Abstract: A laminate includes a base substrate, and a coating layer formed on the base substrate. The coating layer includes a copper alloy portions derived from precipitation-hardening copper alloy particles and hard particle portions which are harder than the copper alloy portions, the hard particle portions are derived from hard particles, and the parts bond with each other via an interface. Each of the hard particle portions has a non-spherical shape. A sliding member includes the laminate in at least one sliding portion. A method for manufacturing a laminate includes a step of spraying a mixture in a non-molten state including precipitation-hardening copper alloy particles and hard particles having a non-spherical shape and being harder than the copper alloy particles onto a base substrate, to form a coating layer on the base substrate.

Abstract: To provide adhesive compositions that have a long pot life which, when used in a two-stage process involving partial curing and complete curing, can be cured completely at a temperature lower than that for partial curing. An adhesive composition including: a curable resin that is radically polymerizable; an organic peroxide having a one-minute half-life temperature of less than 100° C.; and a radical polymerization inhibitor, wherein a rate of viscosity increase of the adhesive composition at 25° C. and after 48 hours is 1.5 or less, partial curing of the adhesive composition is possible by heating at 100° C. to 180° C. for 1 to 5 second(s), and complete curing of the adhesive composition is possible by heating at 70° C. to 100° C. after the partial curing.

Abstract: A correction ink of the present invention is used for correcting a micro defect in a color pattern, which includes a coloring agent, polymer, monomer having reactivity functional group and a solvent, wherein an amount of the solvent is from 25% by weight to 70% by weight of the whole ink, and a viscosity is from 40 to 300 mPa·sec.

Abstract: A hook attaching unit in accordance with the invention is constituted by a hook member which is rotatably attached to an end portion of a base plate, a bolt with a flange inserted to a bolt insertion hole of the base plate, and a resin cover member in which a cover body is connected to an annular basement portion. Since the hook member, the cover member and the bolt are integrally assembled, it is not necessary to install the bolt separately in the work field and then install the cover member after attaching the hook, and as such, the workability at the time of fastening is improved. Further, since the cover member invisibly covers the bolt head portion, improved safety and outer appearance is obtained. The hook attaching unit can be also utilized for attaching a seat belt anchor plate.

Abstract: A correction ink of the present invention is used for correcting a micro defect in a color pattern, which includes a coloring agent, polymer, monomer having reactivity functional group and a solvent, wherein an amount of the solvent is from 25% by weight to 70% by weight of the whole ink, and a viscosity is from 40 to 300 mPa·sec.

Abstract: A correction ink of the present invention is used for correcting a micro defect in a color pattern, which comprises a coloring agent, polymer, monomer having reactivity functional group and a solvent, wherein an amount of the solvent is from 25% by weight to 70% by weight of the whole ink, and a viscosity is from 40 to 300 mPa·sec.

Abstract: The present invention provides a method for manufacturing a semiconductor wafer capable of manufacturing a wafer without ring-like sag in an outer peripheral portion thereof when polishing an alkali etched wafer, and a wafer without the ring-like sag in an outer peripheral portion thereof. The present invention comprises: a back surface part polishing and edge polishing step for performing back surface part polishing and edge polishing such that mirror polishing is performed on a chamfered portion and an inner part extending inward from a boundary between the chamfered portion and a back surface of a starting wafer; and a front surface polishing step for mirror polishing a front surface of the wafer subjected to the back surface part polishing and edge polishing step holding the wafer by the back surface thereof.

Abstract: A hook attaching unit in accordance with the invention is constituted by a hook member in which a hook is rotatably attached to an end portion of a base plate, a bolt with flange inserted to a bolt insertion hole of the base plate, and a resin cover member in which a cover body is connected to an annular basement portion. Since the hook member, the cover member and the bolt are integrally assembled, it is not necessary to install the bolt point by point in a work field and install the cover member after attaching the hook, and a workability at a time of fastening is good. Further, since the cover member invisibly covers a bolt head portion, there can be obtained an effect that a safety and an improved outer appearance can be obtained. The hook attaching unit can be also utilized for attaching a seat belt anchor plate.

Abstract: The present invention provides a method for manufacturing a semiconductor wafer capable of manufacturing a wafer without ring-like sag in an outer peripheral portion thereof when polishing an alkali etched wafer, and a wafer without the ring-like sag in an outer peripheral portion thereof. The present invention comprises: a back surface part polishing and edge polishing step for performing back surface part polishing and edge polishing such that mirror polishing is performed on a chamfered portion and an inner part extending inward from a boundary between the chamfered portion and a back surface of a starting wafer; and a front surface polishing step for mirror polishing a front surface of the wafer subjected to the back surface part polishing and edge polishing step holding the wafer by the back surface thereof.

Abstract: A correction ink of the present invention is used for correcting a micro defect in a color pattern, which comprises a coloring agent, polymer, monomer having reactivity functional group and a solvent, wherein an amount of the solvent is from 25% by weight to 70% by weight of the whole ink, and a viscosity is from 40 to 300 mPa.sec.

Abstract: A grinding apparatus according to the present invention grinds a work having a plurality of non-circular work faces to be worked with a grindstone driven by a motor. The work faces are disposed at intervals. Distances between a grindstone unit, bearings and a gear train which are adjacent to each other, are substantially equal to a distance between adjacent work faces of the work. The gear train and the bearings can be respectively positioned between the adjacent work faces of the work in grinding. Therefore, it is possible to prevent interference of the gear train and the bearings with the work faces other than the work face which is being ground by the grinding wheel by a simple structure.

Abstract: A reinforced polypropylene resin composition contains the following components (A), (B) and (C) in amounts of 67 to 82% by weight of, 6 to 12% by weight and 12 to 21% by weight, respectively:Component (A): crystalline ethylene-propylene block copolymer having an ethylene content of 2 to 4% by weight, a molecular distribution of polypropylene component (Q=M.sub.w /M.sub.n) of at least 7, isotacticity of polypropylene component of at least 98%, an intrinsic viscosity (decalin, 135.degree. C.) of room temperature p-xylene soluble content of at least 6 dl/g, a melt flow rate (MFR) of 3 to 15 g/10 minutes, and the product of flexural modulus at room temperature and Izod impact strength at room temperature of at least 120000.

Abstract: A reinforced polypropylene resin composition comprising the following components (a) to (e), the total amount of the components (b) and (c) being 2 to 14%:(a) 45 to 75% by weight of a polypropylene modified with an organosilane compound or an unsaturated acid, or a modified polypropylene containing an unmodified polypropylene;(b) 1 to 10% by weight of a noncrystalline ethylene-.alpha.-olefin copolymer;(c) 1 to 10% by weight of a styrenic hydrogenated block copolymer;(d) 2 to 12% by weight of a glass fiber having a mean fiber diameter of 4 to 15 .mu.m; and(e) 15 to 35% by weight of a hard mica having a tensile strength of 30 kg/mm.sup.2 or more, a mean particle diameter of 50 to 250 .mu.m and an aspect ratio of 15 to 80.