Abstract: There are provided a vapor deposition mask capable of satisfying both high definition and lightweight in upsizing and forming a vapor deposition pattern with high definition while securing strength, a vapor deposition mask preparation body capable of simply producing the vapor deposition mask and a method for producing a vapor deposition mask, and furthermore, a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition. A metal mask 10 in which a slit 15 is provided and a resin mask 20 in which openings 25 corresponding to a pattern to be produced by vapor deposition are provided at a position of overlapping with the slit 15 are stacked, and the metal mask 10 has a general region 10a in which the slit 15 is provided and a thick region 10b larger in thickness than the general region.

Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size is increased, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A vapor deposition mask is produced by the steps of preparing a metal plate with a resin layer in which a resin layer is provided on one surface of a metal plate, forming a metal mask with a resin layer by forming a slit that penetrates through only the metal plate, for the metal plate in the metal plate with a resin layer, and thereafter, forming a resin mask by forming openings corresponding to a pattern to be produced by vapor deposition in a plurality of rows lengthwise and crosswise in the resin layer by emitting a laser from the metal mask side.

Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size is increased, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A vapor deposition mask is produced by the steps of preparing a metal plate with a resin layer in which a resin layer is provided on one surface of a metal plate, forming a metal mask with a resin layer by forming a slit that penetrates through only the metal plate, for the metal plate in the metal plate with a resin layer, and thereafter, forming a resin mask by forming openings corresponding to a pattern to be produced by vapor deposition in a plurality of rows lengthwise and crosswise in the resin layer by emitting a laser from the metal mask side.

Abstract: Provided are: a vapor deposition mask which can be light weight and have high definition even when the size is increased; a method for producing a vapor deposition mask device whereby it is possible to accurately position the aforementioned vapor mask on a frame; and a method for producing an organic semiconductor element whereby it is possible to produce a high-definition organic semiconductor element. A metal mask on which slits are disposed, and a resin mask which is positioned on the surface of the metal mask and on which multiple openings corresponding to the pattern formed by means of vapor deposition are horizontally and vertically arranged in rows are laminated.

Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size is increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.

Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size is increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.

Abstract: A method for producing a multiple-surface imposition vapor deposition mask enhances definition and reduces weight even when a size is increased. Each of multiple masks in an open space in a frame is configured by a metal mask having a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows. In formation of the plurality of masks, after each of the metal masks and a resin film material for producing the resin mask are attached to the frame, the resin film material is processed, and the openings corresponding to the pattern to be produced by vapor deposition are formed in a plurality of rows lengthwise and crosswise, whereby the multiple-surface imposition vapor deposition mask of the above described configuration is produced.

Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size is increased, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A vapor deposition mask is produced by the steps of preparing a metal plate with a resin layer in which a resin layer is provided on one surface of a metal plate, forming a metal mask with a resin layer by forming a slit that penetrates through only the metal plate, for the metal plate in the metal plate with a resin layer, and thereafter, forming a resin mask by forming openings corresponding to a pattern to be produced by vapor deposition in a plurality of rows lengthwise and crosswise in the resin layer by emitting a laser from the metal mask side.

Abstract: A transparent organic EL element comprising: a transparent substrate, a first transparent electrode layer formed on the transparent substrate in stripe form, an insulating partition wall formed in stripe form in a direction orthogonal to the longitudinal direction of the first transparent electrode layer on the transparent substrate with the first transparent electrode layer formed, an organic EL layer including a light emitting layer and formed on the first transparent electrode layer in the light emitting region between the partition walls, a second transparent electrode layer formed on the organic EL layer and divided with the partition wall, and a first auxiliary electrode group formed on the second transparent electrode layer with a plurality of metal fine lines disposed parallel with each other, characterized in that an angle ?1 is 0°<?1<90°.

Abstract: In a method for manufacturing an organic transistor element, an electrode is subjected to wet etching into a predetermined pattern on an organic semiconductor layer. In the process for performing wet etching on the electrode so as to obtain a predetermined pattern, an etching liquid containing a dopant of the organic semiconductor layer is used to perform wet etching on the electrode and, simultaneously, the organic semiconductor layer is doped with the dopant.

Abstract: A transparent organic EL element comprising: a transparent substrate, a first transparent electrode layer formed on the transparent substrate in stripe form, an insulating partition wall formed in stripe form in a direction orthogonal to the longitudinal direction of the first transparent electrode layer on the transparent substrate with the first transparent electrode layer formed, an organic EL layer including a light emitting layer and formed on the first transparent electrode layer in the light emitting region between the partition walls, a second transparent electrode layer formed on the organic EL layer and divided with the partition wall, and a first auxiliary electrode group formed on the second transparent electrode layer with a plurality of metal fine lines disposed parallel with each other, characterized in that an angle ?1 is 0°<?1<90°.

