has a first element body section having the nonlinear voltage-current characteristics and a second element body section in which an electric current is more likely to flow than in the first element body section. The first element body section is located at least in part between the first conductor and the second conductor, in a direction in which the first conductor and the second conductor are separated from each other. The other end of the first conductor and the other end of the second conductor are located in the second element body section.
    Type: Grant
    Filed: December 11, 2013
    Date of Patent: September 22, 2015
    Assignee: TDK CORPORATION
    Inventors: Takahiro Itami, Naoyoshi Yoshida, Katsunari Moriai
  • Publication number: 20150249199
    Abstract: A piezoelectric device has: a ceramic substrate having a first principal surface and a second principal surface opposed to each other; a piezoelectric element arranged on the first principal surface; a frame having a first face and a second face opposed to each other and arranged on the ceramic substrate so as to surround the piezoelectric element; a metal layer arranged on the second face of the frame; and a metal lid arranged on the metal layer so as to close a space surrounded by the frame. The first face of the frame is in contact with the first principal surface of the ceramic substrate. The metal layer and the metal lid are joined to each other by resistance welding. The frame has a composite portion containing a metal and a metal oxide and the composite portion includes the second face and is in contact with the metal layer.
    Type: Application
    Filed: January 14, 2015
    Publication date: September 3, 2015
    Inventors: Takeshi YANATA, Yo SAITO, Kazuto TAKEYA, Katsunari MORIAI, Takashi INAGAKI, Takahiro ITAMI, Takeshi OYANAGI, Hitoshi ISHIDA
  • Publication number: 20140167909
    Abstract: An element body has first and second faces opposed to each other. A first conductor has one end exposed in a first face and the other end located in the element body. The second conductor has one end exposed in a second face and the other end located in the element body. The element body has a first element body section having the nonlinear voltage-current characteristics and a second element body section in which an electric current is more likely to flow than in the first element body section. The first element body section is located at least in part between the first conductor and the second conductor, in a direction in which the first conductor and the second conductor are separated from each other. The other end of the first conductor and the other end of the second conductor are located in the second element body section.
    Type: Application
    Filed: December 11, 2013
    Publication date: June 19, 2014
    Applicant: TDK CORPORATION
    Inventors: Takahiro ITAMI, Naoyoshi YOSHIDA, Katsunari MORIAI
  • Patent number: 8552831
    Abstract: A chip varistor is provided with a varistor section and a plurality of terminal electrodes. The varistor section is comprised of a sintered body containing ZnO as a major component, exhibits the nonlinear voltage-current characteristics, and has a pair of principal surfaces opposed to each other. The plurality of terminal electrodes are connected each to the varistor section. Each of the terminal electrodes has a first electrode portion connected to either of the principal surfaces and a second electrode portion connected to the first electrode portion.
    Type: Grant
    Filed: August 16, 2012
    Date of Patent: October 8, 2013
    Assignee: TDK Corporation
    Inventors: Kaname Ueda, Katsunari Moriai, Takahiro Itami
  • Patent number: 8525634
    Abstract: A chip varistor is provided with a varistor section, a plurality of electroconductive sections, and a plurality of terminal electrodes. The varistor section is comprised of a sintered body containing ZnO as a major component and is configured to exhibit the nonlinear voltage-current characteristics. The plurality of electroconductive sections are comprised of sintered bodies containing ZnO as a major component and arranged with the varistor section in between, and each electroconductive section has a first principal surface connected to the varistor section and a second principal surface opposed to the first principal surface. The plurality of terminal electrodes are connected respectively to the corresponding electroconductive sections. Each terminal electrode has a first electrode portion connected to the second principal surface and a second electrode portion connected to the first electrode portion.
    Type: Grant
    Filed: August 16, 2012
    Date of Patent: September 3, 2013
    Assignee: TDK Corporation
    Inventors: Kaname Ueda, Katsunari Moriai, Takahiro Itami
  • Patent number: 8508325
    Abstract: A chip varistor is provided with a varistor section, a plurality of electroconductive sections, and a plurality of terminal electrodes. The varistor section is comprised of a sintered body containing ZnO as a major component and exhibits the nonlinear voltage-current characteristics. The plurality of electroconductive sections are arranged on both sides of the varistor section and each electroconductive section has a first principal surface connected to the varistor section and a second principal surface opposed to the first principal surface. The terminal electrodes are connected to the respective second principal surfaces of the electroconductive sections.
