Patents by Inventor Katsunobu Awane

Katsunobu Awane has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High-insulation multi-layer device formed on a metal substrate
    Patent number: 4420364
    Abstract: A high-insulation adhesive sheet is formed on a metal substrate. Bottom conductors are formed on the high-insulation adhesive sheet. A high-insulation organic layer is formed on the high-insulation adhesive sheet and the bottom conductors, and top conductors are formed thereon. The high-insulation organic layer is tightly attached to the metal substrate via the high-insulation adhesive sheet. The bottom conductors and the top conductors are communicated to each other via through holes formed in the high-voltage organic layer.
    Type: Grant
    Filed: May 19, 1982
    Date of Patent: December 13, 1983
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Takashi Nukii, Shigeo Nakabu, Masaru Iwasaki, Katsunobu Awane