Abstract: The invention is an organic luminescence transistor device including: a substrate; an assistance electrode layer provided on a side of an upper surface of the substrate; an insulation film provided on a side of an upper surface of the assistance electrode layer; a first electrode provided locally on a side of an upper surface of the insulation film, the first electrode covering an area of a predetermined size; an electric-charge-injection inhibiting layer provided on an upper surface of the first electrode, the electric-charge-injection inhibiting layer having a shape larger than that of the first electrode in a plan view; an electric-charge injection layer provided on the side of an upper surface of the insulation film at an area not provided with the first electrode or the electric-charge-injection inhibiting layer and on an upper surface of the electric-charge-injection inhibiting layer; a luminescent layer provided on an upper surface of the electric-charge injection layer; and a second electrode layer pr

Abstract: The invention is an organic luminescence transistor device including: a substrate; an assistance electrode layer provided on a side of an upper surface of the substrate; an insulation film provided on a side of an upper surface of the assistance electrode layer; a first electrode provided locally on a side of an upper surface of the insulation film, the first electrode covering an area of a predetermined size; an electric-charge-injection inhibiting layer provided on an upper surface of the first electrode, the electric-charge-injection inhibiting layer having a shape larger than that of the first electrode in a plan view; an electric-charge injection layer provided on the side of an upper surface of the insulation film at an area not provided with the first electrode or the electric-charge-injection inhibiting layer and on an upper surface of the electric-charge-injection inhibiting layer; a luminescent layer provided on an upper surface of the electric-charge injection layer; and a second electrode layer pr

Abstract: An organic light-emitting element comprises a large number of unit pixels each at least composed of a base, an auxiliary electrode, a first insulating layer to cover at least the auxiliary electrode, a charge injection layer on the first insulating electrode, laminated bodies each consisting of a first electrode and a second insulating layer and provided in a predetermined pattern, an organic light-emitting layer formed in regions where the laminated bodies are not provided, and a second electrode to cover at least the organic light-emitting layer. The unit pixel has first partitions provided to demarcate the organic light-emitting layer from other adjacent unit pixels and at least one or more second partitions to have a uniform coated thickness, and at least one of the first partition and the second partition is the laminated body.

Abstract: An organic light-emitting element comprises a large number of unit pixels each at least composed of a base, an auxiliary electrode, a first insulating layer to cover at least the auxiliary electrode, a charge injection layer on the first insulating electrode, laminated bodies each consisting of a first electrode and a second insulating layer and provided in a predetermined pattern, an organic light-emitting layer formed in regions where the laminated bodies are not provided, and a second electrode to cover at least the organic light-emitting layer. The unit pixel has first partitions provided to demarcate the organic light-emitting layer from other adjacent unit pixels and at least one or more second partitions to have a uniform coated thickness, and at least one of the first partition and the second partition is the laminated body.

Abstract: An organic light-emitting transistor having a source electrode layer; a drain electrode layer facing the source electrode layer; an organic light-emitting layer formed between the source electrode layer and the drain electrode layer; a semiconductor layer formed between the organic light-emitting layer and the source electrode layer; and a gate electrode layer deposited to face through a gate insulation film to one face of the source electrode layer opposite to the other face facing the drain electrode layer. The organic light-emitting transistor further comprises: a charge-carrier suppression layer formed between the organic light-emitting layer and the source electrode layer to have an aperture; and a relay region formed between the charge-carrier suppression layer and the source electrode layer to relay charge-carriers from the source electrode layer to the aperture.

Abstract: The invention is an organic luminescence transistor device including: a substrate; a first electrode layer provided on a side of an upper surface of the substrate; a layered structure provided locally on a side of an upper surface of the first electrode layer, the layered structure covering an area of a predetermined size in a plan view, the layered structure including an insulation layer, an assistance electrode layer and an electric-charge-injection inhibiting layer in this order; an organic EL layer provided on the side of an upper surface of the first electrode layer at least at an area not provided with the layered structure; and a second electrode layer provided on a side of an upper surface of the organic EL layer.

Abstract: Disclosed is an organic light-emitting transistor device comprising a substrate, a first electrode layer formed on the upper side of the substrate, a multilayer structure formed locally on the upper side of the first electrode layer in a predetermined size and sequentially having an insulating layer, an auxiliary electrode layer and a charge injection-suppressing layer in this order, an organic EL layer formed on the upper side of the first electrode layer where at least the multilayer structure is not formed, and a second electrode layer formed on the upper side of the organic EL layer. This organic light-emitting transistor device is characterized in that the charge injection-suppressing layer is formed larger than the auxiliary electrode when viewed in plan.

Abstract: The invention is an organic luminescence transistor device including: a substrate; an assistance electrode layer provided on a side of an upper surface of the substrate; an insulation film provided on a side of an upper surface of the assistance electrode layer; a first electrode provided locally on a side of an upper surface of the insulation film, the first electrode covering an area of a predetermined size; an electric-charge-injection inhibiting layer provided on an upper surface of the first electrode, the electric-charge-injection inhibiting layer having a shape larger than that of the first electrode in a plan view; an electric-charge injection layer provided on the side of an upper surface of the insulation film at an area not provided with the first electrode or the electric-charge-injection inhibiting layer and on an upper surface of the electric-charge-injection inhibiting layer; a luminescent layer provided on an upper surface of the electric-charge injection layer; and a second electrode layer pr

Abstract: An organic light-emitting element comprises a large number of unit pixels each at least composed of a base, an auxiliary electrode, a first insulating layer to cover at least the auxiliary electrode, a charge injection layer on the first insulating electrode, laminated bodies each consisting of a first electrode and a second insulating layer and provided in a predetermined pattern, an organic light-emitting layer formed in regions where the laminated bodies are not provided, and a second electrode to cover at least the organic light-emitting layer. The unit pixel has first partitions provided to demarcate the organic light-emitting layer from other adjacent unit pixels and at least one or more second partitions to have a uniform coated thickness, and at least one of the first partition and the second partition is the laminated body.