    Type: Grant
    Filed: November 14, 2011
    Date of Patent: August 13, 2013
    Assignee: TDK Corporation
    Inventors: Kaname Ueda, Katsunari Moriai, Takahiro Itami
  • Patent number: 8471673
    Abstract: A varistor is provided with a varistor element body, a plurality of internal electrodes arranged in the varistor element body so as to sandwich a partial region of the varistor element body between them, and a plurality of external electrodes arranged on the surface of the varistor element body and connected to the corresponding internal electrodes. The external electrode has a sintered electrode layer formed by attaching an electroconductive paste containing an alkali metal to the surface of the varistor element body and sintering it. The varistor element body has a high-resistance region formed by diffusing the alkali metal in the electroconductive paste into the varistor element body from an interface between the surface of the varistor element body and the sintered electrode layer.
    Type: Grant
    Filed: July 10, 2012
    Date of Patent: June 25, 2013
    Assignee: TDK Corporation
    Inventors: Hitoshi Tanaka, Katsunari Moriai, Takahiro Itami
  • Publication number: 20130049923
    Abstract: A chip varistor is provided with a varistor section, a plurality of electroconductive sections, and a plurality of terminal electrodes. The varistor section is comprised of a sintered body containing ZnO as a major component and is configured to exhibit the nonlinear voltage-current characteristics. The plurality of electroconductive sections are comprised of sintered bodies containing ZnO as a major component and arranged with the varistor section in between, and each electroconductive section has a first principal surface connected to the varistor section and a second principal surface opposed to the first principal surface. The plurality of terminal electrodes are connected respectively to the corresponding electroconductive sections. Each terminal electrode has a first electrode portion connected to the second principal surface and a second electrode portion connected to the first electrode portion.
    Type: Application
    Filed: August 16, 2012
    Publication date: February 28, 2013
    Applicant: TDK CORPORATION
    Inventors: Kaname UEDA, Katsunari MORIAI, Takahiro ITAMI
  • Publication number: 20130049922
    Abstract: A chip varistor is provided with a varistor section and a plurality of terminal electrodes. The varistor section is comprised of a sintered body containing ZnO as a major component, exhibits the nonlinear voltage-current characteristics, and has a pair of principal surfaces opposed to each other. The plurality of terminal electrodes are connected each to the varistor section. Each of the terminal electrodes has a first electrode portion connected to either of the principal surfaces and a second electrode portion connected to the first electrode portion.
    Type: Application
    Filed: August 16, 2012
    Publication date: February 28, 2013
    Applicant: TDK CORPORATION
    Inventors: Kaname UEDA, Katsunari MORIAI, Takahiro ITAMI
  • Publication number: 20130021133
    Abstract: A varistor is provided with a varistor element body, a plurality of internal electrodes arranged in the varistor element body so as to sandwich a partial region of the varistor element body between them, and a plurality of external electrodes arranged on the surface of the varistor element body and connected to the corresponding internal electrodes. The external electrode has a sintered electrode layer formed by attaching an electroconductive paste containing an alkali metal to the surface of the varistor element body and sintering it. The varistor element body has a high-resistance region formed by diffusing the alkali metal in the electroconductive paste into the varistor element body from an interface between the surface of the varistor element body and the sintered electrode layer.
    Type: Application
    Filed: July 10, 2012
    Publication date: January 24, 2013
    Applicant: TDK CORPORATION
    Inventors: Hitoshi TANAKA, Katsunari MORIAI, Takahiro ITAMI
  • Publication number: 20120139688
    Abstract: A chip varistor is provided with a varistor section, a plurality of electroconductive sections, and a plurality of terminal electrodes. The varistor section is comprised of a sintered body containing ZnO as a major component and exhibits the nonlinear voltage-current characteristics. The plurality of electroconductive sections are arranged on both sides of the varistor section and each electroconductive section has a first principal surface connected to the varistor section and a second principal surface opposed to the first principal surface. The terminal electrodes are connected to the respective second principal surfaces of the electroconductive sections.
    Type: Application
    Filed: November 14, 2011
    Publication date: June 7, 2012
    Applicant: TDK CORPORATION
    Inventors: Kaname UEDA, Katsunari MORIAI, Takahiro ITAMI
  • Patent number: 8106506
    Abstract: An electronic component has an element body, and a plurality of external electrodes formed on one principal face of the element body. Each external electrode has a first electrode layer joined to the one principal face of the element body, and a second electrode layer joined as laid on an inside region inside an edge of the first electrode layer. An apical surface of the second electrode layer is planar. A joint portion in the second electrode layer to the first electrode layer is rounded.
    Type: Grant
    Filed: March 18, 2009
    Date of Patent: January 31, 2012
    Assignee: TDK Corporation
    Inventors: Yukihiro Murakami, Yoshihiko Satoh, Katsunari Moriai, Kazuto Takeya, Satoshi Kurimoto
  • Patent number: 7995326
    Abstract: A chip-type electronic component has: a ceramic element body; a plurality of first and second internal electrodes arranged in the ceramic element body so as to be opposed at least in part to each other; a first external connection conductor to which the plurality of first internal electrodes are connected; a second external connection conductor to which the plurality of second internal electrodes are connected; first and second terminal electrodes; a first internal connection conductor arranged in the ceramic element body and connecting the first external connection conductor and the first terminal electrode; and a second internal connection conductor arranged in the ceramic element body and connecting the second external connection conductor and the second terminal electrode.
    Type: Grant
    Filed: May 21, 2009
    Date of Patent: August 9, 2011
    Assignee: TDK Corporation
    Inventors: Kaname Ueda, Dai Matsuoka, Naoki Chida, Izuru Soma, Hisayoshi Saito, Katsunari Moriai
  • Publication number: 20100071949
    Abstract: An electronic component has an element body, and a plurality of external electrodes formed on one principal face of the element body. Each external electrode has a first electrode layer joined to the one principal face of the element body, and a second electrode layer joined as laid on an inside region inside an edge of the first electrode layer. An apical surface of the second electrode layer is planar. A joint portion in the second electrode layer to the first electrode layer is rounded.
    Type: Application
    Filed: March 18, 2009
    Publication date: March 25, 2010
    Applicant: TDK CORPORATION
    Inventors: Yukihiro MURAKAMI, Yoshihiko SATOH, Katsunari MORIAI, Kazuto TAKEYA, Satoshi KURIMOTO
  • Patent number: 7652554
    Abstract: An object of the present invention is to provide a multilayer filter constructed so as to be less likely to suffer peeling between a varistor part and an inductor part. A multilayer filter 10 as a preferred embodiment has a structure in which a varistor part 20 and an inductor part are stacked. The varistor part 30 consists of a stack of varistor layers 31, 32 with internal electrodes 31a, 32a, and the varistor layers contain ZnO as a principal component, and contain at least one element selected from the group consisting of Pr and Bi, Co, and Al as additives. The inductor part 20 consists of a stack of inductor layers 21-24 with conductor patterns 21a-24a, and the inductor layers contain ZnO as a principal component and substantially contain neither Co nor Al.
    Type: Grant
    Filed: May 1, 2006
    Date of Patent: January 26, 2010
    Assignee: TDK Corporation
    Inventors: Katsunari Moriai, Dai Matsuoka, Takahiro Sato
  • Patent number: 7649435
    Abstract: A multilayer chip varistor comprises a multilayer body in which a plurality of varistor portions are arranged along a predetermined direction, and a plurality of terminal electrodes. Each varistor portion has a varistor layer to exhibit nonlinear voltage-current characteristics, and a plurality of internal electrodes disposed so as to interpose the varistor layer between them. Each terminal electrode is disposed on a first outer surface parallel to the predetermined direction out of outer surfaces of the multilayer body and is electrically connected to a corresponding internal electrode out of the plurality of internal electrodes. Each of the plurality of internal electrodes includes a first electrode portion overlapping with another first electrode portion between adjacent internal electrodes out of the plurality of internal electrodes, and a second electrode portion led from the first electrode portion so as to be exposed in the first outer surface.
    Type: Grant
    Filed: March 28, 2006
    Date of Patent: January 19, 2010
    Assignee: TDK Corporation
    Inventors: Katsunari Moriai, Dai Matsuoka, Yo Saito
  • Publication number: 20090296312
    Abstract: A chip-type electronic component has: a ceramic element body; a plurality of first and second internal electrodes arranged in the ceramic element body so as to be opposed at least in part to each other; a first external connection conductor to which the plurality of first internal electrodes are connected; a second external connection conductor to which the plurality of second internal electrodes are connected; first and second terminal electrodes; a first internal connection conductor arranged in the ceramic element body and connecting the first external connection conductor and the first terminal electrode; and a second internal connection conductor arranged in the ceramic element body and connecting the second external connection conductor and the second terminal electrode.
    Type: Application
    Filed: May 21, 2009
    Publication date: December 3, 2009
    Applicant: TDK CORPORATION
    Inventors: Kaname Ueda, Dai Matsuoka, Naoki Chida, Izuru Soma, Hisayoshi Saito, Katsunari Moriai